by thermic methods

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CPC
B28D1/221

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BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D1/00Working stone or stone-like materials

Current Industry

B28D1/221by thermic methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nonplanar wafer and method for producing a nonplanar wafer
- Patent number 11,786,995
- Issue date Oct 17, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including crushed layer and wafer processin...
- Patent number 11,721,584
- Issue date Aug 8, 2023
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for creation of a predetermined structure from a...
- Patent number 11,559,858
- Issue date Jan 24, 2023
- DIAMTECH LTD.
- Dotan Duek
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of treating a solid layer bonded to a carrier substrate
- Patent number 11,518,066
- Issue date Dec 6, 2022
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon wafer forming method
- Patent number 11,511,374
- Issue date Nov 29, 2022
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pulsed laser method for machining a diamond
- Patent number 11,446,759
- Issue date Sep 20, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Eglantine Ruaudel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating thin layers of solid material from a solid body
- Patent number 11,201,081
- Issue date Dec 14, 2021
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of separating a glass web
- Patent number 11,008,244
- Issue date May 18, 2021
- Corning Incorporated
- Anatoli Anatolyevich Abramov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in the edge region of a donor substrate,...
- Patent number 10,994,442
- Issue date May 4, 2021
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing a plate-like workpiece having a transparent, glass, glas...
- Patent number 10,941,069
- Issue date Mar 9, 2021
- Trumpf Laser- und Systemtechnik GmbH
- Malte Kumkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the material-saving production of wafers and processing...
- Patent number 10,843,380
- Issue date Nov 24, 2020
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method of producing a structured element, and structured...
- Patent number 10,702,947
- Issue date Jul 7, 2020
- 3D-Micromac AG
- Michael Werner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,676,386
- Issue date Jun 9, 2020
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser working method, laser working apparatus, and its manufacturin...
- Patent number 10,622,254
- Issue date Apr 14, 2020
- Hamamatsu Photonics K.K.
- Makoto Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting brittle material, device for cutting brittle mate...
- Patent number 10,576,651
- Issue date Mar 3, 2020
- Central Glass Co., Ltd.
- Hiroyuki Tamon
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Wafer producing method
- Patent number 10,563,321
- Issue date Feb 18, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water producing method
- Patent number 10,297,438
- Issue date May 21, 2019
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,280,107
- Issue date May 7, 2019
- Siltectra, GmbH
- Marko Swoboda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laminate, method for cutting laminate, method for processing lamina...
- Patent number 10,279,568
- Issue date May 7, 2019
- Nippon Electric Glass Co., Ltd.
- Yoshiharu Miwa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of fabricating plates of super-hard material using a collima...
- Patent number 10,240,254
- Issue date Mar 26, 2019
- Element Six Technologies Limited
- Andrew Michael Bennett
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Combined production method for separating a number of thin layers o...
- Patent number 10,141,219
- Issue date Nov 27, 2018
- Siltectra GmbH
- Wolfram Drescher
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Glass plate separating apparatus
- Patent number 10,131,564
- Issue date Nov 20, 2018
- Kawasaki Jukogyo Kabushiki Kaisha
- Mutsuhiro Nakazawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer producing method
- Patent number 10,094,047
- Issue date Oct 9, 2018
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Combined method for producing solids, involving laser treatment and...
- Patent number 10,079,171
- Issue date Sep 18, 2018
- Siltectra, GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for processing edge of glass by using high fre...
- Patent number 9,957,188
- Issue date May 1, 2018
- LAMINEX CO., LTD
- Kyung Tae Kwon
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Tempered glass cutting method and cutting apparatus
- Patent number 9,896,371
- Issue date Feb 20, 2018
- CORNING PRECISION MATERIALS CO., LTD.
- Jaemin Cha
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cleaving method for a glass film
- Patent number 9,840,028
- Issue date Dec 12, 2017
- Nippon Electric Glass Co., Ltd.
- Yasuhiro Matsumoto
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laminate, method for cutting laminate, method for processing lamina...
- Patent number 9,446,566
- Issue date Sep 20, 2016
- Nippon Electric Glass Co., Ltd.
- Yoshiharu Miwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser working method, laser working apparatus, and its manufacturin...
- Patent number 9,428,413
- Issue date Aug 30, 2016
- Hamamatsu Photonics K.K.
- Makoto Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR COATING FILM ABLATION AND GLASS CUTTING, WHICH USE LASER...
- Publication number 20240317629
- Publication date Sep 26, 2024
- DOWOOINSYS Co., Ltd.
- Seung Jun YI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF FABRICATING GLASS PANEL
- Publication number 20240182349
- Publication date Jun 6, 2024
- CORNING INCORPORATED
- Euisoo Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
HEAT CHAMFERING APPARATUS AND METHOD
- Publication number 20240182348
- Publication date Jun 6, 2024
- Corning Incorporated
- Euisoo Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR CUTTING CONCRETE MEMBER
- Publication number 20240058990
- Publication date Feb 22, 2024
- Japan Agency for Marine-Earth Science and Technology
- Yousuke KAWAHITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD
- Publication number 20230321871
- Publication date Oct 12, 2023
- Disco Corporation
- Kazuya HIRATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CUTTING METHOD AND EQUIPMENT
- Publication number 20230173614
- Publication date Jun 8, 2023
- ITI CO., LTD.
- Jung Joon LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
- Publication number 20210233814
- Publication date Jul 29, 2021
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF SEPARATING A GLASS WEB
- Publication number 20210230043
- Publication date Jul 29, 2021
- Corning Incorporated
- Anatoli Anatolyevich Abramov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE
- Publication number 20210213643
- Publication date Jul 15, 2021
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Treating a Solid Layer Bonded to a Carrier Substrate
- Publication number 20210039279
- Publication date Feb 11, 2021
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CREATION OF A PREDETERMINED STRUCTURE FROM A...
- Publication number 20200171607
- Publication date Jun 4, 2020
- DIAMSENSE LTD.
- Dotan DUEK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PULSED LASER METHOD FOR MACHINING A DIAMOND
- Publication number 20200122268
- Publication date Apr 23, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Eglantine RUAUDEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A Method of Machining Brittle Materials
- Publication number 20200039109
- Publication date Feb 6, 2020
- UNIVERSITY OF NEWCASTLE UPON TYNE
- Zi Jie Choong
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for Separating Thin Layers of Solid Material from a Solid Body
- Publication number 20200006119
- Publication date Jan 2, 2020
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20190218131
- Publication date Jul 18, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRODUCTION MEHTOD FOR SEPARATING A NUMBER OF THIN LAYERS O...
- Publication number 20190096746
- Publication date Mar 28, 2019
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON WAFER FORMING METHOD
- Publication number 20190039187
- Publication date Feb 7, 2019
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A CRACK IN THE EDGE REGION OF A DONOR SUBSTRATE,...
- Publication number 20180370073
- Publication date Dec 27, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF SEPARATING A GLASS WEB
- Publication number 20180346369
- Publication date Dec 6, 2018
- Corning Incorporated
- Anatoli Anatolyevich Abramov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE MATERIAL-SAVING PRODUCTION OF WAFERS AND PROCESSING...
- Publication number 20180243944
- Publication date Aug 30, 2018
- SILTECTRA GMBH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20180237947
- Publication date Aug 23, 2018
- Disco Corporation
- Kazuya Hirata
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20180185957
- Publication date Jul 5, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR LASER PROCESSING OF DIAMONDS
- Publication number 20180117705
- Publication date May 3, 2018
- Menachem Margaliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Cutting Brittle Material, Device for Cutting Brittle Mate...
- Publication number 20170361486
- Publication date Dec 21, 2017
- Central Glass Co., Ltd.
- Hiroyuki TAMON
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
COMBINED METHOD FOR PRODUCING SOLIDS, INVOLVING LASER TREATMENT AND...
- Publication number 20170250109
- Publication date Aug 31, 2017
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING GLASS SUBSTRATE, AND GLASS SUBSTRATE
- Publication number 20140363626
- Publication date Dec 11, 2014
- Shintaro TAKAHASHI
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
DEVICE FOR CUTTING SAPPHIRE SUBSTRATE
- Publication number 20140209579
- Publication date Jul 31, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- GA-LANE CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING METHOD FOR REINFORCED GLASS PLATE AND REINFORCED GLASS PLAT...
- Publication number 20140174131
- Publication date Jun 26, 2014
- Asahi Glass Company, Limited
- Isao SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-STEP CUTTING PROCESS
- Publication number 20140076299
- Publication date Mar 20, 2014
- Apple Inc.
- Anthony J. Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20140080288
- Publication date Mar 20, 2014
- HAMAMATSU PHOTONICS K. K.
- Fumitsugu FUKUYO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by thermic methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming a crack in an edge region of a donor substrate

Nonplanar wafer and method for producing a nonplanar wafer

Wafer processing method including crushed layer and wafer processin...

System and method for creation of a predetermined structure from a...

Method of treating a solid layer bonded to a carrier substrate

Silicon wafer forming method

Pulsed laser method for machining a diamond

Method for separating thin layers of solid material from a solid body

Methods of separating a glass web

Method for forming a crack in the edge region of a donor substrate,...

Processing a plate-like workpiece having a transparent, glass, glas...

Method for the material-saving production of wafers and processing...

Device and method of producing a structured element, and structured...

Method for guiding a crack in the peripheral region of a donor subs...

Laser working method, laser working apparatus, and its manufacturin...

Method of cutting brittle material, device for cutting brittle mate...

Wafer producing method

Water producing method

Method for guiding a crack in the peripheral region of a donor subs...

Laminate, method for cutting laminate, method for processing lamina...

Method of fabricating plates of super-hard material using a collima...

Combined production method for separating a number of thin layers o...

Glass plate separating apparatus

Wafer producing method

Combined method for producing solids, involving laser treatment and...

Method and apparatus for processing edge of glass by using high fre...

Tempered glass cutting method and cutting apparatus

Cleaving method for a glass film

Laminate, method for cutting laminate, method for processing lamina...

Laser working method, laser working apparatus, and its manufacturin...

Patents Applicationslast 30 patents

METHOD FOR COATING FILM ABLATION AND GLASS CUTTING, WHICH USE LASER...

METHOD OF FABRICATING GLASS PANEL

HEAT CHAMFERING APPARATUS AND METHOD

METHOD FOR CUTTING CONCRETE MEMBER

WAFER MANUFACTURING METHOD

CERAMIC CUTTING METHOD AND EQUIPMENT

WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS

METHODS OF SEPARATING A GLASS WEB

METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE

Method of Treating a Solid Layer Bonded to a Carrier Substrate

SYSTEM AND METHOD FOR CREATION OF A PREDETERMINED STRUCTURE FROM A...

PULSED LASER METHOD FOR MACHINING A DIAMOND

A Method of Machining Brittle Materials

Method for Separating Thin Layers of Solid Material from a Solid Body

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

COMBINED PRODUCTION MEHTOD FOR SEPARATING A NUMBER OF THIN LAYERS O...

SILICON WAFER FORMING METHOD

METHOD FOR FORMING A CRACK IN THE EDGE REGION OF A DONOR SUBSTRATE,...

METHODS OF SEPARATING A GLASS WEB

METHOD FOR THE MATERIAL-SAVING PRODUCTION OF WAFERS AND PROCESSING...

WAFER PRODUCING METHOD

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

DEVICE AND METHOD FOR LASER PROCESSING OF DIAMONDS

Method of Cutting Brittle Material, Device for Cutting Brittle Mate...

COMBINED METHOD FOR PRODUCING SOLIDS, INVOLVING LASER TREATMENT AND...

METHOD OF MANUFACTURING GLASS SUBSTRATE, AND GLASS SUBSTRATE

DEVICE FOR CUTTING SAPPHIRE SUBSTRATE

CUTTING METHOD FOR REINFORCED GLASS PLATE AND REINFORCED GLASS PLAT...

MULTI-STEP CUTTING PROCESS

LASER PROCESSING METHOD