by thick-film techniques

Industry

CPC
H05K3/4053

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4053by thick-film techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,910,520
- Issue date Feb 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal drop ejecting three-dimensional (3D) object printer
- Patent number 11,737,216
- Issue date Aug 22, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 11,638,351
- Issue date Apr 25, 2023
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a conductive track on a board via stencil p...
- Patent number 11,622,452
- Issue date Apr 4, 2023
- Robert Bosch GmbH
- Bo Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for producing an electrical connecting contact on...
- Patent number 11,558,965
- Issue date Jan 17, 2023
- voestalpine STAHL GmbH
- Peter Atzmüller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,503,700
- Issue date Nov 15, 2022
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,294,285
- Issue date Apr 5, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layered circuit board
- Patent number 11,297,722
- Issue date Apr 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacture method thereof
- Patent number 11,289,413
- Issue date Mar 29, 2022
- Unimicron Technology Corp.
- Shih-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,160,174
- Issue date Oct 26, 2021
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 11,022,854
- Issue date Jun 1, 2021
- E Ink Corporation
- Matthew Joseph Kayal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed litz line
- Patent number 10,966,312
- Issue date Mar 30, 2021
- Sciperio, Inc.
- Thomas Weller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered circuit board and method for manufacturing the same
- Patent number 10,881,008
- Issue date Dec 29, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of circuit board
- Patent number 10,820,423
- Issue date Oct 27, 2020
- Gold Circuit Electronics Ltd.
- Chih-Hai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a flexible wearable circuit
- Patent number 10,798,817
- Issue date Oct 6, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing flexible array substrate
- Patent number 10,743,424
- Issue date Aug 11, 2020
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Lixuan Chen
- G02 - OPTICS
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,653,011
- Issue date May 12, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 10,616,994
- Issue date Apr 7, 2020
- Kuprion, Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,481,709
- Issue date Nov 19, 2019
- Jui-Jen Yueh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,470,316
- Issue date Nov 5, 2019
- Winbond Electronics Corp.
- Yu-Ming Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electro-optic display with measurement aperture
- Patent number 10,466,564
- Issue date Nov 5, 2019
- E Ink Corporation
- Matthew Joseph Kayal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conductor track with enlargement-free transition between conductor...
- Patent number 10,356,904
- Issue date Jul 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellshaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 10,340,682
- Issue date Jul 2, 2019
- MURATA MANUFACTURING CO., LTD.
- Hiroki Sakamoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electro-optic display backplane structure with drive components and...
- Patent number 10,317,767
- Issue date Jun 11, 2019
- E Ink Corporation
- Richard J. Paolini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device, touch panel and method of manufacturing display device
- Patent number 10,310,692
- Issue date Jun 4, 2019
- Japan Display Inc.
- Yoichi Kamijo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer additive printed circuit
- Patent number 10,182,499
- Issue date Jan 15, 2019
- The University of Memphis Research Foundation
- Bashir I. Morshed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20240206048
- Publication date Jun 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUSTOMIZED THERMAL PATHWAYS IN A PCB
- Publication number 20240008190
- Publication date Jan 4, 2024
- DSBJ PTE. LTD.
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...
- Publication number 20230309241
- Publication date Sep 28, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20230232532
- Publication date Jul 20, 2023
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A CONDUCTIVE TRACK ON A BOARD VIA STENCIL P...
- Publication number 20230062635
- Publication date Mar 2, 2023
- ROBERT BOSCH GmbH
- Bo CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...
- Publication number 20220240387
- Publication date Jul 28, 2022
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20220007519
- Publication date Jan 6, 2022
- MURATA MANUFACTURING CO., LTD.
- Toshikazu HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management In Circuit Board Assemblies
- Publication number 20210227680
- Publication date Jul 22, 2021
- Kuprion, Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20210195741
- Publication date Jun 24, 2021
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED CIRCUIT BOARD
- Publication number 20210136926
- Publication date May 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- ZHI GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE COMPOSITION, CONDUCTIVE FILM, AND CIRCUIT BOARD USING TH...
- Publication number 20210092840
- Publication date Mar 25, 2021
- ZHEN DING TECHNOLOGY CO., LTD.
- SHENG-FENG CHUNG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20200236783
- Publication date Jul 23, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR PRODUCING AN ELECTRICAL CONNECTING CONTACT ON...
- Publication number 20200229310
- Publication date Jul 16, 2020
- VOESTALPINE STAHL GMBH
- Peter ATZMÜLLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management In Circuit Board Assemblies
- Publication number 20200214121
- Publication date Jul 2, 2020
- Kuprion, Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANU...
- Publication number 20200100360
- Publication date Mar 26, 2020
- Nichia Corporation.
- Masaaki KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Top Plane Connection in an Electro-Optic Device
- Publication number 20200064705
- Publication date Feb 27, 2020
- E INK CORPORATION
- Matthew Joseph KAYAL
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Conductor Track With Enlargement-Free Transition Between Conductor...
- Publication number 20190306983
- Publication date Oct 3, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20190261517
- Publication date Aug 22, 2019
- Denso Corporation
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management In Circuit Board Assemblies
- Publication number 20190246491
- Publication date Aug 8, 2019
- Kuprion, Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20190116676
- Publication date Apr 18, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FABRICATION METHOD OF CIRCUIT BOARD
- Publication number 20180376601
- Publication date Dec 27, 2018
- Gold Circuit Electronics Ltd.
- Chih-Hai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...
- Publication number 20180376585
- Publication date Dec 27, 2018
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE ARRAY SUBSTRATE
- Publication number 20180343750
- Publication date Nov 29, 2018
- Shenzhen China Star Optoelectronics Technology Co. LTD.
- Lixuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE, TOUCH PANEL AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20180284923
- Publication date Oct 4, 2018
- Japan Display Inc.
- Yoichi KAMIJO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20180139854
- Publication date May 17, 2018
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180120968
- Publication date May 3, 2018
- Jui-Jen Yueh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE CABLE AND STRETCHABLE CIRCUIT BOARD
- Publication number 20180070446
- Publication date Mar 8, 2018
- Tatsuta Electric Wire & Cable Co., Ltd.
- Akio TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180041026
- Publication date Feb 8, 2018
- Murata Manufacturing Co., Ltd.
- HIROKI SAKAMOTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

by thick-film techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a top plane connection in an electro-optic device

Component-embedded substrate

Method for manufacturing transparent circuit board

Thermal management in circuit board assemblies

Method of manufacturing multilayer substrate

Metal drop ejecting three-dimensional (3D) object printer

Component-embedded substrate

Method of manufacturing a conductive track on a board via stencil p...

Device and method for producing an electrical connecting contact on...

Thermal management in circuit board assemblies

Method for manufacturing circuit board

Multi-layered circuit board

Wiring board and manufacture method thereof

Method of manufacturing multilayer substrate

Method of forming a top plane connection in an electro-optic device

Printed litz line

Multi-layered circuit board and method for manufacturing the same

Fabrication method of circuit board

Method for making a flexible wearable circuit

Method for manufacturing flexible array substrate

Method for manufacturing circuit board

Thermal management in circuit board assemblies

Electronic device

Manufacturing method of circuit board

Electro-optic display with measurement aperture

Conductor track with enlargement-free transition between conductor...

Electronic device and method of manufacturing the same

Electro-optic display backplane structure with drive components and...

Display device, touch panel and method of manufacturing display device

Multilayer additive printed circuit

Patents Applicationslast 30 patents

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

Thermal Management in Circuit Board Assemblies

TRANSPARENT CIRCUIT BOARD

CUSTOMIZED THERMAL PATHWAYS IN A PCB

METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...

COMPONENT-EMBEDDED SUBSTRATE

METHOD OF MANUFACTURING A CONDUCTIVE TRACK ON A BOARD VIA STENCIL P...

METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...

METHOD OF MANUFACTURING MULTILAYER SUBSTRATE

Thermal Management In Circuit Board Assemblies

COMPONENT-EMBEDDED SUBSTRATE

MULTI-LAYERED CIRCUIT BOARD

CONDUCTIVE COMPOSITION, CONDUCTIVE FILM, AND CIRCUIT BOARD USING TH...

METHOD FOR MANUFACTURING CIRCUIT BOARD

DEVICE AND METHOD FOR PRODUCING AN ELECTRICAL CONNECTING CONTACT ON...

Thermal Management In Circuit Board Assemblies

CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANU...

Method of Forming a Top Plane Connection in an Electro-Optic Device

Conductor Track With Enlargement-Free Transition Between Conductor...

METHOD OF MANUFACTURING MULTILAYER SUBSTRATE

Thermal Management In Circuit Board Assemblies

METHOD FOR MANUFACTURING CIRCUIT BOARD

FABRICATION METHOD OF CIRCUIT BOARD

MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...

METHOD FOR MANUFACTURING FLEXIBLE ARRAY SUBSTRATE

DISPLAY DEVICE, TOUCH PANEL AND METHOD OF MANUFACTURING DISPLAY DEVICE

MANUFACTURING METHOD OF CIRCUIT BOARD

ELECTRONIC DEVICE

STRETCHABLE CABLE AND STRETCHABLE CIRCUIT BOARD

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME