by special treatment of the metal

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CPC
H05K3/382

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/382by special treatment of the metal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal surface treatment liquid and liquid concentrate thereof, meta...
- Patent number 12,091,430
- Issue date Sep 17, 2024
- Shikoku Chemicals Corporation
- Noriaki Yamaji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Base material for printed circuit board and method of manufacturing...
- Patent number 12,016,132
- Issue date Jun 18, 2024
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing adhesion of metal-organic interfaces by silane vapor tre...
- Patent number 11,818,849
- Issue date Nov 14, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board including metal-containing l...
- Patent number 11,770,903
- Issue date Sep 26, 2023
- Korea Institute of Science and Technology
- Ji Young Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive laminated structure, a manufacturing method thereof, and...
- Patent number 11,510,323
- Issue date Nov 22, 2022
- Yungu (Gu'an) Technology Co., Ltd.
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing wiring substrate
- Patent number 11,425,824
- Issue date Aug 23, 2022
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Micro-roughened electrodeposited copper foil and copper clad lamina...
- Patent number 11,186,918
- Issue date Nov 30, 2021
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with adhesion promoting shape of wiring structure
- Patent number 11,044,812
- Issue date Jun 22, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal-clad laminate, and metal-clad laminate
- Patent number 10,807,352
- Issue date Oct 20, 2020
- Kuraray Co., Ltd.
- Takahiro Nakashima
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,791,631
- Issue date Sep 29, 2020
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,721,822
- Issue date Jul 21, 2020
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Metallic nano structure, method of fabricating the same, and electr...
- Patent number 10,624,205
- Issue date Apr 14, 2020
- University-Industry Foundation (UIF), Yonsei University
- Dahl-Young Khang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,595,416
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,390,439
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Brian L. Carlson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface-treated copper foil
- Patent number 10,383,222
- Issue date Aug 13, 2019
- JX Nippon Mining & Metals Corporation
- Atsushi Miki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component carrier with adhesion promoting shape of wiring structure
- Patent number 10,349,521
- Issue date Jul 9, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,314,175
- Issue date Jun 4, 2019
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil
- Patent number 10,070,521
- Issue date Sep 4, 2018
- JX Nippon Mining & Metals Corporation
- Ryo Fukuchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board with conductor post having multiple surface ro...
- Patent number 10,070,523
- Issue date Sep 4, 2018
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,051,746
- Issue date Aug 14, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 9,942,990
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-module substrate and manufacturing method thereof
- Patent number 9,862,045
- Issue date Jan 9, 2018
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 9,516,764
- Issue date Dec 6, 2016
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil and laminate using the same
- Patent number 9,504,149
- Issue date Nov 22, 2016
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of bonding glass substrate and metal substrate
- Patent number 9,253,896
- Issue date Feb 2, 2016
- Hon Hai Precision Industry Co., Ltd.
- Jen-Tsorng Chang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 8,987,603
- Issue date Mar 24, 2015
- Ibiden Co,. Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,822,839
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Yogo Kawasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor apparatus and method of manufacturing them
- Patent number 8,779,602
- Issue date Jul 15, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED module having a heat sink
- Patent number 8,754,437
- Issue date Jun 17, 2014
- OSRAM Gesellschaft mit beschraenkter Haftung
- Alexander Faller
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...
- Publication number 20240357749
- Publication date Oct 24, 2024
- Yield Engineering Systems, Inc.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240237229
- Publication date Jul 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240188216
- Publication date Jun 6, 2024
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240138075
- Publication date Apr 25, 2024
- YMT CO>< LTD.
- Sung Wook CHUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...
- Publication number 20230034784
- Publication date Feb 2, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL SURFACE TREATMENT LIQUID AND LIQUID CONCENTRATE THEREOF, META...
- Publication number 20220306656
- Publication date Sep 29, 2022
- SHIKOKU CHEMICALS CORPORATION
- Noriaki YAMAJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD INCLUDING METAL-CONTAINING L...
- Publication number 20220132676
- Publication date Apr 28, 2022
- Korea Institute of Science and Technology
- Ji Young BYUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING WIRING SUBSTRATE
- Publication number 20210410291
- Publication date Dec 30, 2021
- Toyota Jidosha Kabushiki Kaisha
- Keiji KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...
- Publication number 20210014978
- Publication date Jan 14, 2021
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, METHOD...
- Publication number 20210007227
- Publication date Jan 7, 2021
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINA...
- Publication number 20200141017
- Publication date May 7, 2020
- CO-TECH DEVELOPMENT CORP.
- YUN-HSING SUNG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONDUCTIVE LAMINATED STRUCTURE, A MANUFACTURING METHOD THEREOF, AND...
- Publication number 20200128679
- Publication date Apr 23, 2020
- Yungu (Gu'an) Technology Co., Ltd.
- Yu ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
- Publication number 20190364667
- Publication date Nov 28, 2019
- SHINSHU UNIVERSITY
- Kazuhiko SAKAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Component Carrier With Adhesion Promoting Shape of Wiring Structure
- Publication number 20190274218
- Publication date Sep 5, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20190254172
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20190075658
- Publication date Mar 7, 2019
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC NANO STRUCTURE, METHOD OF FABRICATING THE SAME, AND ELECTR...
- Publication number 20180324947
- Publication date Nov 8, 2018
- UNIVERSITY-INDUSTRY FOUNDATION (UIF), YONSEI UNIVERSITY
- Dahl-Young Khang
- B82 - NANO-TECHNOLOGY
Information Patent Application
SURFACE TREATMENT AGENT FOR COPPER AND COPPER ALLOY SURFACES AND ME...
- Publication number 20180312978
- Publication date Nov 1, 2018
- Atotech Deutschland GmbH
- Tatjana CUKIC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...
- Publication number 20180160546
- Publication date Jun 7, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Adhesion Promoting Shape of Wiring Structure
- Publication number 20180132354
- Publication date May 10, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20180103548
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20170273192
- Publication date Sep 21, 2017
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ROLLER STRUCTURE AND METHOD OF USING THE SAME
- Publication number 20160152073
- Publication date Jun 2, 2016
- DTECH PRECISION INDUSTRIES CO., LTD.
- TING-JUI WANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
COPPER CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150230335
- Publication date Aug 13, 2015
- Samsung Electro-mechanics Co., Ltd.
- Kwang Jik LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF...
- Publication number 20150118391
- Publication date Apr 30, 2015
- Rogers Corporation
- Brett W. Kilhenny
- F21 - LIGHTING
Information Patent Application
PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
- Publication number 20150064346
- Publication date Mar 5, 2015
- Atotech Deutschland GmbH
- Hermann Middeke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface Treated Copper Foil and Laminate Using the Same
- Publication number 20140355229
- Publication date Dec 4, 2014
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE, METHOD FOR PRODUCING SAME, HEAT-RELEASING SUBSTRATE, AND...
- Publication number 20140093723
- Publication date Apr 3, 2014
- Masaki Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...
- Publication number 20140071639
- Publication date Mar 13, 2014
- PANASONIC CORPORATION
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by special treatment of the metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal surface treatment liquid and liquid concentrate thereof, meta...

Base material for printed circuit board and method of manufacturing...

Increasing adhesion of metal-organic interfaces by silane vapor tre...

Method for manufacturing circuit board including metal-containing l...

Conductive laminated structure, a manufacturing method thereof, and...

Method for producing wiring substrate

Micro-roughened electrodeposited copper foil and copper clad lamina...

Component carrier with adhesion promoting shape of wiring structure

High-speed interconnects for printed circuit boards

Method for producing metal-clad laminate, and metal-clad laminate

Surface treated copper foil, copper foil with carrier, laminate, me...

Electric connection structure and electric connection member

Metallic nano structure, method of fabricating the same, and electr...

Insertion loss reduction and increased bonding in a circuit apparatus

Insertion loss reduction and increased bonding in a circuit apparatus

Surface-treated copper foil

Component carrier with adhesion promoting shape of wiring structure

Electric connection structure and electric connection member

Surface-treated copper foil

Printed wiring board with conductor post having multiple surface ro...

High-speed interconnects for printed circuit boards

Insertion loss reduction and increased bonding in a circuit apparatus

Power-module substrate and manufacturing method thereof

Method for manufacturing multilayer wiring substrate

Surface treated copper foil and laminate using the same

Method of bonding glass substrate and metal substrate

Multilayer printed wiring board with filled viahole structure

Multi-layer printed circuit board and method of manufacturing multi...

Wiring board, semiconductor apparatus and method of manufacturing them

LED module having a heat sink

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...

METAL SURFACE TREATMENT LIQUID AND LIQUID CONCENTRATE THEREOF, META...

METHOD FOR MANUFACTURING CIRCUIT BOARD INCLUDING METAL-CONTAINING L...

METHOD FOR PRODUCING WIRING SUBSTRATE

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, METHOD...

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINA...

CONDUCTIVE LAMINATED STRUCTURE, A MANUFACTURING METHOD THEREOF, AND...

METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD

Component Carrier With Adhesion Promoting Shape of Wiring Structure

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

METALLIC NANO STRUCTURE, METHOD OF FABRICATING THE SAME, AND ELECTR...

SURFACE TREATMENT AGENT FOR COPPER AND COPPER ALLOY SURFACES AND ME...

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...

Component Carrier With Adhesion Promoting Shape of Wiring Structure

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

ROLLER STRUCTURE AND METHOD OF USING THE SAME

COPPER CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF...

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

Surface Treated Copper Foil and Laminate Using the Same

SUBSTRATE, METHOD FOR PRODUCING SAME, HEAT-RELEASING SUBSTRATE, AND...

FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...