by the use of a metallic or inorganic thin film adhesion layer

Industry

CPC
H05K3/388

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/388by the use of a metallic or inorganic thin film adhesion layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded body, ceramic copper circuit board, method for manufacturing...
- Patent number 12,160,959
- Issue date Dec 3, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 12,028,989
- Issue date Jul 2, 2024
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 12,022,622
- Issue date Jun 25, 2024
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Articles including metallized vias
- Patent number 12,004,295
- Issue date Jun 4, 2024
- Corning Incorporated
- Shrisudersan Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for laminating graphene-coated printed circuit boards
- Patent number 12,004,308
- Issue date Jun 4, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,985,764
- Issue date May 14, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for producing same
- Patent number 11,903,144
- Issue date Feb 13, 2024
- MATERIAL CONCEPT, INC.
- Junichi Koike
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joined body of joining base material and metal layer
- Patent number 11,889,635
- Issue date Jan 30, 2024
- WORLD METAL CO., LTD
- Hidenori Hayashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive film and conductive film roll, electronic paper, touch p...
- Patent number 11,877,391
- Issue date Jan 16, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeshi Kamijo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,823,966
- Issue date Nov 21, 2023
- Kyocera Corporation
- Kyohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal circuits and methods of making the same
- Patent number 11,805,597
- Issue date Oct 31, 2023
- Carnegie Mellon University
- O Burak Ozdoganlar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board including metal-containing l...
- Patent number 11,770,903
- Issue date Sep 26, 2023
- Korea Institute of Science and Technology
- Ji Young Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,700,686
- Issue date Jul 11, 2023
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor, circuit board incorporating the same, and thin...
- Patent number 11,581,148
- Issue date Feb 14, 2023
- TDK Corporation
- Masahiro Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board with heat dissipation function
- Patent number 11,553,602
- Issue date Jan 10, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yin-Ju Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Conductive laminated structure, a manufacturing method thereof, and...
- Patent number 11,510,323
- Issue date Nov 22, 2022
- Yungu (Gu'an) Technology Co., Ltd.
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 11,490,528
- Issue date Nov 1, 2022
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate
- Patent number 11,426,976
- Issue date Aug 30, 2022
- Sumitomo Metal Mining Co., Ltd.
- Junichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,294,285
- Issue date Apr 5, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,276,610
- Issue date Mar 15, 2022
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Display device having protective cover
- Patent number 11,163,334
- Issue date Nov 2, 2021
- Samsung Display Co., Ltd.
- Gowoon Kang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a polymer printed circuit board
- Patent number 11,102,891
- Issue date Aug 24, 2021
- BGT MATERIALS LIMITED
- Kuo-Hsin Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Carrier Substrate
- Publication number 20240107658
- Publication date Mar 28, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL CIRCUITS AND METHODS OF MAKING THE SAME
- Publication number 20240032189
- Publication date Jan 25, 2024
- Carnegie Mellon University
- O Burak Ozdoganlar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Circuit Board And Semiconductor Device Using Same
- Publication number 20230380060
- Publication date Nov 23, 2023
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE STRUCTURE
- Publication number 20230371187
- Publication date Nov 16, 2023
- AMAZING COOL TECHNOLOGY CORPORATION
- Shiann-Tsong TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILVER COATING FOR HIGH TEMPERATURE APPLICATIONS
- Publication number 20230328899
- Publication date Oct 12, 2023
- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
- Adolphe FOYET
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Support Substrate and Method for Producing a Support Substrate
- Publication number 20230171887
- Publication date Jun 1, 2023
- Rogers Germany GmbH
- Tilo Welker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR A PRINTED WIRING BOARD
- Publication number 20230039742
- Publication date Feb 9, 2023
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...
- Publication number 20230034784
- Publication date Feb 2, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS
- Publication number 20220377912
- Publication date Nov 24, 2022
- MELLANOX TECHNOLOGIES, LTD.
- Boaz ATIAS
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
- Publication number 20220377913
- Publication date Nov 24, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- YIN-JU CHEN
- B82 - NANO-TECHNOLOGY
Information Patent Application
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUC...
- Publication number 20220359340
- Publication date Nov 10, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20220304162
- Publication date Sep 22, 2022
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FO...
- Publication number 20220288726
- Publication date Sep 15, 2022
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Publication number 20220295641
- Publication date Sep 15, 2022
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20220295644
- Publication date Sep 15, 2022
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED BODY OF JOINING BASE MATERIAL AND METAL LAYER
- Publication number 20220279661
- Publication date Sep 1, 2022
- WORLD METAL CO., LTD.
- Hidenori HAYASHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220248535
- Publication date Aug 4, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD INCLUDING METAL-CONTAINING L...
- Publication number 20220132676
- Publication date Apr 28, 2022
- Korea Institute of Science and Technology
- Ji Young BYUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20220071024
- Publication date Mar 3, 2022
- Material Concept, Inc.
- Junichi KOIKE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220037220
- Publication date Feb 3, 2022
- KYOCERA CORPORATION
- Kyohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY
- Publication number 20220022326
- Publication date Jan 20, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20220007506
- Publication date Jan 6, 2022
- Toyota Jidosha Kabushiki Kaisha
- Keiji KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
- Publication number 20210407896
- Publication date Dec 30, 2021
- Corning Incorporated
- Mandakini Kanungo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM AND CONDUCTIVE FILM ROLL, ELECTRONIC PAPER, TOUCH P...
- Publication number 20210321512
- Publication date Oct 14, 2021
- Asahi Kasei Kabushiki Kaisha
- Takeshi KAMIJO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...
- Publication number 20210257164
- Publication date Aug 19, 2021
- TDK Corporation
- Masahiro HIRAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Feedthrough Comprising Interconnect Pads
- Publication number 20210176862
- Publication date Jun 10, 2021
- Morgan Advanced Ceramics, Inc.
- Abhishek S. Patnaik
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN, AND DISC...
- Publication number 20210168942
- Publication date Jun 3, 2021
- Sakai Display Products Corporation
- KIBO WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLES INCLUDING METALLIZED VIAS
- Publication number 20210092843
- Publication date Mar 25, 2021
- Corning Incorporated
- Shrisudersan Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20210084774
- Publication date Mar 18, 2021
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...
- Publication number 20210068251
- Publication date Mar 4, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by the use of a metallic or inorganic thin film adhesion layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded body, ceramic copper circuit board, method for manufacturing...

Hermetic metallized via with improved reliability

Substrate for a printed wiring board

Multilayer body

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Method for manufacturing wiring board, and wiring board

Ceramic electronic component

Articles including metallized vias

Process for laminating graphene-coated printed circuit boards

Circuit board and method for manufacturing the same

Electronic component and method for producing same

Joined body of joining base material and metal layer

Conductive film and conductive film roll, electronic paper, touch p...

Wiring substrate, electronic device, and electronic module

Liquid metal circuits and methods of making the same

Method for manufacturing circuit board including metal-containing l...

Method for manufacturing wiring board

Flexible circuit electrode array and method of manufacturing the same

Thin film capacitor, circuit board incorporating the same, and thin...

Method for manufacturing circuit board with heat dissipation function

Conductive laminated structure, a manufacturing method thereof, and...

Method for manufacturing wiring board, and wiring board

Copper-clad laminate

Method for manufacturing circuit board

Wiring board and method of manufacturing the same

Hermetic metallized via with improved reliability

Display device having protective cover

Hermetic metallized via with improved reliability

Method of manufacturing a polymer printed circuit board

High-speed interconnects for printed circuit boards

Patents Applicationslast 30 patents

Carrier Substrate

LIQUID METAL CIRCUITS AND METHODS OF MAKING THE SAME

Ceramic Circuit Board And Semiconductor Device Using Same

PACKAGE SUBSTRATE STRUCTURE

SILVER COATING FOR HIGH TEMPERATURE APPLICATIONS

Support Substrate and Method for Producing a Support Substrate

SUBSTRATE FOR A PRINTED WIRING BOARD

COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...

PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS

METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION

COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUC...

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FO...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

JOINED BODY OF JOINING BASE MATERIAL AND METAL LAYER

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING CIRCUIT BOARD INCLUDING METAL-CONTAINING L...

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

MULTILAYER BODY

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY

CONDUCTIVE FILM AND CONDUCTIVE FILM ROLL, ELECTRONIC PAPER, TOUCH P...

THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...

Feedthrough Comprising Interconnect Pads

CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN, AND DISC...

ARTICLES INCLUDING METALLIZED VIAS

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...