by vapour etching only

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H01L21/32135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32135by vapour etching only

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of metal grid, thin film sensor and manufactur...
- Patent number 12,224,234
- Issue date Feb 11, 2025
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Hu Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact with air spacer
- Patent number 12,176,400
- Issue date Dec 24, 2024
- TAIWAN SEMINCODCUTOR MANUFACTURING COMPANY, LTD.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation and in-situ etching processes for metal layers
- Patent number 12,170,202
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,170,206
- Issue date Dec 17, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for cleaning high aspect ratio structures
- Patent number 12,170,196
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Schubert S. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a gate terminal of a HEMT device, and HEMT...
- Patent number 12,165,871
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Ferdinando Iucolano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metal gate devices and resulting structures
- Patent number 12,159,916
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching method using potential control of grid and substrate
- Patent number 12,148,626
- Issue date Nov 19, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young Yeom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing metal gate overhang by forming a top-wide bottom-narrow du...
- Patent number 12,142,664
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,136,662
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having signal lines formed with double patterning
- Patent number 12,100,655
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and method
- Patent number 12,100,748
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,094,877
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chih Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching processes
- Patent number 12,094,686
- Issue date Sep 17, 2024
- ASM IP Holding B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate
- Patent number 12,080,561
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Zhi-Xuan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch and ion beam etch patterning
- Patent number 12,080,562
- Issue date Sep 3, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase thermal etch solutions for metal oxo photoresists
- Patent number 12,068,170
- Issue date Aug 20, 2024
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Isolation structures for semiconductor devices
- Patent number 12,057,449
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Shuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with protection liner f...
- Patent number 12,057,348
- Issue date Aug 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Huan-Yung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective metal residue and liner cleanse for post-subtractive etch
- Patent number 12,046,511
- Issue date Jul 23, 2024
- International Business Machines Corporation
- Devika Sarkar Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conformal capping layer and method forming same
- Patent number 12,046,660
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Ho Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of ono integration into logic CMOS flow
- Patent number 12,048,162
- Issue date Jul 23, 2024
- LONGITUDE FLASH MEMORY SOLUTIONS LTD.
- Krishnaswamy Ramkumar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing capacitor array
- Patent number 12,034,034
- Issue date Jul 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Zhi-Xuan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase thermal etch solutions for metal oxo photoresists
- Patent number 12,033,866
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device fabrication with removal of accumulation of ma...
- Patent number 12,014,933
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yan-Hong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,009,223
- Issue date Jun 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a III-N enhancement mode HEMT device
- Patent number 12,002,680
- Issue date Jun 4, 2024
- Imec VZW
- Niels Posthuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cut metal gate processes
- Patent number 11,990,341
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER ETCHING PROCESSES
- Publication number 20250037970
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING
- Publication number 20240395704
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION, LAMI...
- Publication number 20240393693
- Publication date Nov 28, 2024
- NISSAN CHEMICAL CORPORATION
- Wataru SHIBAYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GATE STRUCTURE AND METHOD
- Publication number 20240387677
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES
- Publication number 20240387678
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20240387699
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240379557
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379366
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240371870
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chih Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION AND IN-SITU ETCHING PROCESSES FOR METAL LAYERS
- Publication number 20240363350
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DIE
- Publication number 20240355631
- Publication date Oct 24, 2024
- SK keyfoundry Inc.
- Dal Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH PROTECTION LINER F...
- Publication number 20240355674
- Publication date Oct 24, 2024
- NANYA TECHNOLOGY CORPORATION
- HUAN-YUNG YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME
- Publication number 20240347622
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Ho Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321779
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20240312990
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shuo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT METAL GATE PROCESSES
- Publication number 20240290620
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing CO.,LTD.
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...
- Publication number 20240274528
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240274692
- Publication date Aug 15, 2024
- RENESAS ELECTRONICS CORPORATION
- Yuya ABIKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD
- Publication number 20240234370
- Publication date Jul 11, 2024
- Wolfspeed, Inc.
- Shadi Sabri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BEAM LITHOGRAPHY AND NANOENGINEERING
- Publication number 20240222073
- Publication date Jul 4, 2024
- Intel Corporation
- Shida Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVELY FORMING A PASSIVATION LAYER ON A DIELECTRIC...
- Publication number 20240222135
- Publication date Jul 4, 2024
- ASM IP HOLDING B.V.
- Daniele Chiappe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240213122
- Publication date Jun 27, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kenichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240213322
- Publication date Jun 27, 2024
- Huawei Technologies Co., Ltd
- Hongsheng YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKS ASIDE STACKED GATE STRUCTURE AND...
- Publication number 20240172434
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240136200
- Publication date Apr 25, 2024
- Kokusai Electric Corporation
- Motomu DEGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVIC...
- Publication number 20240096644
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Koki UEHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Footing Removal in Cut-Metal Process
- Publication number 20240096707
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088041
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TSENG-CHIEH PAN
- H01 - BASIC ELECTRIC ELEMENTS

by vapour etching only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of metal grid, thin film sensor and manufactur...

Method of manufacturing semiconductor devices with multiple silicid...

Backside contact with air spacer

Formation and in-situ etching processes for metal layers

Method of processing substrate, method of manufacturing semiconduct...

Methods and systems for cleaning high aspect ratio structures

Method for manufacturing a gate terminal of a HEMT device, and HEMT...

Method for fabricating metal gate devices and resulting structures

Dry etching method using potential control of grid and substrate

Reducing metal gate overhang by forming a top-wide bottom-narrow du...

Methods of forming semiconductor devices

Integrated circuits having signal lines formed with double patterning

Gate structure and method

Semiconductor device and method

Atomic layer etching processes

Method of processing substrate

Atomic layer etch and ion beam etch patterning

Vapor phase thermal etch solutions for metal oxo photoresists

Isolation structures for semiconductor devices

Method for fabricating semiconductor device with protection liner f...

Microelectronic assembly from processed substrate

Selective metal residue and liner cleanse for post-subtractive etch

Non-conformal capping layer and method forming same

Method of ono integration into logic CMOS flow

Method of manufacturing capacitor array

Vapor phase thermal etch solutions for metal oxo photoresists

Semiconductor device fabrication with removal of accumulation of ma...

Semiconductor structure and manufacturing method thereof

Method of manufacturing a III-N enhancement mode HEMT device

Cut metal gate processes

Patents Applicationslast 30 patents

ATOMIC LAYER ETCHING PROCESSES

INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING

SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION, LAMI...

GATE STRUCTURE AND METHOD

METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES

METHODS OF FORMING SEMICONDUCTOR DEVICES

GATE CONTACT STRUCTURE

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

SEMICONDUCTOR DEVICES

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

Semiconductor Device and Method

FORMATION AND IN-SITU ETCHING PROCESSES FOR METAL LAYERS

METHOD FOR MANUFACTURING SEMICONDUCTOR DIE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH PROTECTION LINER F...

NON-CONFORMAL CAPPING LAYER AND METHOD FORMING SAME

INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME

ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES

CUT METAL GATE PROCESSES

METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD

ION BEAM LITHOGRAPHY AND NANOENGINEERING

METHODS FOR SELECTIVELY FORMING A PASSIVATION LAYER ON A DIELECTRIC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND ELECTRONIC...

SEMICONDUCTOR DEVICE HAVING STACKS ASIDE STACKED GATE STRUCTURE AND...

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVIC...

Footing Removal in Cut-Metal Process

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF