characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern

Industry

CPC
H05K3/425

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/425characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board
- Patent number 12,063,743
- Issue date Aug 13, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetrical electrolytic plating for a conductive pattern
- Patent number 11,716,819
- Issue date Aug 1, 2023
- AVERATEK CORPORATION
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making interconnect substrate and insulating sheet
- Patent number 11,612,063
- Issue date Mar 21, 2023
- Shinko Electric Industries Co., Ltd.
- Tomoaki Machida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Designing a printed circuit board (PCB) to detect slivers of conduc...
- Patent number 11,570,908
- Issue date Jan 31, 2023
- Juniper Networks, Inc.
- Steve M. Wilkinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making flexible printed circuit board and flexible printe...
- Patent number 11,523,518
- Issue date Dec 6, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Kou Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overhang-compensating annular plating layer in through hole of comp...
- Patent number 11,510,316
- Issue date Nov 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory card and memory card socket
- Patent number 11,464,120
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Seok-Jae Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing transfer film including seed layer, method...
- Patent number 11,453,823
- Issue date Sep 27, 2022
- InkTee Co., Ltd.
- Kwang-Choon Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 11,452,215
- Issue date Sep 20, 2022
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,439,019
- Issue date Sep 6, 2022
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming circuits using seed layer and etchant compositio...
- Patent number 11,317,514
- Issue date Apr 26, 2022
- Inktec Co., Ltd.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,219,129
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Overhang-compensating annular plating layer in through hole of comp...
- Patent number 11,051,403
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon-based direct plating process
- Patent number 10,986,738
- Issue date Apr 20, 2021
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Memory card and memory card socket
- Patent number 10,980,138
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Seok-Jae Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Designing a printed circuit board (PCB) to detect slivers of conduc...
- Patent number 10,917,976
- Issue date Feb 9, 2021
- Juniper Networks, Inc.
- Steve M. Wilkinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coupled via structure, circuit board having the coupled via structu...
- Patent number 10,887,980
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Dong-Yoon Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 10,827,622
- Issue date Nov 3, 2020
- Ajinomoto Co., Inc.
- Shigeo Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing backdrilling elimination utilizing anti-electroplate c...
- Patent number 10,798,829
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printed circuit boards using backing foil
- Patent number 10,765,012
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a multi-layer circuit board using conductive past...
- Patent number 10,765,003
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate production method
- Patent number 10,721,823
- Issue date Jul 21, 2020
- Intel Corporation
- Makoto Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a fusion bonded circuit structure
- Patent number 10,667,410
- Issue date May 26, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240276651
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215157
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ran PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240132441
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN
- Publication number 20230345642
- Publication date Oct 26, 2023
- Averatek Corporation
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT B...
- Publication number 20230337363
- Publication date Oct 19, 2023
- UNIMICRON GERMANY GMBH
- Oliver HOLZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGNING A PRINTED CIRCUIT BOARD (PCB) TO DETECT SLIVERS OF CONDUC...
- Publication number 20230156928
- Publication date May 18, 2023
- Juniper Networks, Inc.
- Steve WILKINSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220369466
- Publication date Nov 17, 2022
- Nichia Corporation.
- Masakazu SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCU...
- Publication number 20220304164
- Publication date Sep 22, 2022
- Atotech Deutschland GmbH & Co. KG
- Akif ÖZKÖK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20220279662
- Publication date Sep 1, 2022
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...
- Publication number 20220151069
- Publication date May 12, 2022
- Mitsui Chemicals, Inc.
- Taichi KOYAMA
- G01 - MEASURING TESTING
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20220095457
- Publication date Mar 24, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220078910
- Publication date Mar 10, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Byeung Kyu PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING INTERCONNECT SUBSTRATE AND INSULATING SHEET
- Publication number 20220046805
- Publication date Feb 10, 2022
- Shinko Electric Industries Co., Ltd.
- Tomoaki MACHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY CARD AND MEMORY CARD SOCKET
- Publication number 20210219441
- Publication date Jul 15, 2021
- Samsung Electronics Co., Ltd.
- Seok-Jae HAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Carbon-Based Direct Plating Process
- Publication number 20210204412
- Publication date Jul 1, 2021
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...
- Publication number 20210185832
- Publication date Jun 17, 2021
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Overhang-Compensating Annular Plating Layer in Through Hole of Comp...
- Publication number 20210185811
- Publication date Jun 17, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGNING A PRINTED CIRCUIT BOARD (PCB) TO DETECT SLIVERS OF CONDUC...
- Publication number 20210153359
- Publication date May 20, 2021
- Juniper Networks, Inc.
- Steve M. WILKINSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME
- Publication number 20210112669
- Publication date Apr 15, 2021
- National Taiwan University of Science and Technology
- CHIH-WEI CHIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MAKING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTE...
- Publication number 20210022254
- Publication date Jan 21, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kou NOGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20200389983
- Publication date Dec 10, 2020
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Overhang-Compensating Annular Plating Layer in Through Hole of Comp...
- Publication number 20200253052
- Publication date Aug 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20200253054
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CIRCUITS USING SEED LAYER AND ETCHANT COMPOSITIO...
- Publication number 20200221578
- Publication date Jul 9, 2020
- Ink Tec Co., Ltd.
- Kwang-Choon CHUNG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COUPLED VIA STRUCTURE, CIRCUIT BOARD HAVING THE COUPLED VIA STRUCTU...
- Publication number 20200178386
- Publication date Jun 4, 2020
- Samsung Electronics Co., Ltd.
- Dong-Yoon SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURE FOR EMBEDDED IC CHIP DIRECTLY CONNECTED TO PCB
- Publication number 20200120811
- Publication date Apr 16, 2020
- Averatek Corporation
- Haris BASIT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD...
- Publication number 20200053881
- Publication date Feb 13, 2020
- INKTEC CO., LTD.
- Kwang-Choon CHUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board, producing method thereof, and wiring circuit...

Hermetic metallized via with improved reliability

Manufacturing sequences for high density interconnect printed circu...

Printed circuit board

Asymmetrical electrolytic plating for a conductive pattern

Component carrier with blind hole filled with an electrically condu...

Process for fabrication of a printed circuit board using a semi-add...

Method of making interconnect substrate and insulating sheet

Designing a printed circuit board (PCB) to detect slivers of conduc...

Method of making flexible printed circuit board and flexible printe...

Overhang-compensating annular plating layer in through hole of comp...

Memory card and memory card socket

Method for manufacturing transfer film including seed layer, method...

Wiring circuit board, producing method thereof, and wiring circuit...

Printed circuit board and method of manufacturing the same

Method for forming circuits using seed layer and etchant compositio...

Component carrier with blind hole filled with an electrically condu...

Hermetic metallized via with improved reliability

Hermetic metallized via with improved reliability

Overhang-compensating annular plating layer in through hole of comp...

Carbon-based direct plating process

Memory card and memory card socket

Designing a printed circuit board (PCB) to detect slivers of conduc...

Coupled via structure, circuit board having the coupled via structu...

Method for manufacturing wiring board

Implementing backdrilling elimination utilizing anti-electroplate c...

Process for printed circuit boards using backing foil

Method for making a multi-layer circuit board using conductive past...

Laminate production method

Method of making a fusion bonded circuit structure

Patents Applicationslast 30 patents

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT B...

DESIGNING A PRINTED CIRCUIT BOARD (PCB) TO DETECT SLIVERS OF CONDUC...

PRINTED CIRCUIT BOARD

MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCU...

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...

Component Carrier With Blind Hole Filled With An Electrically Condu...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF MAKING INTERCONNECT SUBSTRATE AND INSULATING SHEET

MEMORY CARD AND MEMORY CARD SOCKET

Carbon-Based Direct Plating Process

WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...

Overhang-Compensating Annular Plating Layer in Through Hole of Comp...

DESIGNING A PRINTED CIRCUIT BOARD (PCB) TO DETECT SLIVERS OF CONDUC...

CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME

METHOD OF MAKING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTE...

Semi-Additive Process for Printed Circuit Boards

Overhang-Compensating Annular Plating Layer in Through Hole of Comp...

Component Carrier With Blind Hole Filled With An Electrically Condu...

METHOD FOR FORMING CIRCUITS USING SEED LAYER AND ETCHANT COMPOSITIO...

COUPLED VIA STRUCTURE, CIRCUIT BOARD HAVING THE COUPLED VIA STRUCTU...

METHOD OF MANUFACTURE FOR EMBEDDED IC CHIP DIRECTLY CONNECTED TO PCB

METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD...