characterised by the specific liquids involved

Industry

CPC
H05K2203/0779

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0779characterised by the specific liquids involved

Industries

Patents Grantslast 30 patents

Information Patent Grant
Etch chemistry for metallic materials
- Patent number 11,873,564
- Issue date Jan 16, 2024
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper foil having excellent adhesive strength, electrode comprisin...
- Patent number 11,588,156
- Issue date Feb 21, 2023
- SK NEXILIS CO., LTD.
- Seung Min Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Liquid mixture for filling blind holes in copper foil
- Patent number 11,486,050
- Issue date Nov 1, 2022
- An Xie
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring substrate and process for producing it
- Patent number 10,448,506
- Issue date Oct 15, 2019
- AGC Inc.
- Tomoya Hosoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROVIDING ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040056
- Publication date Jan 30, 2025
- Danielle A. Farmer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch Chemistry For Metallic Materials
- Publication number 20240102174
- Publication date Mar 28, 2024
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch Chemistry For Metallic Materials
- Publication number 20200102657
- Publication date Apr 2, 2020
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL HAVING EXCELLENT ADHESIVE STRENGTH, ELECTRODE COMPRISIN...
- Publication number 20200006777
- Publication date Jan 2, 2020
- KCF Technologies Co., Ltd.
- Seung Min KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND PROCESS FOR PRODUCING IT
- Publication number 20190141833
- Publication date May 9, 2019
- AGC Inc.
- Tomoya HOSODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-RESOLUTION PRINTING TECHNIQUE
- Publication number 20180332712
- Publication date Nov 15, 2018
- CARPE DIEM TECHNOLOGIES, INC.
- John S. Berg
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150195915
- Publication date Jul 9, 2015
- SAMSUNG DISPLAY CO., LTD.
- Jun Namkung
- B32 - LAYERED PRODUCTS

characterised by the specific liquids involved

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etch chemistry for metallic materials

Copper foil having excellent adhesive strength, electrode comprisin...

Liquid mixture for filling blind holes in copper foil

Wiring substrate and process for producing it

Patents Applicationslast 30 patents

METHOD OF PROVIDING ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

Etch Chemistry For Metallic Materials

Etch Chemistry For Metallic Materials

COPPER FOIL HAVING EXCELLENT ADHESIVE STRENGTH, ELECTRODE COMPRISIN...

WIRING SUBSTRATE AND PROCESS FOR PRODUCING IT

HIGH-RESOLUTION PRINTING TECHNIQUE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME