by using a moving tool for milling or cutting the conductive material

Industry

CPC
H05K3/043

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/043by using a moving tool for milling or cutting the conductive material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, method for manufacturing substrate, and electronic device
- Patent number 12,114,433
- Issue date Oct 8, 2024
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuitry device manufacturing method
- Patent number 12,089,338
- Issue date Sep 10, 2024
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clinch mechanism for assembling a printed circuit board with electr...
- Patent number 11,903,137
- Issue date Feb 13, 2024
- Universal Instruments Corporation
- Koenraad Alexander Gieskes
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Milling of flex foil with two conductive layers from both sides
- Patent number 11,849,544
- Issue date Dec 19, 2023
- Gentherm GmbH
- Jan Horzella
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Electrically conductive film
- Patent number 11,751,327
- Issue date Sep 5, 2023
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating edge connector pins of printed circuit boards withou...
- Patent number 11,653,455
- Issue date May 16, 2023
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a double-sided laminate including dry milli...
- Patent number 11,617,270
- Issue date Mar 28, 2023
- Gentherm Incorporated
- Michael Peter Ciaccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive film
- Patent number 11,388,814
- Issue date Jul 12, 2022
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Expansion card interfaces for high-frequency signals and methods of...
- Patent number 10,999,929
- Issue date May 4, 2021
- Quanta Computer Inc.
- Che-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming of flexible circuitry layers
- Patent number 10,925,168
- Issue date Feb 16, 2021
- Loomia Technolgies, Inc.
- Madison Thea Maxey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High speed signal fan-out method for BGA and printed circuit board...
- Patent number 10,897,810
- Issue date Jan 19, 2021
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
- Jiwei Wen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extremely low profile electrical interconnect for printed wiring board
- Patent number 10,791,632
- Issue date Sep 29, 2020
- Raytheon Company
- Chad E. Patterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Milling of flex foil with two conductive layers from both sides
- Patent number 10,709,022
- Issue date Jul 7, 2020
- Gentherm Incorporated
- Jan Horzella
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Double-sided, single conductor laminated substrate
- Patent number 10,667,394
- Issue date May 26, 2020
- Gentherm Inc.
- Michael Peter Ciaccio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method
- Patent number 10,492,291
- Issue date Nov 26, 2019
- Fujitsu Limited
- Yoshiyuki Hiroshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for recycling electronic systems
- Patent number 10,378,080
- Issue date Aug 13, 2019
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Systems and methods for patterning composite materials and fabricat...
- Patent number 10,260,126
- Issue date Apr 16, 2019
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Vehicular panel and wiring structure for vehicle
- Patent number 10,017,133
- Issue date Jul 10, 2018
- Yazaki Corporation
- Mitsunori Tsunoda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Film composite having electrical functionality for applying to a su...
- Patent number 9,723,726
- Issue date Aug 1, 2017
- Schreiner Group GmbH & Co. KG
- Wolfram Fischer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magneto-dielectric substrate, circuit material, and assembly having...
- Patent number 9,596,755
- Issue date Mar 14, 2017
- Rogers Corporation
- Murali Sethumadhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weaved electrical components in a substrate package core
- Patent number 9,521,751
- Issue date Dec 13, 2016
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and stacked microelectronic packages with in-trench package...
- Patent number 9,025,340
- Issue date May 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jason R. Wright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel antenna and method of forming a panel antenna
- Patent number 8,604,981
- Issue date Dec 10, 2013
- Times-7 Holdings Limited
- Mathias Martin Ernest Ehlen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board fabrication method
- Patent number 8,402,648
- Issue date Mar 26, 2013
- Fujitsu Limited
- Daita Tsubamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric circuits and method of manufacturing fabric circuits
- Patent number 8,022,307
- Issue date Sep 20, 2011
- The United States of America as represented by the administrator of the Natio...
- Andrew W. Chu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Structuring and circuitizing printed circuit board through-holes
- Patent number 7,935,895
- Issue date May 3, 2011
- Cisco Technology, Inc.
- David D. Senk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for manufacturing embedded conformal electronics
- Patent number 7,709,766
- Issue date May 4, 2010
- Research Foundation of the State University of New York
- Richard Gambino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and a power module employing the same
- Patent number 7,368,665
- Issue date May 6, 2008
- Dowa Mining Co., Ltd.
- Masahiro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...
- Publication number 20240206075
- Publication date Jun 20, 2024
- DP Patterning AB
- Staffan Nordlinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...
- Publication number 20230397332
- Publication date Dec 7, 2023
- JUMATECH GMBH
- Philipp WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20230276578
- Publication date Aug 31, 2023
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220386467
- Publication date Dec 1, 2022
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20220312595
- Publication date Sep 29, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM
- Publication number 20220287173
- Publication date Sep 8, 2022
- GENTHERM GMBH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20220279659
- Publication date Sep 1, 2022
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDES
- Publication number 20220192028
- Publication date Jun 16, 2022
- GENTHERM GMBH
- Jan HORZELLA
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Application
AIR FLOW RATE MEASUREMENT DEVICE
- Publication number 20210348957
- Publication date Nov 11, 2021
- DENSO CORPORATION
- Kengo ITOU
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND PROCESSES FOR FORMING ELECTRICAL CIRCUITRIES ON THREE-D...
- Publication number 20210345494
- Publication date Nov 4, 2021
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20210212214
- Publication date Jul 8, 2021
- SUMITOMO BAKELITE CO., LTD.
- Shigeyuki Yagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Conductive Film
- Publication number 20210204400
- Publication date Jul 1, 2021
- GENTHERM GMBH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR
- Publication number 20210144858
- Publication date May 13, 2021
- LOOMIA Technologies, Inc.
- Madison Thea MAXEY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Double-Sided, Single Conductor Laminated Substrate
- Publication number 20210092844
- Publication date Mar 25, 2021
- Gentherm Inc.
- Michael Peter Ciaccio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLINCH MECHANISM FOR ASSEMBLING A PRINTED CIRCUIT BOARD WITH ELECTR...
- Publication number 20200396876
- Publication date Dec 17, 2020
- UNIVERSAL INSTRUMENTS CORPORATION
- Koenraad Alexander Gieskes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANSION CARD INTERFACES FOR HIGH-FREQUENCY SIGNALS AND METHODS OF...
- Publication number 20200383205
- Publication date Dec 3, 2020
- QUANTA COMPUTER INC.
- Che-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Milling of Flex Foil with Two Conductive Layers From Both Sides
- Publication number 20200337154
- Publication date Oct 22, 2020
- Gentherm Inc.
- Jan HORZELLA
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Application
METHOD FOR 3D-SHAPED MULTIPLE-LAYERED ELECTRONICS WITH ULTRASONIC V...
- Publication number 20200187365
- Publication date Jun 11, 2020
- Interlog Corporation
- Nathanael K. KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Conductive Film
- Publication number 20200053873
- Publication date Feb 13, 2020
- GENTHERM GMBH
- Martin Schaetzle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR
- Publication number 20190373733
- Publication date Dec 5, 2019
- LOOMIA Technologies, Inc.
- Madison Thea MAXEY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH SPEED SIGNAL FAN-OUT METHOD FOR BGA AND PRINTED CIRCUIT BOARD...
- Publication number 20190208618
- Publication date Jul 4, 2019
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LT D
- JIWEI WEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD
- Publication number 20170290144
- Publication date Oct 5, 2017
- Fujitsu Limited
- YOSHIYUKI HIROSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM COMPOSITE HAVING ELECTRICAL FUNCTIONALITY FOR APPLYING TO A SU...
- Publication number 20160381810
- Publication date Dec 29, 2016
- Schreiner Group GmbH & Co. KG
- Wolfram FISCHER
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING SHIELD PRINTED WIRING BOARD, AND SHIELD FI...
- Publication number 20160249446
- Publication date Aug 25, 2016
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroshi TAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PATTERNING COMPOSITE MATERIALS AND FABRICAT...
- Publication number 20160219722
- Publication date Jul 28, 2016
- Michael A. TISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETO-DIELECTRIC SUBSTRATE, CIRCUIT MATERIAL, AND ASSEMBLY HAVING...
- Publication number 20160113113
- Publication date Apr 21, 2016
- Rogers Corporation
- Murali Sethumadhavan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE...
- Publication number 20150092377
- Publication date Apr 2, 2015
- JASON R. WRIGHT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD
- Publication number 20140290058
- Publication date Oct 2, 2014
- Charles Randall Malstrom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20130048342
- Publication date Feb 28, 2013
- Tyco Electronics Corporation
- CHARLES RANDALL MALSTROM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Manufacturing Embedded Conformal Electronics
- Publication number 20110171392
- Publication date Jul 14, 2011
- Richard Gambino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by using a moving tool for milling or cutting the conductive material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrically conductive film

Substrate, method for manufacturing substrate, and electronic device

Flexible circuitry device manufacturing method

Clinch mechanism for assembling a printed circuit board with electr...

Milling of flex foil with two conductive layers from both sides

Electrically conductive film

Electroplating edge connector pins of printed circuit boards withou...

Method of manufacturing a double-sided laminate including dry milli...

Electrically conductive film

Methods and processes for forming electrical circuitries on three-d...

Expansion card interfaces for high-frequency signals and methods of...

Methods for forming of flexible circuitry layers

High speed signal fan-out method for BGA and printed circuit board...

Extremely low profile electrical interconnect for printed wiring board

Milling of flex foil with two conductive layers from both sides

Double-sided, single conductor laminated substrate

Wiring board manufacturing method

Systems and methods for recycling electronic systems

Systems and methods for patterning composite materials and fabricat...

Vehicular panel and wiring structure for vehicle

Film composite having electrical functionality for applying to a su...

Magneto-dielectric substrate, circuit material, and assembly having...

Weaved electrical components in a substrate package core

Devices and stacked microelectronic packages with in-trench package...

Panel antenna and method of forming a panel antenna

Printed circuit board fabrication method

Fabric circuits and method of manufacturing fabric circuits

Structuring and circuitizing printed circuit board through-holes

System and method for manufacturing embedded conformal electronics

Circuit board and a power module employing the same

Patents Applicationslast 30 patents

A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...

METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

METHOD OF MANUFACTURING ELECTRONIC COMPONENT

SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE

ELECTRICALLY CONDUCTIVE FILM

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDES

AIR FLOW RATE MEASUREMENT DEVICE

METHODS AND PROCESSES FOR FORMING ELECTRICAL CIRCUITRIES ON THREE-D...

METHOD OF MANUFACTURING CIRCUIT BOARD

Electrically Conductive Film

DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR

Double-Sided, Single Conductor Laminated Substrate

CLINCH MECHANISM FOR ASSEMBLING A PRINTED CIRCUIT BOARD WITH ELECTR...

EXPANSION CARD INTERFACES FOR HIGH-FREQUENCY SIGNALS AND METHODS OF...

Milling of Flex Foil with Two Conductive Layers From Both Sides

METHOD FOR 3D-SHAPED MULTIPLE-LAYERED ELECTRONICS WITH ULTRASONIC V...

Electrically Conductive Film

DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR

HIGH SPEED SIGNAL FAN-OUT METHOD FOR BGA AND PRINTED CIRCUIT BOARD...

WIRING BOARD MANUFACTURING METHOD

FILM COMPOSITE HAVING ELECTRICAL FUNCTIONALITY FOR APPLYING TO A SU...

METHOD FOR MANUFACTURING SHIELD PRINTED WIRING BOARD, AND SHIELD FI...

SYSTEMS AND METHODS FOR PATTERNING COMPOSITE MATERIALS AND FABRICAT...

MAGNETO-DIELECTRIC SUBSTRATE, CIRCUIT MATERIAL, AND ASSEMBLY HAVING...

DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE...

METHOD OF MANUFACTURING A CIRCUIT BOARD

CIRCUIT BOARD

System and Method for Manufacturing Embedded Conformal Electronics