by treatment in plasmas or gaseous environments

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CPC
H01L21/76856

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76856by treatment in plasmas or gaseous environments

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal adhesion layer to promote metal plug adhesion
- Patent number 11,955,379
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to wiring in a semiconductor device
- Patent number 11,923,291
- Issue date Mar 5, 2024
- Kioxia Corporation
- Atsushi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 11,901,227
- Issue date Feb 13, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming titanium nitride barrier with small surface grai...
- Patent number 11,854,980
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and display device including the semiconductor...
- Patent number 11,830,950
- Issue date Nov 28, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Yasutaka Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium oxide film and ruthenium liner for low-resistance copper...
- Patent number 11,749,604
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 11,742,240
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,735,635
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Han Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper plating filling
- Patent number 11,728,213
- Issue date Aug 15, 2023
- Shanghai Huali Integrated Circuit Corporation
- Junjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,676,861
- Issue date Jun 13, 2023
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 11,651,994
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,600,569
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screwless semiconductor processing chambers
- Patent number 11,600,517
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Ru Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Doping control of metal nitride films
- Patent number 11,587,829
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deuterium-containing films
- Patent number 11,508,584
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Sean M. Seutter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 11,469,139
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,450,564
- Issue date Sep 20, 2022
- United Microelectronics Corp.
- Jin-Yan Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device and manufacturing method thereof
- Patent number 11,417,700
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect structures with wrap around capping layers
- Patent number 11,404,311
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 11,362,003
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,335,596
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect structures with wrap around capping layers
- Patent number 11,315,830
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier for CMOS under array type memory device and met...
- Patent number 11,296,112
- Issue date Apr 5, 2022
- SanDisk Technologies LLC
- Fumitaka Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for filling features with ruthenium
- Patent number 11,282,745
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Sang-Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer-by-layer etching of poly-granular metal-based materials for s...
- Patent number 11,270,893
- Issue date Mar 8, 2022
- International Business Machines Corporation
- John M. Papalia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 11,257,712
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese barrier layer
- Patent number 11,232,983
- Issue date Jan 25, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making self-aligned barrier for metal vias In-Situ durin...
- Patent number 11,227,794
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM
- Publication number 20240105508
- Publication date Mar 28, 2024
- Intel Corporation
- Jitendra Kumar Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR...
- Publication number 20240088303
- Publication date Mar 14, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yasutaka NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
- Publication number 20240087955
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...
- Publication number 20240030062
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- Dennis M. Hausmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
- Publication number 20230420295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES
- Publication number 20230386913
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES
- Publication number 20230386914
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-up Formation of Contact Plugs
- Publication number 20230386917
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...
- Publication number 20230361040
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230290681
- Publication date Sep 14, 2023
- Samsung Electronics Co., Ltd.
- Taekyung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes for Reducing Leakage and Improving Adhesion
- Publication number 20230274976
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH DIFFERENT METAL MATERIALS
- Publication number 20230069567
- Publication date Mar 2, 2023
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD, FILM FORMING DEVICE, AND METHOD FOR MANUFACTUR...
- Publication number 20230037960
- Publication date Feb 9, 2023
- Tokyo Electron Limited
- Seokhyoung HONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEUTERIUM-CONTAINING FILMS
- Publication number 20230037450
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Sean M. Seutter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230009266
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM FILL
- Publication number 20220375792
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Lawrence SCHLOSS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20220359262
- Publication date Nov 10, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Bo-Ru CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bottom-up Formation of Contact Plugs
- Publication number 20220359285
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Prevention of Contact Bottom Void in Semiconductor Fabrication
- Publication number 20220301940
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES
- Publication number 20220277996
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...
- Publication number 20220246535
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BARRIER LAYER IN SEMICONDUCTOR STRUCTURE
- Publication number 20220238372
- Publication date Jul 28, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Peng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES
- Publication number 20220189825
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRALOW-K DIELECTRIC-GAP WRAPPED CONTACTS AND METHOD
- Publication number 20220189818
- Publication date Jun 16, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Fuad H. Al-Amoody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20220139773
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
- Publication number 20220130714
- Publication date Apr 28, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
- Publication number 20220115269
- Publication date Apr 14, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
- Publication number 20220115505
- Publication date Apr 14, 2022
- Intel Corporation
- KELIN J. KUHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment methods for titanium nitride films
- Publication number 20220108914
- Publication date Apr 7, 2022
- Applied Materials, Inc.
- Xinming ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

by treatment in plasmas or gaseous environments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal adhesion layer to promote metal plug adhesion

Selective deposition for integrated circuit interconnect structures

Via connection to wiring in a semiconductor device

Feature fill with nucleation inhibition

Method for forming titanium nitride barrier with small surface grai...

Semiconductor device and display device including the semiconductor...

Method of forming copper interconnect structure with manganese barr...

Ruthenium oxide film and ruthenium liner for low-resistance copper...

Source/drain contact formation methods and devices

Semiconductor device and fabrication method thereof

Method of copper plating filling

Method for fabricating semiconductor device

Processes for reducing leakage and improving adhesion

Integrated circuit device and method of manufacturing the same

Screwless semiconductor processing chambers

Doping control of metal nitride films

Deuterium-containing films

Bottom-up formation of contact plugs

Method for fabricating semiconductor device

Image sensing device and manufacturing method thereof

Metallic interconnect structures with wrap around capping layers

Prevention of contact bottom void in semiconductor fabrication

Selective deposition for integrated circuit interconnect structures

Metallic interconnect structures with wrap around capping layers

Multi-layer barrier for CMOS under array type memory device and met...

Methods for filling features with ruthenium

Layer-by-layer etching of poly-granular metal-based materials for s...

Source/drain contact formation methods and devices

Copper interconnect structure with manganese barrier layer

Method for making self-aligned barrier for metal vias In-Situ durin...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM

SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR...

INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL

INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL

SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES

METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES

Bottom-up Formation of Contact Plugs

RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Processes for Reducing Leakage and Improving Adhesion

INTERCONNECT STRUCTURES WITH DIFFERENT METAL MATERIALS

FILM FORMING METHOD, FILM FORMING DEVICE, AND METHOD FOR MANUFACTUR...

DEUTERIUM-CONTAINING FILMS

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FORMING THE SAME

MOLYBDENUM FILL

SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS

Bottom-up Formation of Contact Plugs

Prevention of Contact Bottom Void in Semiconductor Fabrication

SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES

RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...

METHOD FOR FORMING BARRIER LAYER IN SEMICONDUCTOR STRUCTURE

SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES

ULTRALOW-K DIELECTRIC-GAP WRAPPED CONTACTS AND METHOD

SELF-ALIGNED BARRIER FOR METAL VIAS

INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME

COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER

COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT

Treatment methods for titanium nitride films