by utilizing optical sighting device

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CPC
Y10T29/49131

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

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Y10T29/49131by utilizing optical sighting device

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Patents Grantslast 30 patents

Information Patent Grant
Method of controlling the placement of micro-objects on a micro-ass...
- Patent number 11,772,964
- Issue date Oct 3, 2023
- Xerox Corporation
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component mounting device
- Patent number 11,751,371
- Issue date Sep 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer bonding method and wafer bonding apparatus
- Patent number 11,721,662
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlling the placement of micro-objects on a micro...
- Patent number 11,673,800
- Issue date Jun 13, 2023
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for automatically mounting a connector-housing
- Patent number 11,641,086
- Issue date May 2, 2023
- Aptiv Technologies Limited
- Markus Larisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light-emitting display apparatus and method of manufacturin...
- Patent number 11,575,105
- Issue date Feb 7, 2023
- Samsung Display Co., Ltd.
- Jungmi Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for inspecting insertion states of plurality of pins include...
- Patent number 11,547,033
- Issue date Jan 3, 2023
- Koh Young Technology Inc.
- Dae Sung Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing method
- Patent number 11,546,528
- Issue date Jan 3, 2023
- FUJI CORPORATION
- Masafumi Amano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Automatic insertion apparatus
- Patent number 11,523,552
- Issue date Dec 6, 2022
- Delta Electronics, Inc.
- Yuan-Kun Hsiao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Board working system
- Patent number 11,432,449
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Teruyuki Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer automatic assembly system
- Patent number 11,256,235
- Issue date Feb 22, 2022
- Ki-Beom Kim
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of controlling the placement of micro-objects on a micro-ass...
- Patent number 11,242,244
- Issue date Feb 8, 2022
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component mounting method
- Patent number 11,191,200
- Issue date Nov 30, 2021
- FUJI CORPORATION
- Koushi Kuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic light-emitting display apparatus and method of manufacturin...
- Patent number 11,177,455
- Issue date Nov 16, 2021
- Samsung Display Co., Ltd.
- Jungmi Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting device
- Patent number 10,966,358
- Issue date Mar 30, 2021
- FUJI CORPORATION
- Shigeto Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting device
- Patent number 10,912,241
- Issue date Feb 2, 2021
- Yamaha Hatsudoki Kabushiki Kaisha
- Kazushi Takama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate working system and component mounter
- Patent number 10,888,041
- Issue date Jan 5, 2021
- Yamaha Hatsudoki Kabushiki Kaisha
- Kazushi Takama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding alignment tool
- Patent number 10,847,490
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for automatically mounting a connector-housing
- Patent number 10,804,667
- Issue date Oct 13, 2020
- Delphi Technologies, Inc.
- Markus Larisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount based light emitter components and methods
- Patent number 10,797,204
- Issue date Oct 6, 2020
- Cree, Inc.
- Jesse Colin Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric-based thermal management system
- Patent number 10,784,546
- Issue date Sep 22, 2020
- Gentherm Incorporated
- Alfred Piggott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to assemble aperture segments of a cylindrical feed antenna
- Patent number 10,763,583
- Issue date Sep 1, 2020
- KYMETA CORPORATION
- Steven Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting device
- Patent number 10,674,650
- Issue date Jun 2, 2020
- Yamaha Hatsudoki Kabushiki Kaisha
- Kazushi Takama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Organic light-emitting display apparatus and method of manufacturin...
- Patent number 10,600,993
- Issue date Mar 24, 2020
- Samsung Display Co., Ltd.
- Jungmi Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for camera module
- Patent number 10,477,084
- Issue date Nov 12, 2019
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment tool
- Patent number 10,396,054
- Issue date Aug 27, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounter
- Patent number 10,349,570
- Issue date Jul 9, 2019
- FUJI CORPORATION
- Kenji Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounter
- Patent number 10,319,089
- Issue date Jun 11, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuichi Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermoelectric-based thermal management system
- Patent number 10,270,141
- Issue date Apr 23, 2019
- Gentherm Incorporated
- Alfred Piggott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...
- Publication number 20220153575
- Publication date May 19, 2022
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...
- Publication number 20220153576
- Publication date May 19, 2022
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...
- Publication number 20220069250
- Publication date Mar 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jungmi Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND WAFER BONDING APPARATUS
- Publication number 20210050324
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR AUTOMATICALLY MOUNTING A CONNECTOR-HOUSING
- Publication number 20210028589
- Publication date Jan 28, 2021
- Aptiv Technologies Limited
- Markus Larisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...
- Publication number 20200212339
- Publication date Jul 2, 2020
- SAMSUNG DISPLAY CO., LTD.
- Jungmi Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT TOOL
- Publication number 20190378813
- Publication date Dec 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...
- Publication number 20190148665
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Jungmi Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD WORKING SYSTEM
- Publication number 20180332748
- Publication date Nov 15, 2018
- FUJI CORPORATION
- Teruyuki Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180261578
- Publication date Sep 13, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONNECTOR AND CIRCUIT BOARD ASSEMBLIES
- Publication number 20180011269
- Publication date Jan 11, 2018
- SEAGATE TECHNOLOGY LLC
- Paul Stevens
- G02 - OPTICS
Information Patent Application
COMPONENT MOUNTER
- Publication number 20170280598
- Publication date Sep 28, 2017
- FUJI MACHINE MFG. CO., LTD.
- Kenji HARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATTACHMENT FOR AN ELECTRONIC COMMUNICATIONS DEVICE
- Publication number 20170264332
- Publication date Sep 14, 2017
- CLASSIC PROMOTIONS PTY LTD.
- Aaron LEIBOVICH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...
- Publication number 20170263881
- Publication date Sep 14, 2017
- SAMSUNG DISPLAY CO., LTD.
- Jungmi Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE MOUNTING APPARATUS
- Publication number 20140290047
- Publication date Oct 2, 2014
- Toru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACEMENT APPARATUS FOR OPTICAL COMPONENT, SUCTION NOZZLE FOR OPTIC...
- Publication number 20140283380
- Publication date Sep 25, 2014
- Fujitsu Limited
- Yoshiyuki HIROSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-STAGE POWER DELIVERY ARCHITECTURE
- Publication number 20140268615
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DIODE MODULE
- Publication number 20140173885
- Publication date Jun 26, 2014
- CHIH-CHEN LAI
- G02 - OPTICS
Information Patent Application
Backlight Source and Assembly Method of the Same
- Publication number 20140160794
- Publication date Jun 12, 2014
- BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
- Deyu MENG
- G02 - OPTICS
Information Patent Application
COMPONENT MOUNTER, NOZZLE, AND COMPONENT MOUNTING POSITION CORRECTI...
- Publication number 20140130348
- Publication date May 15, 2014
- Osamu Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH EFFICIENCY EMBEDDING TECHNOLOGY
- Publication number 20140111955
- Publication date Apr 24, 2014
- Infineon Technologies Austria AG
- Martin STANDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING RF ABLATION PROBE WITH UNIBODY ELECTRODE EL...
- Publication number 20130283607
- Publication date Oct 31, 2013
- Jeff W. Zerfas
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PASSIVE WITHIN VIA
- Publication number 20130249112
- Publication date Sep 26, 2013
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING ILLUMINATION SYSTEMS
- Publication number 20130212859
- Publication date Aug 22, 2013
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Clarence Chui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED Replacement of Directional Incandescent Lamps
- Publication number 20130114261
- Publication date May 9, 2013
- Goeken Group Corporation
- Carlo Scianna
- F21 - LIGHTING
Information Patent Application
METHOD FOR PLACING A COMPONENT ON A SUBSTRATE
- Publication number 20130097835
- Publication date Apr 25, 2013
- Johannes Hubertus Antonius Van de Rijdt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING ALIGNMENT TOOL AND METHOD
- Publication number 20130086786
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ASSEMBLE OPTICAL DEVICES WITH OPTICALLY INTERFERING DEVICE
- Publication number 20130055545
- Publication date Mar 7, 2013
- Sumitomo Electric Industries, Ltd.
- Tohru WATANABE
- G02 - OPTICS
Information Patent Application
WORKPIECE TRANSFER APPARATUS, WORKPIECE MOUNTING APPARATUS AND WORK...
- Publication number 20130055541
- Publication date Mar 7, 2013
- TDK Corporation
- Toru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS

by utilizing optical sighting device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of controlling the placement of micro-objects on a micro-ass...

Component mounting device

Wafer bonding method and wafer bonding apparatus

Apparatus for controlling the placement of micro-objects on a micro...

Method for automatically mounting a connector-housing

Organic light-emitting display apparatus and method of manufacturin...

Method for inspecting insertion states of plurality of pins include...

Image processing method

Automatic insertion apparatus

Board working system

Computer automatic assembly system

Method of controlling the placement of micro-objects on a micro-ass...

Component mounting method

Organic light-emitting display apparatus and method of manufacturin...

Electronic module

Component mounting device

Component mounting device

Substrate working system and component mounter

Bonding alignment tool

Device for automatically mounting a connector-housing

Submount based light emitter components and methods

Thermoelectric-based thermal management system

Method to assemble aperture segments of a cylindrical feed antenna

Component mounting device

Organic light-emitting display apparatus and method of manufacturin...

Manufacturing method for camera module

Bonding alignment tool

Component mounter

Component mounter

Thermoelectric-based thermal management system

Patents Applicationslast 30 patents

METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...

METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...

ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...

ELECTRONIC MODULE

WAFER BONDING METHOD AND WAFER BONDING APPARATUS

DEVICE AND METHOD FOR AUTOMATICALLY MOUNTING A CONNECTOR-HOUSING

ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...

BONDING ALIGNMENT TOOL

ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...

BOARD WORKING SYSTEM

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

OPTICAL CONNECTOR AND CIRCUIT BOARD ASSEMBLIES

COMPONENT MOUNTER

ATTACHMENT FOR AN ELECTRONIC COMMUNICATIONS DEVICE

ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURIN...

WORKPIECE MOUNTING APPARATUS

PLACEMENT APPARATUS FOR OPTICAL COMPONENT, SUCTION NOZZLE FOR OPTIC...

TWO-STAGE POWER DELIVERY ARCHITECTURE

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE MODULE

Backlight Source and Assembly Method of the Same

COMPONENT MOUNTER, NOZZLE, AND COMPONENT MOUNTING POSITION CORRECTI...

HIGH EFFICIENCY EMBEDDING TECHNOLOGY

METHOD OF MANUFACTURING RF ABLATION PROBE WITH UNIBODY ELECTRODE EL...

PASSIVE WITHIN VIA

METHODS OF MANUFACTURING ILLUMINATION SYSTEMS

LED Replacement of Directional Incandescent Lamps

METHOD FOR PLACING A COMPONENT ON A SUBSTRATE

BONDING ALIGNMENT TOOL AND METHOD

METHOD TO ASSEMBLE OPTICAL DEVICES WITH OPTICALLY INTERFERING DEVICE

WORKPIECE TRANSFER APPARATUS, WORKPIECE MOUNTING APPARATUS AND WORK...