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characterised by shock absorbing elements

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  • H01L21/67369
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/67369characterised by shock absorbing elements
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
    • Publication number 20240420978
    • Publication date Dec 19, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jeng-Chi LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROSTATIC SUBSTRATE SUPPORT
    • Publication number 20240420984
    • Publication date Dec 19, 2024
    • Applied Materials, Inc.
    • Andrew Nguyen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROTECTION DEVICE FOR SUBSTRATE CONTAINER
    • Publication number 20240371670
    • Publication date Nov 7, 2024
    • GUDENG PRECISION INDUSTRIAL CO., LTD.
    • MING-CHIEN CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LATCHING GUIDE STRUCTURE
    • Publication number 20240105481
    • Publication date Mar 28, 2024
    • GUDENG PRECISION INDUSTRIAL CO., LTD.
    • MING-CHIEN CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DIE CARRIER STRUCTURE
    • Publication number 20240087932
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tzu-Chung TSAI
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    PROTECTIVE PACKAGE ASSEMBLY
    • Publication number 20240006211
    • Publication date Jan 4, 2024
    • GUDENG PRECISION INDUSTRIAL CO., LTD.
    • Ming-Chien CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILTER MODULE
    • Publication number 20230411192
    • Publication date Dec 21, 2023
    • Entegris, Inc.
    • Matthew A. Fuller
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER CONTAINER AND SIZE ADAPTION SYSTEM THEREFOR
    • Publication number 20230360941
    • Publication date Nov 9, 2023
    • ENTEGRIS, INC.
    • Mohamad Zakaria Abd Mutholib
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER STORAGE CONTAINER AND CAP ASSEMBLY USED THEREFOR
    • Publication number 20230317484
    • Publication date Oct 5, 2023
    • 3S KOREA CO., LTD
    • Sang Jin KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONTAINER FOR TRANSPORTING SEMICONDUCTOR WAFER
    • Publication number 20230317485
    • Publication date Oct 5, 2023
    • Achilles Corporation
    • Kenichi Hirose
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SINGULATED DIE SHIPPING TRAY ASSEMBLY
    • Publication number 20230290661
    • Publication date Sep 14, 2023
    • Intel Corporation
    • Kyle ARRINGTON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CASSETTE HOLD DOWN
    • Publication number 20230260812
    • Publication date Aug 17, 2023
    • Entegris, Inc.
    • Sin Ghun Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE STORAGE CONTAINER
    • Publication number 20230197488
    • Publication date Jun 22, 2023
    • MIRAIAL CO., LTD.
    • Kouji KUBOTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RETICLE POD HAVING SIDE CONTAINMENT OF RETICLE
    • Publication number 20230187246
    • Publication date Jun 15, 2023
    • Entegris, Inc.
    • Russ V. Raschke
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER TRANSPORT BOX
    • Publication number 20230072884
    • Publication date Mar 9, 2023
    • 3S KOREA CO., LTD
    • Sang Jin KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RETICLE POD HAVING RETENTION THROUGH RETICLE COMPARTMENT WALL
    • Publication number 20230038768
    • Publication date Feb 9, 2023
    • Entegris, Inc.
    • Russ V. Raschke
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RETICLE POD HAVING RETENTION THROUGH BASEPLATE
    • Publication number 20230014864
    • Publication date Jan 19, 2023
    • Entegris, Inc.
    • Russ V. RASCHKE
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    COIN-SLOT AND BALL-LOCK CERAMIC LIFT PIN HOLDERS
    • Publication number 20220406645
    • Publication date Dec 22, 2022
    • LAM RESEARCH CORPORATION
    • Aleksey V. ALTECOR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Manufacturing Device to Securely Hold Reconstituted P...
    • Publication number 20220392795
    • Publication date Dec 8, 2022
    • STATS ChipPAC Pte Ltd.
    • Hyeonchul Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Substrate Storage Container
    • Publication number 20220277977
    • Publication date Sep 1, 2022
    • Shin-Etsu Polymer Co., Ltd.
    • Sou Kanai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE CONTAINER SYSTEM
    • Publication number 20220100080
    • Publication date Mar 31, 2022
    • GUDENG PRECISION INDUSTRIAL CO., LTD
    • MING-CHIEN CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RETICLE POD HAVING ANTI-COLLISION GAP STRUCTURE
    • Publication number 20220102178
    • Publication date Mar 31, 2022
    • GUDENG PRECISION INDUSTRIAL CO., LTD.
    • MING-CHIEN CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR CONTAINING A RETICLE IN A POD
    • Publication number 20210351054
    • Publication date Nov 11, 2021
    • GUDENG PRECISION INDUSTRIAL CO., LTD
    • MING-CHIEN CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DIE CARRIER STRUCTURE
    • Publication number 20210217642
    • Publication date Jul 15, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tzu-Chung TSAI
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    STRUCTURE AND METHOD OF RETICLE POD HAVING INSPECTION WINDOW
    • Publication number 20210202287
    • Publication date Jul 1, 2021
    • Taiwan Semiconductor Manufacturing company Ltd.
    • WANG CHENG SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR WAFER CONTAINER
    • Publication number 20210118712
    • Publication date Apr 22, 2021
    • Achilles Corporation
    • Masayuki NISHIJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RETICLE POD HAVING SIDE CONTAINMENT OF RETICLE
    • Publication number 20210057248
    • Publication date Feb 25, 2021
    • Entegris, Inc.
    • Russ V. RASCHKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER CUSHION
    • Publication number 20210020482
    • Publication date Jan 21, 2021
    • Entegris, Inc.
    • Colton J. HARR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE STORAGE CONTAINER
    • Publication number 20200286761
    • Publication date Sep 10, 2020
    • Shin-Etsu Polymer Co., Ltd.
    • Kazumasa ONUKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE STORING CONTAINER
    • Publication number 20200286759
    • Publication date Sep 10, 2020
    • Chiaki MATSUTORI
    • H01 - BASIC ELECTRIC ELEMENTS