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CPC
H05K2203/0147

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0147Carriers and holders

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing substrate with sensor
- Patent number 12,167,542
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Manabu Nakagawasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Transfer printing high-precision devices
- Patent number 12,016,131
- Issue date Jun 18, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Mounting device and control method for same
- Patent number 11,968,785
- Issue date Apr 23, 2024
- FUJI CORPORATION
- Hidetoshi Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,516,926
- Issue date Nov 29, 2022
- Innolux Corporation
- Pai-Chi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Feeder
- Patent number 11,445,648
- Issue date Sep 13, 2022
- FUJI CORPORATION
- Yukinori Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detection method for electronic devices
- Patent number 11,163,121
- Issue date Nov 2, 2021
- Industrial Technology Research Institute
- Ming-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Work system
- Patent number 10,856,461
- Issue date Dec 1, 2020
- FUJI CORPORATION
- Hirotaka Hirayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of substrate structure
- Patent number 10,764,995
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Placement of component in circuit board intermediate product by flo...
- Patent number 10,709,023
- Issue date Jul 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and manufacturing method
- Patent number 10,595,414
- Issue date Mar 17, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, method for manufacturing printed circuit boa...
- Patent number 10,206,289
- Issue date Feb 12, 2019
- Tatsuta Electric Wire & Cable Co., Ltd.
- Yoshihiko Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical receiver and optical transceiver
- Patent number 9,977,192
- Issue date May 22, 2018
- Industrial Technology Research Institute
- Chia-Hsin Chao
- G02 - OPTICS
Information Patent Grant
Flexible circuit board and cutting device
- Patent number 9,903,906
- Issue date Feb 27, 2018
- BOE Technology Group Co., Ltd.
- Guowen Yang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Feeder management system of component mounting apparatus
- Patent number 9,669,980
- Issue date Jun 6, 2017
- Fuji Machine Mfg. Co., Ltd.
- Yuji Koyanagi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate separation apparatus and method
- Patent number 9,125,295
- Issue date Sep 1, 2015
- Samsung Display Co., Ltd.
- Seung Jun Lee
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20240292543
- Publication date Aug 29, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...
- Publication number 20240269759
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...
- Publication number 20240074064
- Publication date Feb 29, 2024
- Heraeus Deutschland GmbH & Co. KG
- Richard WACKER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20230217598
- Publication date Jul 6, 2023
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Universal Pin Production Support (UPPS)
- Publication number 20230067686
- Publication date Mar 2, 2023
- Matthew Miller Reggio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH SENSOR
- Publication number 20220151078
- Publication date May 12, 2022
- TOKYO ELECTRON LIMITED
- Manabu NAKAGAWASAI
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE
- Publication number 20220015242
- Publication date Jan 13, 2022
- ITED INC.
- Jee-Hoon SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MICROELECTRODE FILM
- Publication number 20210315105
- Publication date Oct 7, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Fan LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A FLEXIBLE DEVICE, FLEXIBLE ELECTRONIC DEVICE...
- Publication number 20210029830
- Publication date Jan 28, 2021
- Applied Materials, Inc.
- John MALTABES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING DEVICE AND CONTROL METHOD FOR SAME
- Publication number 20200413579
- Publication date Dec 31, 2020
- FUJI CORPORATION
- Hidetoshi KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATED PRINTER ROBOTIC ARM
- Publication number 20200391499
- Publication date Dec 17, 2020
- Illinois Tool Works Inc.
- James Lynch
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ROBOT APPARATUS AND METHOD OF MANUFACTURINGG ELECTRONIC APPARATUS
- Publication number 20200352037
- Publication date Nov 5, 2020
- SONY CORPORATION
- YUJI KOBORI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20200178402
- Publication date Jun 4, 2020
- InnoLux Corporation
- Pai-Chi TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORK SYSTEM
- Publication number 20200037480
- Publication date Jan 30, 2020
- FUJI CORPORATION
- Hirotaka HIRAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTION METHOD FOR ELECTRONIC DEVICES
- Publication number 20190285805
- Publication date Sep 19, 2019
- Industrial Technology Research Institute
- Ming-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDER
- Publication number 20190215995
- Publication date Jul 11, 2019
- FUJI CORPORATION
- Yukinori TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Manufacturing Method
- Publication number 20180288879
- Publication date Oct 4, 2018
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180279480
- Publication date Sep 27, 2018
- Unimicron Technology Corp.
- Ching-Hao HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOA...
- Publication number 20170325338
- Publication date Nov 9, 2017
- Yoshihiko AOYAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT...
- Publication number 20170290165
- Publication date Oct 5, 2017
- TDK Corporation
- Hitoshi SAITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Placement of Component in Circuit Board Intermediate Product by Flo...
- Publication number 20170181293
- Publication date Jun 22, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND CUTTING DEVICE
- Publication number 20170082681
- Publication date Mar 23, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Guowen YANG
- G01 - MEASURING TESTING
Information Patent Application
DETECTION METHOD FOR ELECTRONIC DEVICES AND ELECTRONIC DEVICE TRANS...
- Publication number 20170034922
- Publication date Feb 2, 2017
- Industrial Technology Research Institute
- Ming-Hsien Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERIFYING COMPONENTS FOR PLACEMENT
- Publication number 20160345441
- Publication date Nov 24, 2016
- Accu-Assembly Incorporated
- Yuen-Foo Michael Kou
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20150128411
- Publication date May 14, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20150128410
- Publication date May 14, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE SEPARATION APPARATUS AND METHOD
- Publication number 20140338828
- Publication date Nov 20, 2014
- SAMSUNG DISPLAY CO., LTD.
- Seung Jun LEE
- B32 - LAYERED PRODUCTS

Carriers and holders

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing substrate with sensor

Method for manufacturing microelectrode film

Transfer printing high-precision devices

Mounting device and control method for same

Method for manufacturing flexible circuit board

Feeder

Detection method for electronic devices

Work system

Fabrication method of substrate structure

Placement of component in circuit board intermediate product by flo...

Component carrier and manufacturing method

Printed circuit board, method for manufacturing printed circuit boa...

Optical receiver and optical transceiver

Flexible circuit board and cutting device

Feeder management system of component mounting apparatus

Substrate separation apparatus and method

Patents Applicationslast 30 patents

Component Carrier Method of Manufacturing the Component Carrier and...

TRANSFER PRINTING HIGH-PRECISION DEVICES

CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...

METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...

TRANSFER PRINTING HIGH-PRECISION DEVICES

Universal Pin Production Support (UPPS)

METHOD FOR MANUFACTURING SUBSTRATE WITH SENSOR

APPARATUS AND METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE

METHOD FOR MANUFACTURING MICROELECTRODE FILM

METHOD FOR PRODUCING A FLEXIBLE DEVICE, FLEXIBLE ELECTRONIC DEVICE...

MOUNTING DEVICE AND CONTROL METHOD FOR SAME

AUTOMATED PRINTER ROBOTIC ARM

ROBOT APPARATUS AND METHOD OF MANUFACTURINGG ELECTRONIC APPARATUS

METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

WORK SYSTEM

DETECTION METHOD FOR ELECTRONIC DEVICES

FEEDER

Component Carrier and Manufacturing Method

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOA...

THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT...

Placement of Component in Circuit Board Intermediate Product by Flo...

FLEXIBLE CIRCUIT BOARD AND CUTTING DEVICE

DETECTION METHOD FOR ELECTRONIC DEVICES AND ELECTRONIC DEVICE TRANS...

VERIFYING COMPONENTS FOR PLACEMENT

APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

SUBSTRATE SEPARATION APPARATUS AND METHOD