by using supraconducting materials

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H01L21/76891

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76891by using supraconducting materials

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for fabrication of superconducting integrated c...
- Patent number 11,957,065
- Issue date Apr 9, 2024
- 1372934 B.C. LTD
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabrication of superconducting integrated c...
- Patent number 11,930,721
- Issue date Mar 12, 2024
- 1372934 B.C. LTD
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Chip with bifunctional routing and associated method of manufacturing
- Patent number 11,823,997
- Issue date Nov 21, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabricating a qubit coupling device
- Patent number 11,751,490
- Issue date Sep 5, 2023
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing parasitic capacitance and coupling to inductive coupler modes
- Patent number 11,690,301
- Issue date Jun 27, 2023
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
MIM capacitor with adjustable capacitance via electronic fuses
- Patent number 11,631,614
- Issue date Apr 18, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with vias and methods for mak...
- Patent number 11,574,230
- Issue date Feb 7, 2023
- Rigetti & Co, LLC
- Chad Tyler Rigetti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
MIM capacitor with adjustable capacitance via electronic fuses
- Patent number 11,211,290
- Issue date Dec 28, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing parasitic capacitance and coupling to inductive coupler modes
- Patent number 11,127,892
- Issue date Sep 21, 2021
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming superconducting layers and traces
- Patent number 11,114,602
- Issue date Sep 7, 2021
- MICROSOFT TECHNOLOGY LICENSING, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Systems and methods for fabrication of superconducting integrated c...
- Patent number 11,038,095
- Issue date Jun 15, 2021
- D-Wave Systems Inc.
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preclean and dielectric deposition methodology for superconductor i...
- Patent number 10,985,059
- Issue date Apr 20, 2021
- Northrop Grumman Systems Corporation
- Brian Paul Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 10,937,735
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microfabricated air bridges for planar microwave resonator circuits
- Patent number 10,930,987
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Vivekananda P. Adiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer to prevent etching by photoresist developer
- Patent number 10,811,276
- Issue date Oct 20, 2020
- Google LLC
- Anthony Edward Megrant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafer and methods fo...
- Patent number 10,769,546
- Issue date Sep 8, 2020
- Rigetti & Co, Inc.
- Chad Tyler Rigetti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Buffer layer to prevent etching by photoresist developer
- Patent number 10,770,307
- Issue date Sep 8, 2020
- Google LLC
- Anthony Edward Megrant
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Deposition methodology for superconductor interconnects
- Patent number 10,763,419
- Issue date Sep 1, 2020
- Northrop Grumman Systems Corporation
- Christopher F. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer to prevent etching by photoresist developer
- Patent number 10,727,079
- Issue date Jul 28, 2020
- Google LLC
- Anthony Edward Megrant
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Systems and methods for fabrication of superconducting integrated c...
- Patent number 10,700,256
- Issue date Jun 30, 2020
- D-Wave Systems Inc.
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Low-noise microwave amplifier utilizing superconductor-insulator-su...
- Patent number 10,680,567
- Issue date Jun 9, 2020
- INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION NATIONAL INSTITUTES OE NATURA...
- Yoshinori Uzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming superconducting apparatus including superconducti...
- Patent number 10,651,362
- Issue date May 12, 2020
- Microsoft Technology Licensing, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming superconducting wiring layers with low magnetic n...
- Patent number 10,454,015
- Issue date Oct 22, 2019
- D-Wave Systems Inc.
- Trevor Michael Lanting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfabricated air bridges for planar microwave resonator circuits
- Patent number 10,431,866
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Vivekananda P. Adiga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming superconductor structures
- Patent number 10,312,142
- Issue date Jun 4, 2019
- Northrop Grumman Systems Corporation
- Christopher F. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preclean methodology for superconductor interconnect fabrication
- Patent number 10,312,141
- Issue date Jun 4, 2019
- Northrop Grumman Systems Corporation
- Christopher F. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preclean and deposition methodology for superconductor interconnects
- Patent number 10,276,504
- Issue date Apr 30, 2019
- Northrop Grumman Systems Corporation
- Vivien Luu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with VIAS and methods for mak...
- Patent number 9,971,970
- Issue date May 15, 2018
- Rigetti & Co, Inc.
- Chad T. Rigetti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for fabrication of superconducting vias for electrical conn...
- Patent number 9,865,795
- Issue date Jan 9, 2018
- The United States of America as represented by the administrator of the Natio...
- Kevin L. Denis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20250024758
- Publication date Jan 16, 2025
- 1372934 B.C. Ltd.
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Application
CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING
- Publication number 20220093501
- Publication date Mar 24, 2022
- Commissariat à L'énergie atomique et aux énergies alternatives,
- Candice THOMAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES
- Publication number 20220084883
- Publication date Mar 17, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING PARASITIC CAPACITANCE AND COUPLING TO INDUCTIVE COUPLER MODES
- Publication number 20210384402
- Publication date Dec 9, 2021
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCING PARASITIC CAPACITANCE AND COUPLING TO INDUCTIVE COUPLER MODES
- Publication number 20210384401
- Publication date Dec 9, 2021
- Google LLC
- Anthony Edward Megrant
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20210384406
- Publication date Dec 9, 2021
- D-WAVE SYSTEMS INC.
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES
- Publication number 20210296170
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20210118808
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20200274050
- Publication date Aug 27, 2020
- D-WAVE SYSTEMS INC.
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUPERCONDUCTING APPARATUS INCLUDING SUPERCONDUCTING LAYERS AND TRACES
- Publication number 20200243743
- Publication date Jul 30, 2020
- Microsoft Technology Licensing, LLC
- Richard P. Rouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20200144476
- Publication date May 7, 2020
- D-WAVE SYSTEMS INC.
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECLEAN AND DIELECTRIC DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR I...
- Publication number 20200144114
- Publication date May 7, 2020
- Northrop Grumman Systems Corporation
- BRIAN PAUL WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFABRICATED AIR BRIDGES FOR PLANAR MICROWAVE RESONATOR CIRCUITS
- Publication number 20190363418
- Publication date Nov 28, 2019
- International Business Machines Corporation
- Vivekananda P. Adiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECTS
- Publication number 20180351072
- Publication date Dec 6, 2018
- Northrop Grumman Systems Corporation
- CHRISTOPHER F. KIRBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SUPERCONDUCTING WIRING LAYERS WITH LOW MAGNETIC N...
- Publication number 20180219150
- Publication date Aug 2, 2018
- D-WAVE SYSTEMS INC.
- Trevor Michael Lanting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SUPERCONDUCTOR STRUCTURES
- Publication number 20180151430
- Publication date May 31, 2018
- Northrop Grumman Systems Corporation
- Christopher F. KIRBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECLEAN METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECT FABRICATION
- Publication number 20180053689
- Publication date Feb 22, 2018
- Northrop Grumman Systems Corporation
- CHRISTOPHER F. KIRBY
- H01 - BASIC ELECTRIC ELEMENTS

by using supraconducting materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for fabrication of superconducting integrated c...

Systems and methods for fabrication of superconducting integrated c...

Chip with bifunctional routing and associated method of manufacturing

Hybrid under-bump metallization component

Fabricating a qubit coupling device

Reducing parasitic capacitance and coupling to inductive coupler modes

MIM capacitor with adjustable capacitance via electronic fuses

Microwave integrated quantum circuits with vias and methods for mak...

MIM capacitor with adjustable capacitance via electronic fuses

Reducing parasitic capacitance and coupling to inductive coupler modes

Method of forming superconducting layers and traces

Systems and methods for fabrication of superconducting integrated c...

Preclean and dielectric deposition methodology for superconductor i...

Hybrid under-bump metallization component

Microfabricated air bridges for planar microwave resonator circuits

Buffer layer to prevent etching by photoresist developer

Microwave integrated quantum circuits with cap wafer and methods fo...

Buffer layer to prevent etching by photoresist developer

Deposition methodology for superconductor interconnects

Buffer layer to prevent etching by photoresist developer

Systems and methods for fabrication of superconducting integrated c...

Low-noise microwave amplifier utilizing superconductor-insulator-su...

Method of forming superconducting apparatus including superconducti...

Method of forming superconducting wiring layers with low magnetic n...

Microfabricated air bridges for planar microwave resonator circuits

Method of forming superconductor structures

Preclean methodology for superconductor interconnect fabrication

Preclean and deposition methodology for superconductor interconnects

Microwave integrated quantum circuits with VIAS and methods for mak...

Process for fabrication of superconducting vias for electrical conn...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING

MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES

REDUCING PARASITIC CAPACITANCE AND COUPLING TO INDUCTIVE COUPLER MODES

REDUCING PARASITIC CAPACITANCE AND COUPLING TO INDUCTIVE COUPLER MODES

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

MIM CAPACITOR WITH ADJUSTABLE CAPACITANCE VIA ELECTRONIC FUSES

HYBRID UNDER-BUMP METALLIZATION COMPONENT

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

SUPERCONDUCTING APPARATUS INCLUDING SUPERCONDUCTING LAYERS AND TRACES

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

PRECLEAN AND DIELECTRIC DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR I...

MICROFABRICATED AIR BRIDGES FOR PLANAR MICROWAVE RESONATOR CIRCUITS

DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECTS

METHOD OF FORMING SUPERCONDUCTING WIRING LAYERS WITH LOW MAGNETIC N...

METHOD OF FORMING SUPERCONDUCTOR STRUCTURES

PRECLEAN METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECT FABRICATION