characterized by a material, a roughness, a coating or the like

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H01L21/67336

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67336characterized by a material, a roughness, a coating or the like

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Patterned carrier assemblies having an integrated adhesive film
- Patent number 12,154,805
- Issue date Nov 26, 2024
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making adsorption device
- Patent number 11,676,839
- Issue date Jun 13, 2023
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Adsorption device, transferring system having same, and transferrin...
- Patent number 11,676,840
- Issue date Jun 13, 2023
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Adsorption device, transferring system having same, and transferrin...
- Patent number 11,521,878
- Issue date Dec 6, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure and micro device structure
- Patent number 11,302,547
- Issue date Apr 12, 2022
- PlayNitride Display Co., Ltd.
- Pei-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device comprising a magnetic plate having opposite magne...
- Patent number 11,295,971
- Issue date Apr 5, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device and transferring system having same
- Patent number 11,139,187
- Issue date Oct 5, 2021
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Die tray with channels
- Patent number 10,796,936
- Issue date Oct 6, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid substrate carrier
- Patent number 10,777,442
- Issue date Sep 15, 2020
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shield tray, magnetic shield wrapper and magnetic memory p...
- Patent number 10,562,658
- Issue date Feb 18, 2020
- TOSHIBA MEMORY CORPORATION
- Takeshi Fujimori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Protecting partially-processed products during transport
- Patent number 10,566,224
- Issue date Feb 18, 2020
- Skyworks Solutions, Inc.
- John D Steeves
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip accommodation tray
- Patent number 10,475,681
- Issue date Nov 12, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an arrangement including a chip carrier notch
- Patent number 10,361,138
- Issue date Jul 23, 2019
- Infineon Technologies AG
- Michael Ledutke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent electrostatic carrier
- Patent number 10,332,773
- Issue date Jun 25, 2019
- Applied Materials, Inc.
- Leung Kway Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for handling integrated circuits
- Patent number 9,824,906
- Issue date Nov 21, 2017
- Altera Corporation
- Terry Lynne Barrette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate carrier unit for a film deposition apparatus
- Patent number 9,771,649
- Issue date Sep 26, 2017
- Linco Technology Co., Ltd.
- Chung-Yu Yeh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Arrangement having a plurality of chips and a chip carrier, and a p...
- Patent number 9,698,070
- Issue date Jul 4, 2017
- Infineon Technologies AG
- Michael Ledutke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer styrenic resin sheet
- Patent number 9,646,863
- Issue date May 9, 2017
- DENKA COMPANY LIMITED
- Yutaka Aoki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Device and method for drying separated electronic components
- Patent number 9,558,970
- Issue date Jan 31, 2017
- Besi Netherlands B.V.
- Jurgen Hendrikus Gerhardus Huisstede
- F26 - DRYING
Information Patent Grant
Carrier for separated electronic components and method for visual i...
- Patent number 9,487,344
- Issue date Nov 8, 2016
- Besi Netherlands B.V.
- Johannes Gerhardus Augustinus Zweers
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 9,142,440
- Issue date Sep 22, 2015
- Cypess Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming substrate carriers and articles from compositions...
- Patent number 8,652,391
- Issue date Feb 18, 2014
- Entegris, Inc.
- Sanjiv M. Bhatt
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Vacuum holder for integrated circuit units
- Patent number 7,540,503
- Issue date Jun 2, 2009
- Rokko Systems Pte Ltd.
- Hae Choon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 7,489,029
- Issue date Feb 10, 2009
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making a thermoplastic container
- Patent number 6,835,344
- Issue date Dec 28, 2004
- Sumitomo Bakelite, Co., Ltd.
- Tung Teck Hong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transport device for electronic components with an anticontaminatio...
- Patent number 6,497,932
- Issue date Dec 24, 2002
- Infineon Technologies AG
- Thomas Münch
- B08 - CLEANING
Information Patent Grant
Boat for organic and ceramic flip chip package assembly
- Patent number 6,488,158
- Issue date Dec 3, 2002
- Advanced Micro Devices, Inc.
- Mohammad Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra precision process carrier for semi-conductor manufacturing
- Patent number 6,367,635
- Issue date Apr 9, 2002
- Auer Precision Company, Inc
- Carl Auer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud and ride for use on matrix trays
- Patent number 6,349,832
- Issue date Feb 26, 2002
- Tiang Fong Han
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Product holder
- Patent number 6,261,370
- Issue date Jul 17, 2001
- Bridgestone Corporation
- Masashi Otsuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240395587
- Publication date Nov 28, 2024
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRID STRUCTURE FOR FIXING SPECIMEN
- Publication number 20240242989
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yeoseon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER PLATE AND TRANSFERRING DEVICE
- Publication number 20240047250
- Publication date Feb 8, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Haixu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE
- Publication number 20230386875
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED DIE SHIPPING TRAY ASSEMBLY
- Publication number 20230290661
- Publication date Sep 14, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230282496
- Publication date Sep 7, 2023
- TOKYO ELECTRON LIMITED
- Manabu HONMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND MANUFACTURING METHOD...
- Publication number 20230079059
- Publication date Mar 16, 2023
- LG ELECTRONICS INC.
- Younho HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID CARRIER ASSEMBLIES WITH TACKY MEDIA MOLDED THEREON
- Publication number 20220384226
- Publication date Dec 1, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
AUTOMATED-POSITION-ALIGNING METHOD FOR TRANSFERRING CHIP AND SYSTEM...
- Publication number 20220189911
- Publication date Jun 16, 2022
- Yu-Jung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADSORPTION DEVICE, TRANSFERRING SYSTEM HAVING SAME, AND TRANSFERRIN...
- Publication number 20220172970
- Publication date Jun 2, 2022
- Century Technology (Shenzhen) Corporation Limited
- PO-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20220013390
- Publication date Jan 13, 2022
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADSORPTION DEVICE, METHOD FOR MAKING SAME, AND TRANSFERRING SYSTEM...
- Publication number 20210398832
- Publication date Dec 23, 2021
- Century Technology (Shenzhen) Corporation Limited
- PO-LIANG CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ADSORPTION DEVICE, TRANSFERRING SYSTEM HAVING SAME, AND TRANSFERRIN...
- Publication number 20210005489
- Publication date Jan 7, 2021
- Century Technology (Shenzhen) Corporation Limited
- PO-LIANG CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ADSORPTION DEVICE, TRANSFERRING SYSTEM HAVING SAME, AND TRANSFERRIN...
- Publication number 20210005490
- Publication date Jan 7, 2021
- Century Technology (Shenzhen) Corporation Limited
- PO-LIANG CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ADSORPTION DEVICE, METHOD FOR MAKING SAME, AND TRANSFERRING SYSTEM...
- Publication number 20210005488
- Publication date Jan 7, 2021
- Century Technology (Shenzhen) Corporation Limited
- PO-LIANG CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
POLYLACTIC ACID RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20190127573
- Publication date May 2, 2019
- Advanced Semiconductor Engineering, Inc.
- Chean-Cheng SU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067061
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die tray with channels
- Publication number 20180182654
- Publication date Jun 28, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE CARRIER
- Publication number 20180144969
- Publication date May 24, 2018
- SRISKANTHARAJAH THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SHIELD TRAY, MAGNETIC SHIELD WRAPPER AND MAGNETIC MEMORY P...
- Publication number 20180079547
- Publication date Mar 22, 2018
- Toshiba Memory Corporation
- Takeshi FUJIMORI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ARRANGEMENT HAVING A PLURALITY OF CHIPS AND A CHIP CARRIER, AND A P...
- Publication number 20170263480
- Publication date Sep 14, 2017
- INFINEON TECHNOLOGIES AG
- Michael Ledutke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ACCOMMODATION TRAY
- Publication number 20170186635
- Publication date Jun 29, 2017
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING AND APPARATUS
- Publication number 20170162412
- Publication date Jun 8, 2017
- ROKKO SYSTEMS PTE LTD
- Seung Ho BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HANDLING INTEGRATED CIRCUITS
- Publication number 20150063977
- Publication date Mar 5, 2015
- Altera Corporation
- Terry Lynne Barrette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT HAVING A PLURALITY OF CHIPS AND A CHIP CARRIER, AND A P...
- Publication number 20140306356
- Publication date Oct 16, 2014
- INFINEON TECHNOLOGIES AG
- Michael Ledutke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIERS AND ARTICLES FORMED FROM COMPOSITIONS COMPRISING...
- Publication number 20140264999
- Publication date Sep 18, 2014
- Entegris, Inc.
- Sanjiv M. BHATT
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method of forming substrate carriers and articles from compositions...
- Publication number 20130341835
- Publication date Dec 26, 2013
- Sanjiv M. Bhatt
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTILAYER STYRENIC RESIN SHEET
- Publication number 20130337202
- Publication date Dec 19, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Yutaka Aoki
- B32 - LAYERED PRODUCTS
Information Patent Application
Carrier for Separated Electronic Components and Method for Visual I...
- Publication number 20130300857
- Publication date Nov 14, 2013
- BESI NETHERLANDS B.V.
- Johannes Gerhardus Augustinus Zweers
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Thermoformed IC Trays Of Poly(Phenylene Ether) Compositions
- Publication number 20130142979
- Publication date Jun 6, 2013
- LUBRIZOL ADVANCED MATERIALS, INC.
- Kurt S. Edwards
- H01 - BASIC ELECTRIC ELEMENTS

characterized by a material, a roughness, a coating or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned carrier assemblies having an integrated adhesive film

Method for making adsorption device

Adsorption device, transferring system having same, and transferrin...

Adsorption device, transferring system having same, and transferrin...

Carrier structure and micro device structure

Adsorption device comprising a magnetic plate having opposite magne...

Adsorption device and transferring system having same

Die tray with channels

Hybrid substrate carrier

Magnetic shield tray, magnetic shield wrapper and magnetic memory p...

Protecting partially-processed products during transport

Chip accommodation tray

Method for manufacturing an arrangement including a chip carrier notch

Transparent electrostatic carrier

Methods and structures for handling integrated circuits

Substrate carrier unit for a film deposition apparatus

Arrangement having a plurality of chips and a chip carrier, and a p...

Multilayer styrenic resin sheet

Device and method for drying separated electronic components

Carrier for separated electronic components and method for visual i...

Carrier structure for stacked-type semiconductor device, method of...

Method of forming substrate carriers and articles from compositions...

Vacuum holder for integrated circuit units

Carrier structure for stacked-type semiconductor device, method of...

Process of making a thermoplastic container

Transport device for electronic components with an anticontaminatio...

Boat for organic and ceramic flip chip package assembly

Ultra precision process carrier for semi-conductor manufacturing

Stud and ride for use on matrix trays

Product holder

Patents Applicationslast 30 patents

TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

GRID STRUCTURE FOR FIXING SPECIMEN

CARRIER PLATE AND TRANSFERRING DEVICE

UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE

SINGULATED DIE SHIPPING TRAY ASSEMBLY

SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND MANUFACTURING METHOD...

RIGID CARRIER ASSEMBLIES WITH TACKY MEDIA MOLDED THEREON

AUTOMATED-POSITION-ALIGNING METHOD FOR TRANSFERRING CHIP AND SYSTEM...

ADSORPTION DEVICE, TRANSFERRING SYSTEM HAVING SAME, AND TRANSFERRIN...

PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

ADSORPTION DEVICE, METHOD FOR MAKING SAME, AND TRANSFERRING SYSTEM...

ADSORPTION DEVICE, TRANSFERRING SYSTEM HAVING SAME, AND TRANSFERRIN...

ADSORPTION DEVICE, TRANSFERRING SYSTEM HAVING SAME, AND TRANSFERRIN...

ADSORPTION DEVICE, METHOD FOR MAKING SAME, AND TRANSFERRING SYSTEM...

POLYLACTIC ACID RESIN COMPOSITION AND APPLICATION THEREOF

RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

Die tray with channels

HYBRID SUBSTRATE CARRIER

MAGNETIC SHIELD TRAY, MAGNETIC SHIELD WRAPPER AND MAGNETIC MEMORY P...

ARRANGEMENT HAVING A PLURALITY OF CHIPS AND A CHIP CARRIER, AND A P...

CHIP ACCOMMODATION TRAY

SUBSTRATE PROCESSING AND APPARATUS

METHODS AND STRUCTURES FOR HANDLING INTEGRATED CIRCUITS

ARRANGEMENT HAVING A PLURALITY OF CHIPS AND A CHIP CARRIER, AND A P...

SUBSTRATE CARRIERS AND ARTICLES FORMED FROM COMPOSITIONS COMPRISING...

Method of forming substrate carriers and articles from compositions...

MULTILAYER STYRENIC RESIN SHEET

Carrier for Separated Electronic Components and Method for Visual I...

Thermoformed IC Trays Of Poly(Phenylene Ether) Compositions