by transfer of thin metal foil formed on a temporary carrier

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CPC
H05K3/025

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/025by transfer of thin metal foil formed on a temporary carrier

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board producing apparatus
- Patent number 12,075,569
- Issue date Aug 27, 2024
- FUJIFILM Business Innovation Corp.
- Yasuo Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-resolution graphene-based flexible electronics...
- Patent number 11,938,708
- Issue date Mar 26, 2024
- lowa State University Research Foundation, Inc.
- Metin Uz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing FCCL capable of controlling flexibility an...
- Patent number 11,665,828
- Issue date May 30, 2023
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite copper foil and method of fabricating the same
- Patent number 11,639,557
- Issue date May 2, 2023
- Circuit Foil Luxembourg
- Zainhia Kaidi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composite metal foil and preparation method thereof
- Patent number 11,582,869
- Issue date Feb 14, 2023
- GUANGZHOU FANGBANG ELECTRONIC CO., LTD.
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board or wiring board material
- Patent number 11,490,522
- Issue date Nov 1, 2022
- Daiwa Co., Ltd.
- Yoshimura Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-resolution graphene-based flexible electronics...
- Patent number 11,465,397
- Issue date Oct 11, 2022
- Iowa State University Research Foundation, Inc.
- Metin Uz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, and resin film, metal foil with resin, metal cla...
- Patent number 11,345,784
- Issue date May 31, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kyosuke Michigami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing circuit board and method for producing integra...
- Patent number 11,272,622
- Issue date Mar 8, 2022
- FUJIFILM Business Innovation Corp.
- Yasuo Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-foil-attached ultra-thin copper foil
- Patent number 11,166,378
- Issue date Nov 2, 2021
- Iljin Materials Co., Ltd.
- Won Jin Beom
- B32 - LAYERED PRODUCTS
Information Patent Grant
Reel-to-reel laser sintering methods and devices in FPC fabrication
- Patent number 11,026,333
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel flexible printed circuit fabrication methods and devices
- Patent number 11,026,332
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foils with ordered crystal structure and method for producing...
- Patent number 10,980,130
- Issue date Apr 13, 2021
- The Curators of the University of Missouri
- Jay A. Switzer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil with carrier, production method for same, production me...
- Patent number 10,886,146
- Issue date Jan 5, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,888,003
- Issue date Jan 5, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Reel-to-reel slug removal methods and devices in FPC fabrication
- Patent number 10,842,025
- Issue date Nov 17, 2020
- Manaflex LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for electromechanical transfer printing of two...
- Patent number 10,828,878
- Issue date Nov 10, 2020
- Massachusetts Institute of Technology
- Sanha Kim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Copper foil with minimized bagginess, wrinkle or tear, electrode in...
- Patent number 10,787,752
- Issue date Sep 29, 2020
- KCF TECHNOLOGIES CO., LTD.
- Seung Min Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded printed circuit board and method of m...
- Patent number 10,779,414
- Issue date Sep 15, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho-Sik Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil, manufacturing method therefor, printed...
- Patent number 10,763,002
- Issue date Sep 1, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing flexible array substrate
- Patent number 10,743,424
- Issue date Aug 11, 2020
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Lixuan Chen
- G02 - OPTICS
Information Patent Grant
Semi-finished product for the production of connection systems for...
- Patent number 10,729,013
- Issue date Jul 28, 2020
- AT&S (CHINA) (CO., LTD.
- Peiwang Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic product and manufacturing method thereof
- Patent number 10,716,219
- Issue date Jul 14, 2020
- Lite-On Electronics (Guangzhou) Limited
- Yi-Feng Pu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,492,308
- Issue date Nov 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper heat dissipation material, carrier-attached copper foil, con...
- Patent number 10,464,291
- Issue date Nov 5, 2019
- JX Nippon Mining & Metals Corporation
- Hajime Momoi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate or panel with releasable core
- Patent number 10,398,033
- Issue date Aug 27, 2019
- Intel Corporation
- Ravi Shankar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminate
- Patent number 10,377,110
- Issue date Aug 13, 2019
- Ube Industries, Ltd.
- Kohji Narui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printing method using two lasers
- Patent number 10,362,683
- Issue date Jul 23, 2019
- Centre National de la Recherche Scientifique
- Anne Patricia Blanche Alloncle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240349422
- Publication date Oct 17, 2024
- SONY GROUP CORPORATION
- Kenji UEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...
- Publication number 20240114624
- Publication date Apr 4, 2024
- ISCOOLLAB CO., LTD.
- YAN-MEI JIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...
- Publication number 20240057263
- Publication date Feb 15, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE FILM AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20230199947
- Publication date Jun 22, 2023
- TORAY ADVANCED MATERIALS KOREA INC.
- Jong Hun Cheon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL WITH CARRIER
- Publication number 20230072120
- Publication date Mar 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20220304161
- Publication date Sep 22, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...
- Publication number 20220287184
- Publication date Sep 8, 2022
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER FOIL AND METHOD OF FABRICATING THE SAME
- Publication number 20220127743
- Publication date Apr 28, 2022
- Circuit Foil Luxembourg
- Zainhia KAIDI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Lift Printing Using Thin Donor Foils
- Publication number 20220024223
- Publication date Jan 27, 2022
- ORBOTECH LTD.
- Marc Altman
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR MANUFACTURING FCCL CAPABLE OF CONTROLLING FLEXIBILITY AN...
- Publication number 20220007514
- Publication date Jan 6, 2022
- Samwon Act Co., Ltd
- Kyung Yul LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210400818
- Publication date Dec 23, 2021
- HUIZHOU GLORYSKY ELECTRONICS CO.,LTD
- Xiaobin Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLA...
- Publication number 20210363308
- Publication date Nov 25, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kyosuke MICHIGAMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITE METAL FOIL AND PREPARATION METHOD THEREOF
- Publication number 20210321515
- Publication date Oct 14, 2021
- GUANGZHOU FANGBANG ELECTRONIC CO., LTD.
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Manufacturing Method for the Manufacturing of High-Precisi...
- Publication number 20210282268
- Publication date Sep 9, 2021
- Alexandre Perry Kamel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20210195755
- Publication date Jun 24, 2021
- DAIWA CO., LTD.
- YOSHIMURA Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING CIRCUIT BOARD AND CIRCUIT BOARD PRODUCING APPA...
- Publication number 20200093004
- Publication date Mar 19, 2020
- FUJI XEROX CO., LTD
- Yasuo MATSUMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20200053885
- Publication date Feb 13, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045830
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045829
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL
- Publication number 20190364664
- Publication date Nov 28, 2019
- ILJIN Materials Co., Ltd.
- Won Jin Beom
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20190261518
- Publication date Aug 22, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL FOILS WITH ORDERED CRYSTAL STRUCTURE AND METHOD FOR PRODUCING...
- Publication number 20190132957
- Publication date May 2, 2019
- THE CURATORS OF THE UNIVERSITY OF MISSOURI
- Jay A. Switzer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20190029125
- Publication date Jan 24, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE ARRAY SUBSTRATE
- Publication number 20180343750
- Publication date Nov 29, 2018
- Shenzhen China Star Optoelectronics Technology Co. LTD.
- Lixuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...
- Publication number 20180288867
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20180279482
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masafumi ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Producing Laminated Body, and Laminated Body
- Publication number 20180279487
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masayuki Takamori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...
- Publication number 20180255646
- Publication date Sep 6, 2018
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION ELIMINATING VOLATILE LOSS OF INITIATING SPECIES F...
- Publication number 20180077796
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Dylan J. Boday
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by transfer of thin metal foil formed on a temporary carrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board producing apparatus

Fabrication of high-resolution graphene-based flexible electronics...

Method for manufacturing FCCL capable of controlling flexibility an...

Composite copper foil and method of fabricating the same

Composite metal foil and preparation method thereof

Reel-to-reel lamination methods and devices in FPC fabrication

Method for manufacturing wiring board or wiring board material

Reel-to-reel laser ablation methods and devices in FPC fabrication

Fabrication of high-resolution graphene-based flexible electronics...

Resin composition, and resin film, metal foil with resin, metal cla...

Method for producing circuit board and method for producing integra...

Carrier-foil-attached ultra-thin copper foil

Reel-to-reel laser sintering methods and devices in FPC fabrication

Reel-to-reel flexible printed circuit fabrication methods and devices

Metal foils with ordered crystal structure and method for producing...

Copper foil with carrier, production method for same, production me...

Copper foil with carrier, coreless support with wiring layer, and m...

Reel-to-reel slug removal methods and devices in FPC fabrication

Systems and methods for electromechanical transfer printing of two...

Copper foil with minimized bagginess, wrinkle or tear, electrode in...

Electronic component embedded printed circuit board and method of m...

Surface-treated copper foil, manufacturing method therefor, printed...

Method for manufacturing flexible array substrate

Semi-finished product for the production of connection systems for...

Electronic product and manufacturing method thereof

Copper foil with carrier, coreless support with wiring layer, and m...

Copper heat dissipation material, carrier-attached copper foil, con...

Substrate or panel with releasable core

Copper clad laminate

Printing method using two lasers

Patents Applicationslast 30 patents

COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

Method for preparing novel material layer structure of high-frequen...

AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...

METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...

COPPER CLAD LAMINATE FILM AND ELECTRONIC DEVICE INCLUDING SAME

METAL FOIL WITH CARRIER

Method for preparing novel material layer structure of high-frequen...

TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...

COMPOSITE COPPER FOIL AND METHOD OF FABRICATING THE SAME

Lift Printing Using Thin Donor Foils

METHOD FOR MANUFACTURING FCCL CAPABLE OF CONTROLLING FLEXIBILITY AN...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLA...

COMPOSITE METAL FOIL AND PREPARATION METHOD THEREOF

Advanced Manufacturing Method for the Manufacturing of High-Precisi...

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

METHOD FOR PRODUCING CIRCUIT BOARD AND CIRCUIT BOARD PRODUCING APPA...

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

METAL FOILS WITH ORDERED CRYSTAL STRUCTURE AND METHOD FOR PRODUCING...

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

METHOD FOR MANUFACTURING FLEXIBLE ARRAY SUBSTRATE

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

Method of Producing Laminated Body, and Laminated Body

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...

RESIN COMPOSITION ELIMINATING VOLATILE LOSS OF INITIATING SPECIES F...