characterised by a coating or a hardness or a material

Industry

CPC
H01L21/68757

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68757characterised by a coating or a hardness or a material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate supporting plate, thin film deposition apparatus includin...
- Patent number 11,965,262
- Issue date Apr 23, 2024
- ASM IP Holding B.V.
- Yong Min Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support for chucking of mask for deposition processes
- Patent number 11,967,516
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Jrjyan Jerry Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate holding apparatus and substrate processing apparatus
- Patent number 11,961,757
- Issue date Apr 16, 2024
- SCREEN Holdings Co., Ltd.
- Ryo Muramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support for reduced damage substrate backside
- Patent number 11,955,362
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Joel M Huston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with high insulation performance and electrosta...
- Patent number 11,951,583
- Issue date Apr 9, 2024
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic chuck and processing apparatus
- Patent number 11,955,360
- Issue date Apr 9, 2024
- Tocalo Co., Ltd.
- Takeshi Takabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding fixture
- Patent number 11,955,363
- Issue date Apr 9, 2024
- Rockley Photonics Limited
- Moshe Amit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with mesas
- Patent number 11,955,361
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor manufacturing apparatus member
- Patent number 11,939,678
- Issue date Mar 26, 2024
- Toto Ltd.
- Yasutaka Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for conditioning a processing reactor
- Patent number 11,926,892
- Issue date Mar 12, 2024
- GlobalWafers Co., Ltd.
- Gang Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-zone semiconductor substrate supports
- Patent number 11,915,950
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Mehmet Tugrul Samir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone pedestal heater having a routing layer
- Patent number 11,895,741
- Issue date Feb 6, 2024
- Watlow Electric Manufacturing Company
- Kevin Ptasienski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lithographic apparatus, substrate table, and non-uniform coating me...
- Patent number 11,887,881
- Issue date Jan 30, 2024
- ASML Holding N.V.
- Bruce Tirri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate retaining apparatus, system including the apparatus, and...
- Patent number 11,885,023
- Issue date Jan 30, 2024
- ASM IP Holding B.V.
- Shiva K. T. Rajavelu Muralidhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heterogeneous composite material and method for producing the same
- Patent number 11,887,883
- Issue date Jan 30, 2024
- Semes Co., Ltd.
- Do Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-irradiation thermal treatment apparatus
- Patent number 11,881,420
- Issue date Jan 23, 2024
- SCREEN Holdings Co., Ltd.
- Takahiro Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with metal bond
- Patent number 11,881,423
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a wear-resistant material on a body, and compo...
- Patent number 11,874,607
- Issue date Jan 16, 2024
- ASML Netherlands B.V.
- Andrey Nikipelov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and substrate fixing device
- Patent number 11,862,501
- Issue date Jan 2, 2024
- Shinko Electric Industries Co., Ltd.
- Norio Shiraiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatus and method utilizing electrostat...
- Patent number 11,854,860
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck, method for producing the same, and exposure apparatus
- Patent number 11,842,918
- Issue date Dec 12, 2023
- Canon Kabushiki Kaisha
- Keiji Hirabayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck device and production method for electrostatic...
- Patent number 11,837,489
- Issue date Dec 5, 2023
- Sumitomo Osaka Cement Co., Ltd.
- Hironori Kugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and manufacturing method therefor
- Patent number 11,823,940
- Issue date Nov 21, 2023
- Applied Matierals, Inc.
- Saeng Hyun Cho
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Multi zone spot heating in EPI
- Patent number 11,821,088
- Issue date Nov 21, 2023
- Applied Materials, Inc.
- Shu-Kwan Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for holding and releasing a substrate
- Patent number 11,814,721
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Simon Lau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nanosecond pulser ADC system
- Patent number 11,810,761
- Issue date Nov 7, 2023
- Eagle Harbor Technologies, Inc.
- Ilia Slobodov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of aluminum process chamber components
- Patent number 11,810,766
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Karthikeyan Balaraman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contour pocket and hybrid susceptor for wafer uniformity
- Patent number 11,810,810
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Kaushal Gangakhedkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,804,400
- Issue date Oct 31, 2023
- Tokyo Electron Limited
- Mitsuaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of e chuck to aluminum base configuration
- Patent number 11,794,441
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Vijay D. Parkhe
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...
- Publication number 20240133035
- Publication date Apr 25, 2024
- ASM IP HOLDING B.V.
- SHIVA K.T. RAJAVELU MURALIDHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSECOND PULSER ADC SYSTEM
- Publication number 20240136152
- Publication date Apr 25, 2024
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240136219
- Publication date Apr 25, 2024
- NGK Insulators, Ltd.
- Tatsuya KUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER
- Publication number 20240096686
- Publication date Mar 21, 2024
- Hon Young Semiconductor Corporation
- Chia-Jen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...
- Publication number 20240087945
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240079218
- Publication date Mar 7, 2024
- NGK Insulators, Ltd.
- Tatsuya KUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20240071800
- Publication date Feb 29, 2024
- Shinko Electric Industries Co., Ltd.
- Yasuhiko Kusama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK, METHOD FOR PRODUCING THE SAME, AND EXPOSURE APPARATUS
- Publication number 20240071807
- Publication date Feb 29, 2024
- Canon Kabushiki Kaisha
- Keiji Hirabayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND SYSTEMS FOR DRY ETCHING
- Publication number 20240071803
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Fu-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR HEATING WAFER
- Publication number 20240071806
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jeongdu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK APPARATUS WITH AIR MEMBER AND METHOD OF FABRICATING A S...
- Publication number 20240063044
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dong Hoon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF
- Publication number 20240063050
- Publication date Feb 22, 2024
- Hong Chuang Applied Technology Co., Ltd
- YAN-KAI ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING PARTS USING SOLID-STATE ADDITIVE MANUFACTURING
- Publication number 20240062997
- Publication date Feb 22, 2024
- Lam Research Corporaton
- Pankaj Jyoti Hazarika
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI ZONE SPOT HEATING IN EPI
- Publication number 20240044004
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Shu-Kwan LAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
- Publication number 20240030057
- Publication date Jan 25, 2024
- SEMES CO., LTD.
- Youngjun SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT SUSCEPTOR WITH GRID PATTERN AND VENTING GROOVES ON SURFACE THE...
- Publication number 20240014065
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240006194
- Publication date Jan 4, 2024
- NGK Insulators, Ltd.
- Mitsuru KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20230420279
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20230411199
- Publication date Dec 21, 2023
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING ARRANGEMENT FOR HOLDING A SUBSTRATE, CARRIER FOR SUPPORTING...
- Publication number 20230392252
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Simon LAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORTING PLATE, APPARATUS INCLUDING THE SUBSTRATE SUPPO...
- Publication number 20230392278
- Publication date Dec 7, 2023
- ASM IP HOLDING B.V.
- SungBae Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM SHEET BOND FIXTURING AND FLEXIBLE BURL APPLICATIONS FOR SUBS...
- Publication number 20230384694
- Publication date Nov 30, 2023
- ASML NETHERLANDS B.V.
- Abdullah ALIKHAN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS OF MAKING HEATING BLOCKS, HEATING BLOCKS, AND SEMICONDUCTOR...
- Publication number 20230389134
- Publication date Nov 30, 2023
- ASM IP HOLDING B.V.
- ChangMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HANDLING DEVICE AND PROCESSING CHAMBER
- Publication number 20230364802
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS FOR PROCESSING A WAFER
- Publication number 20230360952
- Publication date Nov 9, 2023
- LAM RESEARCH AG
- Michael BRUGGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR
- Publication number 20230349045
- Publication date Nov 2, 2023
- NIPPON TECHNO-CARBON CO., LTD.
- Shuichi Okubo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER CERAMIC PLATE DEVICE
- Publication number 20230347436
- Publication date Nov 2, 2023
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Michael PARKER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20230317430
- Publication date Oct 5, 2023
- NGK Insulators, Ltd.
- Ikuhisa MORIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE, ELECTROSTATIC CHUCK, SUBSTRATE FIXING DEVICE, AN...
- Publication number 20230307282
- Publication date Sep 28, 2023
- Shinko Electric Industries Co., Ltd.
- Akira Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL UNIFORMITY CONTROL IN REMOTE PLASMA FILM DEPOSITION
- Publication number 20230304156
- Publication date Sep 28, 2023
- LAM RESEARCH CORPORATION
- Geoffrey HOHN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

characterised by a coating or a hardness or a material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate supporting plate, thin film deposition apparatus includin...

Substrate support for chucking of mask for deposition processes

Substrate holding apparatus and substrate processing apparatus

Substrate support for reduced damage substrate backside

Electrostatic chuck with high insulation performance and electrosta...

Electrostatic chuck and processing apparatus

Bonding fixture

Electrostatic chuck with mesas

Method of making a semiconductor manufacturing apparatus member

Methods for conditioning a processing reactor

Multi-zone semiconductor substrate supports

Multi-zone pedestal heater having a routing layer

Lithographic apparatus, substrate table, and non-uniform coating me...

Substrate retaining apparatus, system including the apparatus, and...

Heterogeneous composite material and method for producing the same

Light-irradiation thermal treatment apparatus

Electrostatic chuck with metal bond

Method for providing a wear-resistant material on a body, and compo...

Electrostatic chuck and substrate fixing device

Semiconductor processing apparatus and method utilizing electrostat...

Wafer chuck, method for producing the same, and exposure apparatus

Electrostatic chuck device and production method for electrostatic...

Electrostatic chuck and manufacturing method therefor

Multi zone spot heating in EPI

Method for holding and releasing a substrate

Nanosecond pulser ADC system

Protection of aluminum process chamber components

Contour pocket and hybrid susceptor for wafer uniformity

Substrate processing apparatus

Bonding structure of e chuck to aluminum base configuration

Patents Applicationslast 30 patents

SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...

NANOSECOND PULSER ADC SYSTEM

WAFER PLACEMENT TABLE

FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...

WAFER PLACEMENT TABLE

SUBSTRATE FIXING DEVICE

WAFER CHUCK, METHOD FOR PRODUCING THE SAME, AND EXPOSURE APPARATUS

METHODS AND SYSTEMS FOR DRY ETCHING

APPARATUS FOR HEATING WAFER

WAFER CHUCK APPARATUS WITH AIR MEMBER AND METHOD OF FABRICATING A S...

CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF

PROCESSING PARTS USING SOLID-STATE ADDITIVE MANUFACTURING

MULTI ZONE SPOT HEATING IN EPI

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

FLAT SUSCEPTOR WITH GRID PATTERN AND VENTING GROOVES ON SURFACE THE...

MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

SUBSTRATE FIXING DEVICE

HOLDING ARRANGEMENT FOR HOLDING A SUBSTRATE, CARRIER FOR SUPPORTING...

SUBSTRATE SUPPORTING PLATE, APPARATUS INCLUDING THE SUBSTRATE SUPPO...

VACUUM SHEET BOND FIXTURING AND FLEXIBLE BURL APPLICATIONS FOR SUBS...

METHODS OF MAKING HEATING BLOCKS, HEATING BLOCKS, AND SEMICONDUCTOR...

SUBSTRATE HANDLING DEVICE AND PROCESSING CHAMBER

APPARATUS FOR PROCESSING A WAFER

SUSCEPTOR

MULTI-LAYER CERAMIC PLATE DEVICE

WAFER PLACEMENT TABLE

CERAMIC SUBSTRATE, ELECTROSTATIC CHUCK, SUBSTRATE FIXING DEVICE, AN...

WAFER LEVEL UNIFORMITY CONTROL IN REMOTE PLASMA FILM DEPOSITION