characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane

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H01L21/3083

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3083characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,814
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,131,979
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor structure
- Patent number 12,120,869
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengna Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method
- Patent number 12,112,986
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin structures
- Patent number 12,057,505
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching chemistry and method of forming semiconductor device us...
- Patent number 12,046,476
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a source/drain contact plug with an upw...
- Patent number 12,014,957
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Sungmoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated nanowire and nanoribbon patterning in transistor manufac...
- Patent number 12,014,959
- Issue date Jun 18, 2024
- Intel Corporation
- Leonard P Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor power device
- Patent number 12,015,078
- Issue date Jun 18, 2024
- SUZHOU ORIENTAL SEMICONDUCTOR CO., LTD.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a necked semiconductor body and method...
- Patent number 12,015,087
- Issue date Jun 18, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,888
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and pattern formation...
- Patent number 11,942,322
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous semiconductor device substrates with high quality epi...
- Patent number 11,908,922
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET and fabrication method thereof
- Patent number 11,908,862
- Issue date Feb 20, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing phase shift photo masks
- Patent number 11,906,898
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,901,306
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide layer on a doped substrate using nitridatio...
- Patent number 11,862,461
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor substrate having a stressed s...
- Patent number 11,810,789
- Issue date Nov 7, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a necked semiconductor body and method...
- Patent number 11,784,257
- Issue date Oct 10, 2023
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-V fins by aspect ratio trapping and self-aligned etch to remove...
- Patent number 11,776,956
- Issue date Oct 3, 2023
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,764,290
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method of manufacturing thereof
- Patent number 11,749,526
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thinning wafer thereof
- Patent number 11,721,555
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective bilayer inner spacer for nanosheet devices
- Patent number 11,695,057
- Issue date Jul 4, 2023
- International Business Machines Corporation
- Yao Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and manufacturing method thereof
- Patent number 11,665,902
- Issue date May 30, 2023
- Kioxia Corporation
- Takayuki Kashima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395906
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Georgios VELLIANITIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device and Method
- Publication number 20240395625
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURES
- Publication number 20240347637
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY
- Publication number 20240339327
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240250031
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...
- Publication number 20240222509
- Publication date Jul 4, 2024
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PHASE SHIFT PHOTO MASKS
- Publication number 20240184195
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED U...
- Publication number 20230402287
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Da HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND PATTERN FORMATION...
- Publication number 20230386840
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTRING COMPANY, LTD.
- An-Ren ZI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369467
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Georgios VELLIANITIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCHING CHEMISTRY AND METHOD OF FORMING SEMICONDUCTOR DEVICE US...
- Publication number 20230307240
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20230307343
- Publication date Sep 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE WHICH INCLUDES FINS
- Publication number 20230247817
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING REGROWN FIDUCIALS FOR SEMICONDUCT...
- Publication number 20230230931
- Publication date Jul 20, 2023
- NEXGEN POWER SYSTEMS, INC.
- Karthik Suresh Arulalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230207315
- Publication date Jun 29, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- TZUNG-HAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20230207393
- Publication date Jun 29, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing Semiconductor Structure, and Semiconductor...
- Publication number 20230197461
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Having A SiC Semiconductor Body
- Publication number 20230148156
- Publication date May 11, 2023
- Andreas Peter Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20230129760
- Publication date Apr 27, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230112229
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...
- Publication number 20230013575
- Publication date Jan 19, 2023
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SUBSTRATE PROCESSING
- Publication number 20230010069
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20220415661
- Publication date Dec 29, 2022
- TOKYO ELECTRON LIMITED
- Akinobu KAKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS
- Publication number 20220415660
- Publication date Dec 29, 2022
- TOKYO ELECTRON LIMITED
- Akinobu KAKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20220367174
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Sheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE REMOVAL OF SEMICONDUCTOR FINS
- Publication number 20220344211
- Publication date Oct 27, 2022
- TESSERA LLC
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF ANGLED GRATINGS
- Publication number 20220301926
- Publication date Sep 22, 2022
- Applied Materials, Inc.
- Rutger MEYER TIMMERMAN THIJSSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20220293428
- Publication date Sep 15, 2022
- TOKYO ELECTRON LIMITED
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS

characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Wafer dicing using femtosecond-based laser and plasma etch

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method for forming semiconductor structure

Through-substrate via structure and method of manufacture

FinFET device and method

Protective wafer grooving structure for wafer thinning and methods...

Semiconductor device having fin structures

Wet etching chemistry and method of forming semiconductor device us...

Semiconductor device having a source/drain contact plug with an upw...

Integrated nanowire and nanoribbon patterning in transistor manufac...

Manufacturing method of semiconductor power device

Semiconductor device having a necked semiconductor body and method...

Semiconductor device

Method of manufacturing semiconductor devices and pattern formation...

Heterogeneous semiconductor device substrates with high quality epi...

FinFET and fabrication method thereof

Method of manufacturing phase shift photo masks

Semiconductor structure

Method of forming oxide layer on a doped substrate using nitridatio...

Method of fabricating a semiconductor substrate having a stressed s...

Semiconductor device having a necked semiconductor body and method...

III-V fins by aspect ratio trapping and self-aligned etch to remove...

Semiconductor device

Semiconductor substrate and method of manufacturing thereof

Method and system for thinning wafer thereof

Semiconductor device and method of forming micro interconnect struc...

Protective bilayer inner spacer for nanosheet devices

Semiconductor storage device and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FinFET Device and Method

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURES

METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...

METHOD OF MANUFACTURING PHASE SHIFT PHOTO MASKS

SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED U...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND PATTERN FORMATION...

SEMICONDUCTOR DEVICE

WET ETCHING CHEMISTRY AND METHOD OF FORMING SEMICONDUCTOR DEVICE US...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD OF MAKING SEMICONDUCTOR DEVICE WHICH INCLUDES FINS

METHOD AND SYSTEM FOR FABRICATING REGROWN FIDUCIALS FOR SEMICONDUCT...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

Method for Manufacturing Semiconductor Structure, and Semiconductor...

Semiconductor Component Having A SiC Semiconductor Body

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...

APPARATUS FOR SUBSTRATE PROCESSING

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

PROCESSING APPARATUS

SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THEREOF

SELECTIVE REMOVAL OF SEMICONDUCTOR FINS

FORMATION OF ANGLED GRATINGS

APPARATUS FOR PROCESSING SUBSTRATE