characterised by supporting more than one semiconductor substrate

Industry

CPC
H01L21/68771

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68771characterised by supporting more than one semiconductor substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and methods to transfer substrates into and out of a spat...
- Patent number 12,183,618
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Sanjeev Baluja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for processing substrate
- Patent number 12,170,221
- Issue date Dec 17, 2024
- Jusung Engineering Co., Ltd.
- Won Woo Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,142,515
- Issue date Nov 12, 2024
- Jusung Engineering Co., Ltd.
- DongHyuk Oh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Floating pin, wafer carrying device and depositing apparatus
- Patent number 12,119,257
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chaoqun Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing system, load port and method
- Patent number 12,112,961
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuang Li
- G01 - MEASURING TESTING
Information Patent Grant
Susceptor arrangement of a CVD reactor
- Patent number 12,110,591
- Issue date Oct 8, 2024
- Aixtron SE
- Francisco Ruda Y Witt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,054,828
- Issue date Aug 6, 2024
- Tokyo Electron Limited
- Kohei Fukushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,051,566
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Hitoshi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cooling system
- Patent number 12,033,873
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Otto Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,027,380
- Issue date Jul 2, 2024
- TOSHIBA MEMORY CORPORATION
- Tomohiko Sugita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Movable work piece carrier device for holding work pieces to be tre...
- Patent number 12,024,769
- Issue date Jul 2, 2024
- OERLIKON SURFACE SOLUTIONS AG, PFAFFIKON
- Jürgen Gwehenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining and controlling substrate temperature during substrate...
- Patent number 12,020,960
- Issue date Jun 25, 2024
- Lam Research Corporation
- Jeremy George Smith
- G05 - CONTROLLING REGULATING
Information Patent Grant
Apparatus and methods for motor shaft and heater leveling
- Patent number 12,018,376
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Ashutosh Agarwal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heater assembly with process gap control for batch processing chambers
- Patent number 12,020,957
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Akshay Gunaji
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Apparatus for manufacturing a thin film and a method therefor
- Patent number 12,014,922
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsai-Fu Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of, and an apparatus for, rinsing materialographic samples
- Patent number 11,998,956
- Issue date Jun 4, 2024
- STRUERS APS
- Thomas Matschofsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for environmental control of dies and substrates for hybr...
- Patent number 12,001,193
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- Ying Wang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Substrate processing apparatus having exhaust gas decomposer, and e...
- Patent number 11,970,770
- Issue date Apr 30, 2024
- Jusung Engineering Co., Ltd.
- Dong Won Seo
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Substrate processing apparatus, substrate retainer and method of ma...
- Patent number 11,961,715
- Issue date Apr 16, 2024
- Kokusai Electric Corporation
- Daisuke Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming silicon nitride films using microwave plasma
- Patent number 11,955,331
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, substrate processing method and non...
- Patent number 11,926,893
- Issue date Mar 12, 2024
- Kokusai Electric Corporation
- Naofumi Ohashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ metrology and process control
- Patent number 11,908,718
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Ramesh Krishnamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wafer processing environments with spatial separation
- Patent number 11,894,257
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Michael Rice
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition apparatus
- Patent number 11,869,798
- Issue date Jan 9, 2024
- Tokyo Electron Limited
- Manabu Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for manufacturing display device and method for manufactu...
- Patent number 11,862,500
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Jae Won Shim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PECVD deposition system for deposition on selective side of the sub...
- Patent number 11,851,760
- Issue date Dec 26, 2023
- Lam Research Corporation
- Fayaz Shaikh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,856,655
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Hirofumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking apparatus and stacking method
- Patent number 11,823,935
- Issue date Nov 21, 2023
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of wafer bow in multiple stations
- Patent number 11,823,928
- Issue date Nov 21, 2023
- Lam Research Corporation
- Edward Augustyniak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICLE FURNACE FOR PROCESSING A PLURALITY OF SUBSTRATES AND METHO...
- Publication number 20240420971
- Publication date Dec 19, 2024
- ASM IP HOLDING B.V.
- Subir Parui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240413001
- Publication date Dec 12, 2024
- SCREEN Holdings Co., Ltd.
- Shinichi TANIGUCHI
- B08 - CLEANING
Information Patent Application
IN-LIQUID POSTURE TURNING APPARATUS AND SUBSTRATE PROCESSING APPARA...
- Publication number 20240413002
- Publication date Dec 12, 2024
- SCREEN Holdings Co., Ltd.
- Shinichi TANIGUCHI
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM, LOAD DEVICE AND METHOD
- Publication number 20240387213
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER BORE HOLE PLUG
- Publication number 20240387236
- Publication date Nov 21, 2024
- SCHUNK XYCARB TECHNOLOGY B.V.
- Moritz WIPPERLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Mode Silicon Carbide Epitaxial Reactor
- Publication number 20240360589
- Publication date Oct 31, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Cooling System
- Publication number 20240332044
- Publication date Oct 3, 2024
- Taiwan Semconductor Manufacturing Company, Ltd.
- Otto CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATIONAL INDEXER WITH WAFER EDGE GRIP
- Publication number 20240332054
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Eric Bramwell Britcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER
- Publication number 20240321604
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE
- Publication number 20240312803
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Shusaku MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20240312802
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Yosuke MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUB...
- Publication number 20240309507
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Fayaz Shaikh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS
- Publication number 20240304470
- Publication date Sep 12, 2024
- Applied Materials, Inc.
- Akshay Gunaji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND CONTROL POSITION SETTING METHOD
- Publication number 20240297061
- Publication date Sep 5, 2024
- TOKYO ELECTRON LIMITED
- Ryoya TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISION-BASED WAFER PRE-ALIGNMENT PLATFORM AND ALIGNMENT METHOD
- Publication number 20240289985
- Publication date Aug 29, 2024
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...
- Publication number 20240249960
- Publication date Jul 25, 2024
- Kokusai Electric Corporation
- Kazuya NABETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATIONAL INDEXERS WITH WAFER CENTERING CAPABILITY
- Publication number 20240213070
- Publication date Jun 27, 2024
- LAM RESEARCH CORPORATION
- Brian Lewis Ratliff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CARRIER ASSEMBLY WITH IMPROVED TEMPERATURE UNIFORMITY
- Publication number 20240102166
- Publication date Mar 28, 2024
- VEECO INSTRUMENTS INC.
- Aniruddha Bagchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20240105483
- Publication date Mar 28, 2024
- SCREEN Holdings Co., Ltd.
- Ichiro MITSUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION
- Publication number 20240096688
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Michael Robert Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240060181
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Manabu HONMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORT UNIT, AND APPARATUS AND METHOD FOR DEPOSITING A L...
- Publication number 20240063051
- Publication date Feb 22, 2024
- Evatec AG
- Florian Hagmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROL OF WAFER BOW IN MULTIPLE STATIONS
- Publication number 20240055285
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Edward Augustyniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY
- Publication number 20230420289
- Publication date Dec 28, 2023
- LAM RESEARCH CORPORATION
- Karl Frederick Leeser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION METHOD AND DEPOSITION APPARATUS
- Publication number 20230407466
- Publication date Dec 21, 2023
- TOKYO ELECTRON LIMITED
- Muneyuki OTANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER
- Publication number 20230395410
- Publication date Dec 7, 2023
- LAM RESEARCH CORPORATION
- Jacob L. Hiester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
- Publication number 20230383399
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yi SHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS CURTAIN DEVICE AND GAS PERMEABLE ASSEMBLY
- Publication number 20230343584
- Publication date Oct 26, 2023
- Brillian Network & Automation Integrated System Co., Ltd.
- Sheng-Chi HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230343647
- Publication date Oct 26, 2023
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CVD REACTOR WITH TEMPERATURE-CONTROLLABLE GAS INLET REGION
- Publication number 20230332292
- Publication date Oct 19, 2023
- AIXTRON SE
- Philip HENS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

characterised by supporting more than one semiconductor substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vision-based wafer pre-alignment platform and alignment method

Apparatus and methods to transfer substrates into and out of a spat...

Apparatus for processing substrate

Substrate processing apparatus

Floating pin, wafer carrying device and depositing apparatus

Substrate processing system, load port and method

Susceptor arrangement of a CVD reactor

Substrate processing method and substrate processing apparatus

Plasma processing apparatus

Wafer cooling system

Semiconductor manufacturing apparatus and method of manufacturing s...

Movable work piece carrier device for holding work pieces to be tre...

Determining and controlling substrate temperature during substrate...

Apparatus and methods for motor shaft and heater leveling

Heater assembly with process gap control for batch processing chambers

Apparatus for manufacturing a thin film and a method therefor

Method of, and an apparatus for, rinsing materialographic samples

Apparatus for environmental control of dies and substrates for hybr...

Substrate processing apparatus having exhaust gas decomposer, and e...

Substrate processing apparatus, substrate retainer and method of ma...

Method of forming silicon nitride films using microwave plasma

Substrate processing apparatus, substrate processing method and non...

In-situ metrology and process control

Single wafer processing environments with spatial separation

Deposition apparatus

Apparatus for manufacturing display device and method for manufactu...

PECVD deposition system for deposition on selective side of the sub...

Substrate processing apparatus and substrate processing method

Stacking apparatus and stacking method

Control of wafer bow in multiple stations

Patents Applicationslast 30 patents

VERTICLE FURNACE FOR PROCESSING A PLURALITY OF SUBSTRATES AND METHO...

SUBSTRATE PROCESSING APPARATUS

IN-LIQUID POSTURE TURNING APPARATUS AND SUBSTRATE PROCESSING APPARA...

SUBSTRATE PROCESSING SYSTEM, LOAD DEVICE AND METHOD

SUBSTRATE CARRIER BORE HOLE PLUG

Batch Mode Silicon Carbide Epitaxial Reactor

Wafer Cooling System

ROTATIONAL INDEXER WITH WAFER EDGE GRIP

SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER

SUBSTRATE PROCESSING DEVICE

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...

PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUB...

HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS

SUBSTRATE PROCESSING APPARATUS AND CONTROL POSITION SETTING METHOD

VISION-BASED WAFER PRE-ALIGNMENT PLATFORM AND ALIGNMENT METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...

ROTATIONAL INDEXERS WITH WAFER CENTERING CAPABILITY

WAFER CARRIER ASSEMBLY WITH IMPROVED TEMPERATURE UNIFORMITY

SUBSTRATE TREATING APPARATUS

SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE SUPPORT UNIT, AND APPARATUS AND METHOD FOR DEPOSITING A L...

CONTROL OF WAFER BOW IN MULTIPLE STATIONS

MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY

DEPOSITION METHOD AND DEPOSITION APPARATUS

AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER

STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

GAS CURTAIN DEVICE AND GAS PERMEABLE ASSEMBLY

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

CVD REACTOR WITH TEMPERATURE-CONTROLLABLE GAS INLET REGION