characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis

Industry

CPC
H01L21/68764

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68764characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for treating substrate
- Patent number 11,972,939
- Issue date Apr 30, 2024
- Semes Co., Ltd.
- Ohyeol Kwon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus having exhaust gas decomposer, and e...
- Patent number 11,970,770
- Issue date Apr 30, 2024
- Jusung Engineering Co., Ltd.
- Dong Won Seo
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Wafer processing system, semiconductor-machine automatic leveling a...
- Patent number 11,972,967
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xueyu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of analyzing semiconductor structure
- Patent number 11,959,958
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet bench structure
- Patent number 11,961,745
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding apparatus and substrate processing apparatus
- Patent number 11,961,757
- Issue date Apr 16, 2024
- SCREEN Holdings Co., Ltd.
- Ryo Muramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing substrate and method of transferring subst...
- Patent number 11,961,758
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Takehiro Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated inspection tool
- Patent number 11,961,770
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Han Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for coating photo resist over a substrate
- Patent number 11,955,335
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Hung Feng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Substrate processing apparatus
- Patent number 11,955,352
- Issue date Apr 9, 2024
- Tokyo Electron Limited
- Hiroki Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation apparatus
- Patent number 11,955,367
- Issue date Apr 9, 2024
- SHIBAURA MECHATRONICS CORPORATION
- Shohei Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus and polishing apparatus
- Patent number 11,948,811
- Issue date Apr 2, 2024
- Ebara Corporation
- Mitsuru Miyazaki
- B08 - CLEANING
Information Patent Grant
Transfer apparatus
- Patent number 11,948,816
- Issue date Apr 2, 2024
- Tokyo Electron Limited
- Masahiro Dogome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad carrier for horizontal pre-clean module
- Patent number 11,942,319
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Edward Golubovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,935,736
- Issue date Mar 19, 2024
- Tokyo Electron Limited
- Rintaro Higuchi
- B08 - CLEANING
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate processing apparatus, substrate processing method and non...
- Patent number 11,926,893
- Issue date Mar 12, 2024
- Kokusai Electric Corporation
- Naofumi Ohashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor wafer cassette roller type transportation structure s...
- Patent number 11,929,275
- Issue date Mar 12, 2024
- EDDIE AND SONS TECHNOLOGY CO., LTD
- James Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate heating unit, substrate processing apparatus, and substra...
- Patent number 11,923,213
- Issue date Mar 5, 2024
- Semes Co., Ltd.
- Tae Shin Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Development processing apparatus and development processing method
- Patent number 11,923,218
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Kouichirou Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,923,209
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Hyunwoong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,915,944
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Suguen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,915,965
- Issue date Feb 27, 2024
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,911,808
- Issue date Feb 27, 2024
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Self-assembled monolayers as sacrificial capping layers
- Patent number 11,915,973
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Ainhoa Romo Negreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP wafer cleaning equipment, wafer transfer robot and wafer flippi...
- Patent number 11,908,720
- Issue date Feb 20, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B08 - CLEANING
Information Patent Grant
In-situ metrology and process control
- Patent number 11,908,718
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Ramesh Krishnamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for controlling profile of critical dimension
- Patent number 11,908,754
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method, plasma processing apparatus, and control...
- Patent number 11,901,158
- Issue date Feb 13, 2024
- Tokyo Electron Limited
- Takeshi Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for post exposure processing of photoresist wa...
- Patent number 11,899,366
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Viachslav Babayan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20240128109
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Ji Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetically Opposed, Iron Core Linear Motor Based Motion Stages Fo...
- Publication number 20240120235
- Publication date Apr 11, 2024
- KLA Corporation
- Michel Pharand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
- Publication number 20240112902
- Publication date Apr 4, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING DEVICE
- Publication number 20240112929
- Publication date Apr 4, 2024
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20240105483
- Publication date Mar 28, 2024
- SCREEN Holdings Co., Ltd.
- Ichiro MITSUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING APPARATUS
- Publication number 20240105496
- Publication date Mar 28, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE
- Publication number 20240105497
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION
- Publication number 20240096688
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Michael Robert Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240096653
- Publication date Mar 21, 2024
- SHIBAURA MECHATRONICS CORPORATION
- Kensuke DEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
- Publication number 20240096652
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Mana TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING
- Publication number 20240096687
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Harish V PENMETHSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ROTATING APPARATUS
- Publication number 20240093358
- Publication date Mar 21, 2024
- SANTEC CORPORATION
- Noboru UEHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240096654
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Fumihiro KAMIMURA
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION
- Publication number 20240087915
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF CLEANING, METHOD OF MANUF...
- Publication number 20240087946
- Publication date Mar 14, 2024
- Kokusai Electric Corporation
- Yoshitomo HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED SELECTIVE AIR LAYER TRANSFER PRINTING DEVICE
- Publication number 20240079516
- Publication date Mar 7, 2024
- HARDRAM CO., LTD.
- Sung Wook MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240068101
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Yasushi TAKEUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240060181
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Manabu HONMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORT UNIT, AND APPARATUS AND METHOD FOR DEPOSITING A L...
- Publication number 20240063051
- Publication date Feb 22, 2024
- Evatec AG
- Florian Hagmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...
- Publication number 20240050992
- Publication date Feb 15, 2024
- EBARA CORPORATION
- Masaya SEKI
- B08 - CLEANING
Information Patent Application
METHOD OF POLISHING CARRIER PLATE, CARRIER PLATE, AND METHOD OF POL...
- Publication number 20240055262
- Publication date Feb 15, 2024
- SUMCO CORPORATION
- Shunsuke MIKURIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
- Publication number 20240047244
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Koki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
- Publication number 20240047237
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Koki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI ZONE SPOT HEATING IN EPI
- Publication number 20240044004
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Shu-Kwan LAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS MIXTURE INCLUDING HYDROGEN FLUORIDE, ALCOHOL AND AN ADDITIVE FO...
- Publication number 20240038526
- Publication date Feb 1, 2024
- LAM RESEARCH AG
- Ji ZHU
- B08 - CLEANING
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240038573
- Publication date Feb 1, 2024
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20240038576
- Publication date Feb 1, 2024
- Kokusai Electric Corporation
- Daigi KAMIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240021445
- Publication date Jan 18, 2024
- TOKYO ELECTRON LIMITED
- Hiroki SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, AND DEVI...
- Publication number 20240021463
- Publication date Jan 18, 2024
- Sumitomo Heavy Industries, Ltd.
- Tatsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS

characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for treating substrate

Substrate processing apparatus having exhaust gas decomposer, and e...

Wafer processing system, semiconductor-machine automatic leveling a...

Method of analyzing semiconductor structure

Wet bench structure

Substrate holding apparatus and substrate processing apparatus

Apparatus for processing substrate and method of transferring subst...

Automated inspection tool

Method and apparatus for coating photo resist over a substrate

Substrate processing apparatus

Film formation apparatus

Cleaning apparatus and polishing apparatus

Transfer apparatus

Pad carrier for horizontal pre-clean module

Substrate processing method and substrate processing apparatus

Electroplating apparatus and electroplating method

Substrate processing apparatus, substrate processing method and non...

Semiconductor wafer cassette roller type transportation structure s...

Substrate heating unit, substrate processing apparatus, and substra...

Development processing apparatus and development processing method

Substrate processing apparatus and substrate processing method

Substrate processing apparatus and substrate processing method

Wafer processing method

System for cleaning semiconductor wafers

Self-assembled monolayers as sacrificial capping layers

CMP wafer cleaning equipment, wafer transfer robot and wafer flippi...

In-situ metrology and process control

Method and system for controlling profile of critical dimension

Plasma processing method, plasma processing apparatus, and control...

Method and apparatus for post exposure processing of photoresist wa...

Patents Applicationslast 30 patents

APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MAN...

Magnetically Opposed, Iron Core Linear Motor Based Motion Stages Fo...

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

PROCESSING DEVICE

SUBSTRATE TREATING APPARATUS

SUBSTRATE SUPPORTING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE

POLISHING APPARATUS

SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION

SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING

SUBSTRATE ROTATING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION

SUBSTRATE PROCESSING APPARATUS, METHOD OF CLEANING, METHOD OF MANUF...

MICRO LED SELECTIVE AIR LAYER TRANSFER PRINTING DEVICE

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE SUPPORT UNIT, AND APPARATUS AND METHOD FOR DEPOSITING A L...

PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...

METHOD OF POLISHING CARRIER PLATE, CARRIER PLATE, AND METHOD OF POL...

LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD

LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD

MULTI ZONE SPOT HEATING IN EPI

GAS MIXTURE INCLUDING HYDROGEN FLUORIDE, ALCOHOL AND AN ADDITIVE FO...

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

STAGE APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, AND DEVI...