characterised by the pressure relationship between the joining step and the severing step

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Industry

CPC
B29C65/7415

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B29Plastic substance processing B29CSHAPING OR JOINING OF PLASTICS SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL AFTER-TREATMENT OF THE SHAPED PRODUCTS B29C65/00Joining or sealing of preformed parts

Current Industry

B29C65/7415characterised by the pressure relationship between the joining step and the severing step

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of bonding substrates, microchip and method of manufacturing...
- Patent number 12,103,246
- Issue date Oct 1, 2024
- Ushio Denki Kabushiki Kaisha
- Motohiro Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INJECTION MOLDED ASSEMBLY AND METHOD OF JOINING INJECTION MOLDED PARTS
- Publication number 20180370151
- Publication date Dec 27, 2018
- FAURECIA INTERIOR SYSTEMS, INC.
- Scott Shields
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF BONDING SUBSTRATES, MICROCHIP AND METHOD OF MANUFACTURING...
- Publication number 20180141280
- Publication date May 24, 2018
- Ushio Denki Kabushiki Kaisha
- Motohiro SAKAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY