by thin-film techniques

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H05K3/4076

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/4076by thin-film techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Double-sided circuit non-oxide-based ceramic substrate and method f...
- Patent number 12,028,984
- Issue date Jul 2, 2024
- Hitachi Power Solutions Co., Ltd.
- Hideaki Takemori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly structure for vehicle camera module using solder-jet
- Patent number 12,025,848
- Issue date Jul 2, 2024
- Hyundai Mobis Co., Ltd.
- SangHwan Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board assemblies with engin...
- Patent number 11,711,885
- Issue date Jul 25, 2023
- TTM Technologies, Inc.
- Rick Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film board, circuit element, manufacturing method of circuit e...
- Patent number 11,503,714
- Issue date Nov 15, 2022
- Anritsu Corporation
- Kota Kuramitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,350,520
- Issue date May 31, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Günther Mayr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method and apparatus for electroplating a metal onto a substrate
- Patent number 11,015,257
- Issue date May 25, 2021
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flexible and self-healing elastomer-based modular electronics and a...
- Patent number 10,869,392
- Issue date Dec 15, 2020
- The Board of Trustees of the Leland Stanford Junior University
- Zhenan Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,856,376
- Issue date Dec 1, 2020
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,813,182
- Issue date Oct 20, 2020
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,811,210
- Issue date Oct 20, 2020
- Sanmina Corporation
- Shinichi Iketani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 10,765,011
- Issue date Sep 1, 2020
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,721,822
- Issue date Jul 21, 2020
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 10,653,012
- Issue date May 12, 2020
- Gio Optoelectronics Corp.
- Chin-Tang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite circuit board
- Patent number 10,638,606
- Issue date Apr 28, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 10,609,823
- Issue date Mar 31, 2020
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for electroplating a metal onto a substrate
- Patent number 10,501,860
- Issue date Dec 10, 2019
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer wiring board
- Patent number 10,477,702
- Issue date Nov 12, 2019
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,470,316
- Issue date Nov 5, 2019
- Winbond Electronics Corp.
- Yu-Ming Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,446,356
- Issue date Oct 15, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,314,175
- Issue date Jun 4, 2019
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,285,268
- Issue date May 7, 2019
- LG Innotek Co., Ltd
- Gi Gon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuses with integrated metals
- Patent number 10,276,337
- Issue date Apr 30, 2019
- Littelfuse, Inc.
- Michael Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate including via interconnect whose side surface incl...
- Patent number 10,187,986
- Issue date Jan 22, 2019
- Shinko Electric Industries Co., Ltd.
- Satoshi Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and methods to enhance reliability
- Patent number 10,172,243
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,165,640
- Issue date Dec 25, 2018
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240015884
- Publication date Jan 11, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method f...
- Publication number 20220248537
- Publication date Aug 4, 2022
- Hitachi Power Solutions Co., Ltd.
- Hideaki TAKEMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BOARD, CIRCUIT ELEMENT, MANUFACTURING METHOD OF CIRCUIT E...
- Publication number 20210368624
- Publication date Nov 25, 2021
- Anritsu Corporation
- Kota KURAMITSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY STRUCTURE FOR VEHICLE CAMERA MODULE USING SOLDER-JET
- Publication number 20210318507
- Publication date Oct 14, 2021
- HYUNDAI MOBIS CO., LTD.
- SangHwan OH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210045233
- Publication date Feb 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Günther Mayr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING A METAL ONTO A SUBSTRATE
- Publication number 20200080217
- Publication date Mar 12, 2020
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
- Publication number 20200043690
- Publication date Feb 6, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method f...
- Publication number 20200029441
- Publication date Jan 23, 2020
- Hitachi Power Solutions Co., Ltd.
- Hideaki TAKEMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20190394886
- Publication date Dec 26, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER
- Publication number 20190166669
- Publication date May 30, 2019
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190124764
- Publication date Apr 25, 2019
- GIO Optoelectronics Corp.
- Chin-Tang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE AND SELF-HEALING ELASTOMER-BASED MODULAR ELECTRONICS AND A...
- Publication number 20190110363
- Publication date Apr 11, 2019
- The Board of Trustees of the Leland Stanford Junior University
- Zhenan Bao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20190075658
- Publication date Mar 7, 2019
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITE CIRCUIT BOARD
- Publication number 20190069406
- Publication date Feb 28, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20180359874
- Publication date Dec 13, 2018
- DYCONEX AG
- Marc Hauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20180279472
- Publication date Sep 27, 2018
- Shinko Electric Industries Co., Ltd.
- Satoshi SUNOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180192516
- Publication date Jul 5, 2018
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHODS TO ENHANCE RELIABILITY
- Publication number 20180139852
- Publication date May 17, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
- Publication number 20180110133
- Publication date Apr 19, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20180084651
- Publication date Mar 22, 2018
- Hitachi Chemical Company, Ltd.
- Nobuyuki YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING A METAL ONTO A SUBSTRATE
- Publication number 20180010258
- Publication date Jan 11, 2018
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD WITH VIA CAPACITOR STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20170367183
- Publication date Dec 21, 2017
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Wen Tsung LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20170273192
- Publication date Sep 21, 2017
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20170223842
- Publication date Aug 3, 2017
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER CURABLE RESIN FILM, PREPREG, LAMINATE, CURED PRODUCT, CO...
- Publication number 20170223843
- Publication date Aug 3, 2017
- Zeon Corporation
- Osamu Kawakami
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FABRICATING CAVITY PRINTED CIRCUIT BOARD
- Publication number 20170111999
- Publication date Apr 20, 2017
- DAEDUCK ELECTRONICS CO., LTD.
- Jun-Tae AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRAPHENE WIRING STRUCTURE AND METHOD FOR MANUFACTURING GRAPHENE WIR...
- Publication number 20170079138
- Publication date Mar 16, 2017
- KABUSHIKI KAISHA TOSHIBA
- Tadashi SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by thin-film techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin multilayer substrate and method for manufacturing resin multi...

Double-sided circuit non-oxide-based ceramic substrate and method f...

Assembly structure for vehicle camera module using solder-jet

Method for manufacturing transparent circuit board

Method of manufacturing printed circuit board assemblies with engin...

Method of fabricating a glass substrate with a plurality of vias

Thin film board, circuit element, manufacturing method of circuit e...

Component carrier and method of manufacturing the same

Filling materials and methods of filling through holes of a substrate

Method and apparatus for electroplating a metal onto a substrate

Electronic module and method for producing same

Flexible and self-healing elastomer-based modular electronics and a...

Printed circuit board for integrated LED driver

Printed circuit board for integrated LED driver

Multilayer printed circuit board via hole registration and accuracy

Multilayer wiring board

Electric connection structure and electric connection member

Electronic device and manufacturing method thereof

Composite circuit board

Method for manufacturing multilayer wiring board

Method and apparatus for electroplating a metal onto a substrate

Multilayer wiring board

Manufacturing method of circuit board

Multilayer printed circuit board via hole registration and accuracy

Electric connection structure and electric connection member

Printed circuit board and method of manufacturing the same

Fuses with integrated metals

Wiring substrate including via interconnect whose side surface incl...

Printed circuit board and methods to enhance reliability

Printed circuit board for integrated LED driver

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

TRANSPARENT CIRCUIT BOARD

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method f...

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

THIN FILM BOARD, CIRCUIT ELEMENT, MANUFACTURING METHOD OF CIRCUIT E...

ASSEMBLY STRUCTURE FOR VEHICLE CAMERA MODULE USING SOLDER-JET

Component Carrier and Method of Manufacturing the Same

METHOD AND APPARATUS FOR ELECTROPLATING A METAL ONTO A SUBSTRATE

MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY

Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method f...

MULTILAYER WIRING BOARD

PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

FLEXIBLE AND SELF-HEALING ELASTOMER-BASED MODULAR ELECTRONICS AND A...

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

COMPOSITE CIRCUIT BOARD

ELECTRONIC MODULE AND METHOD FOR PRODUCING SAME

WIRING SUBSTRATE

COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHODS TO ENHANCE RELIABILITY

MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

METHOD AND APPARATUS FOR ELECTROPLATING A METAL ONTO A SUBSTRATE

CIRCUIT BOARD WITH VIA CAPACITOR STRUCTURE AND MANUFACTURING METHOD...

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

MULTILAYER CURABLE RESIN FILM, PREPREG, LAMINATE, CURED PRODUCT, CO...

METHOD OF FABRICATING CAVITY PRINTED CIRCUIT BOARD

GRAPHENE WIRING STRUCTURE AND METHOD FOR MANUFACTURING GRAPHENE WIR...