characterised by supporting substrates others than wafers

Industry

CPC
H01L21/68778

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68778characterised by supporting substrates others than wafers

Industries

Patents Grantslast 30 patents

Information Patent Grant
System and method for performing spin dry etching
- Patent number 11,854,861
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate chuck for self-assembling semiconductor light emitting di...
- Patent number 11,794,310
- Issue date Oct 24, 2023
- LG Electronics Inc.
- Inbum Yang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus for plasma dicing
- Patent number 11,769,675
- Issue date Sep 26, 2023
- Gautham Ragunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display apparatus
- Patent number 11,647,664
- Issue date May 9, 2023
- Samsung Display Co., Ltd.
- Daehum Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display apparatus
- Patent number 11,618,940
- Issue date Apr 4, 2023
- Samsung Display Co., Ltd.
- Kyubum Kim
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of manufacturing display apparatus
- Patent number 11,597,994
- Issue date Mar 7, 2023
- Samsung Display Co., Ltd.
- Kyubum Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,565,351
- Issue date Jan 31, 2023
- Samsung Display Co., Ltd.
- Toshinaru Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier system, exposure apparatus, carrier method, exposure method...
- Patent number 11,511,438
- Issue date Nov 29, 2022
- Nikon Corporation
- Hideaki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subring for semiconductor dies
- Patent number 11,482,442
- Issue date Oct 25, 2022
- Texas Instruments Incorporated
- Matthew John Sherbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support for flexible workpieces
- Patent number 11,311,982
- Issue date Apr 26, 2022
- ASM ASSEMBLY SYSTEMS SINGAPORE PTE LTD
- Neil Short
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Carrier system, exposure apparatus, carrier method, exposure method...
- Patent number 11,097,426
- Issue date Aug 24, 2021
- Nikon Corporation
- Hideaki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer device and chip transferring method using the same
- Patent number 11,004,705
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Doyoung Kwag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method including applying a polyolefin sheet to a...
- Patent number 10,991,624
- Issue date Apr 27, 2021
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device
- Patent number 10,910,254
- Issue date Feb 2, 2021
- Au Optronics Corporation
- Yi-Fen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier system, exposure apparatus, carrier method, exposure method...
- Patent number 10,744,648
- Issue date Aug 18, 2020
- Nikon Corporation
- Hideaki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic structure cleaving system
- Patent number 10,672,938
- Issue date Jun 2, 2020
- SolarCity Corporation
- Pablo Gonzalez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
ScAIN etch mask for highly selective etching
- Patent number 10,651,048
- Issue date May 12, 2020
- National Technology & Engineering Solutions of Sandia, LLC
- Michael David Henry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and structures
- Patent number 10,651,050
- Issue date May 12, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation apparatus
- Patent number 10,633,736
- Issue date Apr 28, 2020
- SHIBAURA MECHATRONICS CORPORATION
- Akihiko Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
LED die dispersal in displays and light panels with preserving neig...
- Patent number 10,622,241
- Issue date Apr 14, 2020
- Chan-Long Shieh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Frame mounting after foil expansion
- Patent number 10,600,670
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Thomas Fischer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Chip transfer member, chip transfer apparatus, and chip transfer me...
- Patent number 10,566,219
- Issue date Feb 18, 2020
- TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting and transferring apparatus, method of supporti...
- Patent number 10,515,844
- Issue date Dec 24, 2019
- Samsung Electronics Co., Ltd.
- Sang-Joon Hong
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device packages and related methods
- Patent number 10,418,255
- Issue date Sep 17, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-baking device and post-baking method for forming black matrix
- Patent number 10,401,731
- Issue date Sep 3, 2019
- BOE Technology Group Co., Ltd.
- Lu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier system, exposure apparatus, carrier method, exposure method...
- Patent number 10,384,350
- Issue date Aug 20, 2019
- Nikon Corporation
- Hideaki Hara
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus for plasma dicing
- Patent number 10,283,381
- Issue date May 7, 2019
- SPTS Technologies Limited
- Gautham Ragunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 10,283,535
- Issue date May 7, 2019
- Japan Display Inc.
- Takashi Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for performing spin dry etching
- Patent number 10,276,426
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding device having robot arms for supporting and clamping substrate
- Patent number 10,269,612
- Issue date Apr 23, 2019
- BOE Technology Group Co., Ltd.
- Liwei Guan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR ENVIRONMENTAL CONTROL OF DIES AND SUBSTRATES FOR HYBR...
- Publication number 20230288916
- Publication date Sep 14, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER, APPARATUS FOR MANUFACTURING DISPLAY APPARATUS AND INCLUDIN...
- Publication number 20230193450
- Publication date Jun 22, 2023
- SAMSUNG DISPLAY CO., LTD.
- Kyubum Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...
- Publication number 20210354309
- Publication date Nov 18, 2021
- Nikon Corporation
- Hideaki HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DI...
- Publication number 20210252671
- Publication date Aug 19, 2021
- LG ELECTRONICS INC.
- Inbum YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBRING FOR SEMICONDUCTOR DIES
- Publication number 20210183683
- Publication date Jun 17, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Matthew John Sherbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...
- Publication number 20200338747
- Publication date Oct 29, 2020
- Nikon Corporation
- Hideaki HARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBRING FOR SEMICONDUCTOR DIES
- Publication number 20200075386
- Publication date Mar 5, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Matthew John Sherbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...
- Publication number 20190329420
- Publication date Oct 31, 2019
- Nikon Corporation
- Hideaki HARA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20190308276
- Publication date Oct 10, 2019
- SAMSUNG DISPLAY CO., LTD.
- TOSHINARU SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP TRANSFER DEVICE AND CHIP TRANSFERING METHOD USING THE SAME
- Publication number 20190304816
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Doyoung KWAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND STRUCTURES
- Publication number 20190273000
- Publication date Sep 5, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PLASMA DICING
- Publication number 20190259640
- Publication date Aug 22, 2019
- Gautham Ragunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFER MEMBER, CHIP TRANSFER APPARATUS, AND CHIP TRANSFER ME...
- Publication number 20190252219
- Publication date Aug 15, 2019
- TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Performing Spin Dry Etching
- Publication number 20190252237
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS
- Publication number 20190172724
- Publication date Jun 6, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER DEVICE
- Publication number 20190148213
- Publication date May 16, 2019
- AU OPTRONICS CORPORATION
- Yi-Fen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING AND TRANSFERRING APPARATUS, METHOD OF SUPPORTI...
- Publication number 20190139809
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Sang-Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING DEVICE
- Publication number 20190067073
- Publication date Feb 28, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Liwei GUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180323223
- Publication date Nov 8, 2018
- Japan Display Inc.
- Takashi SAEKI
- G02 - OPTICS
Information Patent Application
WORKPIECE HOLDING BODY AND FILM-FORMING APPARATUS
- Publication number 20180274085
- Publication date Sep 27, 2018
- ULVAC, Inc.
- YUU NAKAMUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...
- Publication number 20180257237
- Publication date Sep 13, 2018
- Nikon Corporation
- Hideaki HARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Frame mounting after foil expansion
- Publication number 20180190530
- Publication date Jul 5, 2018
- INFINEON TECHNOLOGIES AG
- Thomas FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SINGULATION ASSEMBLY
- Publication number 20180138062
- Publication date May 17, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Arnel Jose Hidlao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180019267
- Publication date Jan 18, 2018
- Japan Display Inc.
- Takashi SAEKI
- G02 - OPTICS
Information Patent Application
System and Method for Performing Spin Dry Etching
- Publication number 20170345703
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chiang Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS SYSTEM AND OPERATION METHOD THEREOF
- Publication number 20170309502
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Sang-moo PARK
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...
- Publication number 20170297203
- Publication date Oct 19, 2017
- Nikon Corporation
- Hideaki HARA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS FOR PLASMA DICING
- Publication number 20170117166
- Publication date Apr 27, 2017
- SPTS TECHNOLOGIES LIMITED
- Gautham Ragunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATE FOR...
- Publication number 20170110355
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Tsuneo NUMANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ADJUSTMENT OF A HANDLING DEVICE FOR HANDLI...
- Publication number 20170062256
- Publication date Mar 2, 2017
- ASM Technology Singapore Pte Ltd
- Yu Sze CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS

characterised by supporting substrates others than wafers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for performing spin dry etching

Substrate chuck for self-assembling semiconductor light emitting di...

Apparatus for plasma dicing

Method of manufacturing display apparatus

Method of manufacturing display apparatus

Method of manufacturing display apparatus

Substrate processing apparatus and substrate processing method

Carrier system, exposure apparatus, carrier method, exposure method...

Subring for semiconductor dies

Support for flexible workpieces

Carrier system, exposure apparatus, carrier method, exposure method...

Chip transfer device and chip transferring method using the same

Wafer processing method including applying a polyolefin sheet to a...

Transfer device

Carrier system, exposure apparatus, carrier method, exposure method...

Photovoltaic structure cleaving system

ScAIN etch mask for highly selective etching

Semiconductor device packages and structures

Film formation apparatus

LED die dispersal in displays and light panels with preserving neig...

Frame mounting after foil expansion

Chip transfer member, chip transfer apparatus, and chip transfer me...

Substrate supporting and transferring apparatus, method of supporti...

Semiconductor device packages and related methods

Post-baking device and post-baking method for forming black matrix

Carrier system, exposure apparatus, carrier method, exposure method...

Apparatus for plasma dicing

Display device and method for manufacturing the same

System and method for performing spin dry etching

Holding device having robot arms for supporting and clamping substrate

Patents Applicationslast 30 patents

APPARATUS FOR ENVIRONMENTAL CONTROL OF DIES AND SUBSTRATES FOR HYBR...

CARRIER, APPARATUS FOR MANUFACTURING DISPLAY APPARATUS AND INCLUDIN...

CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...

SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DI...

SUBRING FOR SEMICONDUCTOR DIES

CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...

SUBRING FOR SEMICONDUCTOR DIES

CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

CHIP TRANSFER DEVICE AND CHIP TRANSFERING METHOD USING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND STRUCTURES

APPARATUS FOR PLASMA DICING

CHIP TRANSFER MEMBER, CHIP TRANSFER APPARATUS, AND CHIP TRANSFER ME...

System and Method for Performing Spin Dry Etching

SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS

TRANSFER DEVICE

SUBSTRATE SUPPORTING AND TRANSFERRING APPARATUS, METHOD OF SUPPORTI...

SUBSTRATE HOLDING DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

WORKPIECE HOLDING BODY AND FILM-FORMING APPARATUS

CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...

Frame mounting after foil expansion

INTEGRATED CIRCUIT PACKAGE SINGULATION ASSEMBLY

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

System and Method for Performing Spin Dry Etching

PROCESS SYSTEM AND OPERATION METHOD THEREOF

CARRIER SYSTEM, EXPOSURE APPARATUS, CARRIER METHOD, EXPOSURE METHOD...

APPARATUS FOR PLASMA DICING

SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATE FOR...

APPARATUS AND METHOD FOR ADJUSTMENT OF A HANDLING DEVICE FOR HANDLI...