by treatment in plasmas or gaseous environments

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CPC
H01L21/76856

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76856by treatment in plasmas or gaseous environments

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 12,062,578
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method for forming the same
- Patent number 12,062,540
- Issue date Aug 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Ya-Ting Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming barrier layer in semiconductor structure
- Patent number 12,062,573
- Issue date Aug 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,046,510
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate
- Patent number 12,024,777
- Issue date Jul 2, 2024
- Wonik IPS Co., Ltd.
- Dae Seong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 12,020,983
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultralow-K dielectric-gap wrapped contacts and method
- Patent number 11,978,661
- Issue date May 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Fuad H. Al-Amoody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void free low stress fill
- Patent number 11,978,666
- Issue date May 7, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal adhesion layer to promote metal plug adhesion
- Patent number 11,955,379
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to wiring in a semiconductor device
- Patent number 11,923,291
- Issue date Mar 5, 2024
- Kioxia Corporation
- Atsushi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 11,901,227
- Issue date Feb 13, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming titanium nitride barrier with small surface grai...
- Patent number 11,854,980
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and display device including the semiconductor...
- Patent number 11,830,950
- Issue date Nov 28, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Yasutaka Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium oxide film and ruthenium liner for low-resistance copper...
- Patent number 11,749,604
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 11,742,240
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,735,635
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Han Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper plating filling
- Patent number 11,728,213
- Issue date Aug 15, 2023
- Shanghai Huali Integrated Circuit Corporation
- Junjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,676,861
- Issue date Jun 13, 2023
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 11,651,994
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,600,569
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screwless semiconductor processing chambers
- Patent number 11,600,517
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Ru Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Doping control of metal nitride films
- Patent number 11,587,829
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deuterium-containing films
- Patent number 11,508,584
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Sean M. Seutter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 11,469,139
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
2-DIMENSIONAL MATERIALS AS BARRIER LAYERS IN METALLIZATION OF SEMIC...
- Publication number 20240387371
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240355622
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
- Publication number 20240332076
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS TUNGSTEN LAYER DEPOSITION
- Publication number 20240266215
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES
- Publication number 20240258166
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION
- Publication number 20240249977
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240250153
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID FREE LOW STRESS FILL
- Publication number 20240234208
- Publication date Jul 11, 2024
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...
- Publication number 20240209500
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM
- Publication number 20240105508
- Publication date Mar 28, 2024
- Intel Corporation
- Jitendra Kumar Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR...
- Publication number 20240088303
- Publication date Mar 14, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yasutaka NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
- Publication number 20240087955
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...
- Publication number 20240030062
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- Dennis M. Hausmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
- Publication number 20230420295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES
- Publication number 20230386913
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES
- Publication number 20230386914
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-up Formation of Contact Plugs
- Publication number 20230386917
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...
- Publication number 20230361040
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230290681
- Publication date Sep 14, 2023
- Samsung Electronics Co., Ltd.
- Taekyung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes for Reducing Leakage and Improving Adhesion
- Publication number 20230274976
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH DIFFERENT METAL MATERIALS
- Publication number 20230069567
- Publication date Mar 2, 2023
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD, FILM FORMING DEVICE, AND METHOD FOR MANUFACTUR...
- Publication number 20230037960
- Publication date Feb 9, 2023
- Tokyo Electron Limited
- Seokhyoung HONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEUTERIUM-CONTAINING FILMS
- Publication number 20230037450
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Sean M. Seutter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230009266
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM FILL
- Publication number 20220375792
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Lawrence SCHLOSS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20220359262
- Publication date Nov 10, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Bo-Ru CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

by treatment in plasmas or gaseous environments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated assemblies having one or more modifying substances distr...

Bottom-up formation of contact plugs

Bottom-up formation of contact plugs

Prevention of contact bottom void in semiconductor fabrication

Integrated circuit device and method for forming the same

Method for forming barrier layer in semiconductor structure

Conductive feature formation and structure

Method of processing substrate

Processes for reducing leakage and improving adhesion

Ultralow-K dielectric-gap wrapped contacts and method

Void free low stress fill

Self-aligned barrier for metal vias

Metal adhesion layer to promote metal plug adhesion

Selective deposition for integrated circuit interconnect structures

Via connection to wiring in a semiconductor device

Feature fill with nucleation inhibition

Method for forming titanium nitride barrier with small surface grai...

Semiconductor device and display device including the semiconductor...

Method of forming copper interconnect structure with manganese barr...

Ruthenium oxide film and ruthenium liner for low-resistance copper...

Source/drain contact formation methods and devices

Semiconductor device and fabrication method thereof

Method of copper plating filling

Method for fabricating semiconductor device

Processes for reducing leakage and improving adhesion

Integrated circuit device and method of manufacturing the same

Screwless semiconductor processing chambers

Doping control of metal nitride films

Deuterium-containing films

Bottom-up formation of contact plugs

Patents Applicationslast 30 patents

2-DIMENSIONAL MATERIALS AS BARRIER LAYERS IN METALLIZATION OF SEMIC...

BOTTOM-UP FORMATION OF CONTACT PLUGS

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

INTEGRATED CIRCUIT DEVICE

CONDUCTIVE FEATURE FORMATION AND STRUCTURE

LOW STRESS TUNGSTEN LAYER DEPOSITION

SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES

METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SELF-ALIGNED BARRIER FOR METAL VIAS

VOID FREE LOW STRESS FILL

PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...

INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM

SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR...

INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL

INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL

SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES

METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES

Bottom-up Formation of Contact Plugs

RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Processes for Reducing Leakage and Improving Adhesion

INTERCONNECT STRUCTURES WITH DIFFERENT METAL MATERIALS

FILM FORMING METHOD, FILM FORMING DEVICE, AND METHOD FOR MANUFACTUR...

DEUTERIUM-CONTAINING FILMS

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING THE SAME

MOLYBDENUM FILL

SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS