By vapour deposition

Industry

CPC
H05K3/146

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/146By vapour deposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Visible components with functional coating
- Patent number 12,027,038
- Issue date Jul 2, 2024
- Audi AG
- Frank Stohler
- G08 - SIGNALLING
Information Patent Grant
Miniaturized impedance sensors
- Patent number 11,895,781
- Issue date Feb 6, 2024
- Tula Health, Inc.
- Robert Davis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Increasing adhesion of metal-organic interfaces by silane vapor tre...
- Patent number 11,818,849
- Issue date Nov 14, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for selectively coating a substrate using shado...
- Patent number 11,795,539
- Issue date Oct 24, 2023
- Massachusetts Institute of Technology
- Isaac Mayer Ehrenberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Implantable electrical connecting device
- Patent number 11,785,716
- Issue date Oct 10, 2023
- Albert-Ludwigs-Universitat Freiburg
- Patrick Kiele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing embedded circuit board, embedded circuit b...
- Patent number 11,632,861
- Issue date Apr 18, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing display substrate
- Patent number 11,417,847
- Issue date Aug 16, 2022
- BOE Technology Group Co., Ltd.
- Youngyik Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier comprising a double layer structure
- Patent number 11,197,367
- Issue date Dec 7, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring on curved surfaces
- Patent number 11,194,179
- Issue date Dec 7, 2021
- Tectus Corporation
- Eric Anthony Perozziello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass wiring substrate, method of producing the same, part-mounted...
- Patent number 11,195,971
- Issue date Dec 7, 2021
- Sony Corporation
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaporation apparatus for depositing material on a flexible substra...
- Patent number 11,058,010
- Issue date Jul 6, 2021
- Applied Materials, Inc.
- Roland Trassl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sn whisker growth mitigation using NiO sublayers
- Patent number 10,967,463
- Issue date Apr 6, 2021
- The University of Toledo
- Vamsi Borra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask frame assembly including pattern position adjusting mechanism...
- Patent number 10,883,164
- Issue date Jan 5, 2021
- Samsung Display Co., Ltd.
- Mingoo Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,856,376
- Issue date Dec 1, 2020
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for selectively coating a substrate using shado...
- Patent number 10,814,609
- Issue date Oct 27, 2020
- Massachusetts Institute of Technology
- Isaac Mayer Ehrenberg
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,813,182
- Issue date Oct 20, 2020
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,791,628
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass wiring substrate, method of producing the same, part-mounted...
- Patent number 10,784,403
- Issue date Sep 22, 2020
- Sony Corporation
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of forming same
- Patent number 10,785,878
- Issue date Sep 22, 2020
- Honeywell Federal Manufacturing & Technologies, LLC
- Michael Girardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device including the same, and manufac...
- Patent number 10,772,205
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure comprising an inductor and resistor
- Patent number 10,586,774
- Issue date Mar 10, 2020
- Rohm Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave attenuators on high-thermal conductivity substrates for q...
- Patent number 10,505,245
- Issue date Dec 10, 2019
- International Business Machines Corporation
- Salvatore Bernardo Olivadese
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of thin film adhesion pretreatment
- Patent number 10,426,043
- Issue date Sep 24, 2019
- Honeywell Federal Manufacturing & Technologies, LLC
- Michael Girardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,426,030
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable electronics for dentistry applications and method of ma...
- Patent number 10,405,432
- Issue date Sep 3, 2019
- Marco Letizia
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Film and flexible metal-clad laminate
- Patent number 10,375,836
- Issue date Aug 6, 2019
- Kaneka Corporation
- Takashi Kikuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,165,640
- Issue date Dec 25, 2018
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of patterning graphene holes and method of fabricating graph...
- Patent number 10,124,438
- Issue date Nov 13, 2018
- Samsung Electronics Co., Ltd.
- Jeongyub Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and arrangement for transferring electrically conductive mat...
- Patent number 10,085,350
- Issue date Sep 25, 2018
- Stora Enso Oyj
- Juha Maijala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film thickness regulator and manufacturing method thereof, film thi...
- Patent number 9,930,787
- Issue date Mar 27, 2018
- BOE Technology Group Co., Ltd.
- Xiaohu Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...
- Publication number 20240357749
- Publication date Oct 24, 2024
- Yield Engineering Systems, Inc.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251510
- Publication date Jul 25, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVELY COATNG A SUBSTRATE USING SHADOW...
- Publication number 20240209492
- Publication date Jun 27, 2024
- Massachusetts Institute of Technology
- Isaac Mayer Ehrenberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hydrophobic Low-Dielectric-Constant Film and Preparation Method The...
- Publication number 20220145460
- Publication date May 12, 2022
- JIANGSU FAVORED NANOTECHNOLOGY CO., LTD.
- Jian Zong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING EMBEDDED CIRCUIT BOARD, EMBEDDED CIRCUIT B...
- Publication number 20220015243
- Publication date Jan 13, 2022
- SHENNAN CIRCUITS CO., LTD.
- LIXIANG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Implantable Electrical Connecting Device
- Publication number 20210274654
- Publication date Sep 2, 2021
- Albert-Ludwigs-Universitat Freiburg
- Patrick Kiele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVELY COATING A SUBSTRATE USING SHADO...
- Publication number 20210039378
- Publication date Feb 11, 2021
- Massachusetts Institute of Technology
- Isaac Mayer Ehrenberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GLASS WIRING SUBSTRATE, METHOD OF PRODUCING THE SAME, PART-MOUNTED...
- Publication number 20200381587
- Publication date Dec 3, 2020
- SONY CORPORATION
- Toshihiko WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising a Double Layer Structure
- Publication number 20200329555
- Publication date Oct 15, 2020
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFAC...
- Publication number 20200275552
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FORMING SAME
- Publication number 20190274223
- Publication date Sep 5, 2019
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Michael Girardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROWAVE ATTENUATORS ON HIGH-THERMAL CONDUCTIVITY SUBSTRATES FOR Q...
- Publication number 20190252752
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Salvatore Bernardo Olivadese
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EVAPORATION APPARATUS FOR DEPOSITING MATERIAL ON A FLEXIBLE SUBSTRA...
- Publication number 20190246504
- Publication date Aug 8, 2019
- Applied Materials, Inc.
- Roland TRASSL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER
- Publication number 20190166669
- Publication date May 30, 2019
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS WIRING SUBSTRATE, METHOD OF PRODUCING THE SAME, PART-MOUNTED...
- Publication number 20190103513
- Publication date Apr 4, 2019
- SONY CORPORATION
- Toshihiko WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE/VIA HYBRID STRUCTURE MULTICHIP CARRIER
- Publication number 20180310403
- Publication date Oct 25, 2018
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE ELECTRONICS FOR DENTISTRY APPLICATIONS AND METHOD OF MA...
- Publication number 20180168033
- Publication date Jun 14, 2018
- Marco Letizia
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FILM AND FLEXIBLE METAL-CLAD LAMINATE
- Publication number 20180132362
- Publication date May 10, 2018
- Kaneka Corporation
- Takashi Kikuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD AND METHOD OF FORMING SAME
- Publication number 20180054899
- Publication date Feb 22, 2018
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES LLC
- MICHAEL GIRARDI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring on Curved Surfaces
- Publication number 20180017813
- Publication date Jan 18, 2018
- Spy Eye, LLC
- Eric Anthony Perozziello
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD WITH VIA CAPACITOR STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20170367183
- Publication date Dec 21, 2017
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Wen Tsung LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTORS, MAKING METHOD OF THE SAME, AND ELECTRONIC DEVICES INCLU...
- Publication number 20170273181
- Publication date Sep 21, 2017
- Samsung Electronics Co., Ltd.
- Hiesang SOHN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Warpage Control With Intermediate Material
- Publication number 20170231086
- Publication date Aug 10, 2017
- AT & S Austria Technologie & Systemtechink Aktiengesellschaft
- Elisabeth Kreutzwiesner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF FORMING ELECTRICAL INTERCONNECTS
- Publication number 20170223828
- Publication date Aug 3, 2017
- The Boeing Company
- Minas H. Tanielian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GRAPHENE WIRING STRUCTURE AND METHOD FOR MANUFACTURING GRAPHENE WIR...
- Publication number 20170079138
- Publication date Mar 16, 2017
- KABUSHIKI KAISHA TOSHIBA
- Tadashi SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM THICKNESS REGULATOR AND MANUFACTURING METHOD THEREOF, FILM THI...
- Publication number 20170037507
- Publication date Feb 9, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiaohu LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

By vapour deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Visible components with functional coating

Miniaturized impedance sensors

Increasing adhesion of metal-organic interfaces by silane vapor tre...

Systems and methods for selectively coating a substrate using shado...

Implantable electrical connecting device

Method for manufacturing embedded circuit board, embedded circuit b...

Method for manufacturing display substrate

Component carrier comprising a double layer structure

Wiring on curved surfaces

Glass wiring substrate, method of producing the same, part-mounted...

Evaporation apparatus for depositing material on a flexible substra...

Sn whisker growth mitigation using NiO sublayers

Mask frame assembly including pattern position adjusting mechanism...

Printed circuit board for integrated LED driver

Systems and methods for selectively coating a substrate using shado...

Printed circuit board for integrated LED driver

Trace/via hybrid structure multichip carrier

Glass wiring substrate, method of producing the same, part-mounted...

Circuit board and method of forming same

Circuit board, semiconductor device including the same, and manufac...

Structure comprising an inductor and resistor

Microwave attenuators on high-thermal conductivity substrates for q...

Method of thin film adhesion pretreatment

Trace/via hybrid structure multichip carrier

Stretchable electronics for dentistry applications and method of ma...

Film and flexible metal-clad laminate

Printed circuit board for integrated LED driver

Method of patterning graphene holes and method of fabricating graph...

Method and arrangement for transferring electrically conductive mat...

Film thickness regulator and manufacturing method thereof, film thi...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD

SYSTEMS AND METHODS FOR SELECTIVELY COATNG A SUBSTRATE USING SHADOW...

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

Hydrophobic Low-Dielectric-Constant Film and Preparation Method The...

METHOD FOR MANUFACTURING EMBEDDED CIRCUIT BOARD, EMBEDDED CIRCUIT B...

Implantable Electrical Connecting Device

SYSTEMS AND METHODS FOR SELECTIVELY COATING A SUBSTRATE USING SHADO...

GLASS WIRING SUBSTRATE, METHOD OF PRODUCING THE SAME, PART-MOUNTED...

Component Carrier Comprising a Double Layer Structure

CIRCUIT BOARD, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFAC...

CIRCUIT BOARD AND METHOD OF FORMING SAME

MICROWAVE ATTENUATORS ON HIGH-THERMAL CONDUCTIVITY SUBSTRATES FOR Q...

EVAPORATION APPARATUS FOR DEPOSITING MATERIAL ON A FLEXIBLE SUBSTRA...

PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER

GLASS WIRING SUBSTRATE, METHOD OF PRODUCING THE SAME, PART-MOUNTED...

TRACE/VIA HYBRID STRUCTURE MULTICHIP CARRIER

STRETCHABLE ELECTRONICS FOR DENTISTRY APPLICATIONS AND METHOD OF MA...

FILM AND FLEXIBLE METAL-CLAD LAMINATE

CIRCUIT BOARD AND METHOD OF FORMING SAME

Wiring on Curved Surfaces

CIRCUIT BOARD WITH VIA CAPACITOR STRUCTURE AND MANUFACTURING METHOD...

CONDUCTORS, MAKING METHOD OF THE SAME, AND ELECTRONIC DEVICES INCLU...

Warpage Control With Intermediate Material

SYSTEM AND METHOD OF FORMING ELECTRICAL INTERCONNECTS

GRAPHENE WIRING STRUCTURE AND METHOD FOR MANUFACTURING GRAPHENE WIR...

FILM THICKNESS REGULATOR AND MANUFACTURING METHOD THEREOF, FILM THI...