characterized by a material, a roughness, a coating or the like

Industry

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H01L21/6733

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6733characterized by a material, a roughness, a coating or the like

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device testing apparatus and electronic device testing m...
- Patent number 12,180,018
- Issue date Dec 31, 2024
- CHROMA ATE INC.
- Chin-Yi Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned carrier assemblies having an integrated adhesive film
- Patent number 12,154,805
- Issue date Nov 26, 2024
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module tray for semiconductor device
- Patent number 12,119,248
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Taegeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier, chip testing module, and chip handling module
- Patent number 12,112,964
- Issue date Oct 8, 2024
- CHROMA ATE INC.
- Sheng-Hung Wang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic device pick-and-place system and electronic device testi...
- Patent number 12,103,789
- Issue date Oct 1, 2024
- CHROMA ATE INC.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet bench structure
- Patent number 12,074,041
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer apparatus
- Patent number 12,068,178
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Dongkyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer system for wafer cassettes
- Patent number 12,046,497
- Issue date Jul 23, 2024
- Visera Technologies Company Ltd
- Yi-Feng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer method and mass transfer device thereof for micro led...
- Patent number 12,033,876
- Issue date Jul 9, 2024
- Beijing Boe Display Technology Co., Ltd.
- Bohua Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for packaging electronic components using a t...
- Patent number 12,035,478
- Issue date Jul 9, 2024
- CSP Technologies, Inc.
- Tzu-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip tray positioning device
- Patent number 11,970,342
- Issue date Apr 30, 2024
- CHROMA ATE INC.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet bench structure
- Patent number 11,961,745
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control and method for devices under test and image sen...
- Patent number 11,932,498
- Issue date Mar 19, 2024
- CHROMA ATE INC.
- Chin-Yi Ouyang
- G01 - MEASURING TESTING
Information Patent Grant
Dual applicator fluid dispensing methods and systems
- Patent number 11,919,020
- Issue date Mar 5, 2024
- Nordson Corporation
- Christopher L. Giusti
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus for attaching semiconductor parts
- Patent number 11,823,920
- Issue date Nov 21, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chamber module and test handler including the same
- Patent number 11,762,009
- Issue date Sep 19, 2023
- Semes Co., Ltd.
- Hyon Jin Lee
- G01 - MEASURING TESTING
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tray
- Patent number 11,764,090
- Issue date Sep 19, 2023
- Chipbond Technology Corporation
- Hsu-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of making and using the same
- Patent number 11,725,120
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate processing apparatus, quartz reaction tube and method of...
- Patent number 11,685,992
- Issue date Jun 27, 2023
- Kokusai Electric Corporation
- Yusaku Okajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for handling die carriers
- Patent number 11,682,571
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making adsorption device
- Patent number 11,676,839
- Issue date Jun 13, 2023
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Adsorption device, transferring system having same, and transferrin...
- Patent number 11,676,840
- Issue date Jun 13, 2023
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Automatic tray loading system and use method of the same
- Patent number 11,628,993
- Issue date Apr 18, 2023
- QINGDAO UNIVERSITY OF TECHNOLOGY
- Changhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spring anchor for advanced packaging
- Patent number 11,626,312
- Issue date Apr 11, 2023
- Dong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for tray cassette warehousing
- Patent number 11,527,425
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device, transferring system having same, and transferrin...
- Patent number 11,521,878
- Issue date Dec 6, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tray
- Patent number 11,521,877
- Issue date Dec 6, 2022
- Disco Corporation
- Kentaro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-row carrier tape with alternating, staggered dummy pockets
- Patent number 11,452,247
- Issue date Sep 20, 2022
- Advantek, Inc.
- Todd M. Oliverius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for handling die carriers
- Patent number 11,398,396
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022730
- Publication date Jan 16, 2025
- TES CO., LTD.
- Jin-Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE TRAY FOR SEMICONDUCTOR DEVICE
- Publication number 20240404855
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Taegeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE TRAY FOR SEMICONDUCTOR DEVICE
- Publication number 20240404856
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Taegeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240395587
- Publication date Nov 28, 2024
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING PLATE, HOLDING SYSTEM, USE OF THE HOLDING PLATE, USE OF THE...
- Publication number 20240355657
- Publication date Oct 24, 2024
- ASMPT GmbH & Co. KG
- Christoph OECKL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALI...
- Publication number 20240321618
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Suhwan SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...
- Publication number 20240322068
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACEPLATE LOADING PLATFORM
- Publication number 20240312815
- Publication date Sep 19, 2024
- Applied Materials, Inc.
- Thyagarajan Kathavarayan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Calibration Device
- Publication number 20240304479
- Publication date Sep 12, 2024
- DIODES INCORPORATED
- WanHui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRID STRUCTURE FOR FIXING SPECIMEN
- Publication number 20240242989
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yeoseon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HANDLING DEVICE AND SUCKER MODULE THEREOF
- Publication number 20240194515
- Publication date Jun 13, 2024
- Wistron Corporation
- Shun-Chi YEH
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS FOR TRANSPORTING SEMICONDUCTOR WAFERS
- Publication number 20240178026
- Publication date May 30, 2024
- Siltronic AG
- Ludwig Lamprecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND LID SYSTEM FOR A CHIP TRAY
- Publication number 20240170315
- Publication date May 23, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Richard Rochford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAY MODULE
- Publication number 20240092552
- Publication date Mar 21, 2024
- SAMSUNG DISPLAY CO., LTD.
- MINJONG CHEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS-TRANSFER METHOD AND MASS-TRANSFER DEVICE FOR MICRO SEMICONDUCT...
- Publication number 20240079395
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Joonyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE TRAY FOR SEMICONDUCTOR DEVICE
- Publication number 20240055286
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Taegeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER PLATE AND TRANSFERRING DEVICE
- Publication number 20240047250
- Publication date Feb 8, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Haixu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SYSTEM FOR WAFER CASSETTES
- Publication number 20240047249
- Publication date Feb 8, 2024
- VisEra Technologies Company Ltd.
- Yi-Feng YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WET TRANSFER APPARATUS
- Publication number 20240006199
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Hyunjoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE
- Publication number 20230386875
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
- Publication number 20230340298
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS AND METHODS FOR HANDLING DIE CARRIERS
- Publication number 20230298919
- Publication date Sep 21, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED DIE SHIPPING TRAY ASSEMBLY
- Publication number 20230290661
- Publication date Sep 14, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230282496
- Publication date Sep 7, 2023
- TOKYO ELECTRON LIMITED
- Manabu HONMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SECURING SEMICONDUCTOR DEVICE CARRYING BOA...
- Publication number 20230268210
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHUN-YU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER
- Publication number 20230253226
- Publication date Aug 10, 2023
- Po-Hsiang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE, AND USE OF THE HOLDING DEVICE
- Publication number 20230245868
- Publication date Aug 3, 2023
- HANWHA Q CELLS GMBH
- Martin SCHAPER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICRO-SEMICONDUCTOR CHIP TRANSFER APPARATUS AND CHIP EXTRACTION APP...
- Publication number 20230197477
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAY CARRIER AND CORRESPONDING METHOD
- Publication number 20230170236
- Publication date Jun 1, 2023
- STMicroelectronics (Malta) Ltd.
- Silvio SPITERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING SUBSTRATE AND METHOD FOR TRANSFERRING SU...
- Publication number 20230170239
- Publication date Jun 1, 2023
- TOKYO ELECTRON LIMITED
- Takehiro SHINDO
- H01 - BASIC ELECTRIC ELEMENTS

characterized by a material, a roughness, a coating or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device testing apparatus and electronic device testing m...

Patterned carrier assemblies having an integrated adhesive film

Module tray for semiconductor device

Chip carrier, chip testing module, and chip handling module

Electronic device pick-and-place system and electronic device testi...

Wet bench structure

Chip transfer apparatus

Transfer system for wafer cassettes

Mass transfer method and mass transfer device thereof for micro led...

Apparatus and methods for packaging electronic components using a t...

Chip tray positioning device

Wet bench structure

Temperature control and method for devices under test and image sen...

Dual applicator fluid dispensing methods and systems

Apparatus for attaching semiconductor parts

Chamber module and test handler including the same

Tape carrier assemblies having an integrated adhesive film

Tray

Carrier tape system and methods of making and using the same

Substrate processing apparatus, quartz reaction tube and method of...

Apparatus and methods for handling die carriers

Method for making adsorption device

Adsorption device, transferring system having same, and transferrin...

Automatic tray loading system and use method of the same

Metal spring anchor for advanced packaging

Systems and methods for tray cassette warehousing

Adsorption device, transferring system having same, and transferrin...

Carrier tray

Multi-row carrier tape with alternating, staggered dummy pockets

Apparatus and methods for handling die carriers

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

MODULE TRAY FOR SEMICONDUCTOR DEVICE

MODULE TRAY FOR SEMICONDUCTOR DEVICE

TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

HOLDING PLATE, HOLDING SYSTEM, USE OF THE HOLDING PLATE, USE OF THE...

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALI...

MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...

FACEPLATE LOADING PLATFORM

Calibration Device

GRID STRUCTURE FOR FIXING SPECIMEN

WAFER HANDLING DEVICE AND SUCKER MODULE THEREOF

APPARATUS FOR TRANSPORTING SEMICONDUCTOR WAFERS

CLIP AND LID SYSTEM FOR A CHIP TRAY

TRAY MODULE

MASS-TRANSFER METHOD AND MASS-TRANSFER DEVICE FOR MICRO SEMICONDUCT...

MODULE TRAY FOR SEMICONDUCTOR DEVICE

CARRIER PLATE AND TRANSFERRING DEVICE

TRANSFER SYSTEM FOR WAFER CASSETTES

CHIP WET TRANSFER APPARATUS

UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE

CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME

APPARATUS AND METHODS FOR HANDLING DIE CARRIERS

SINGULATED DIE SHIPPING TRAY ASSEMBLY

SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

METHOD AND APPARATUS FOR SECURING SEMICONDUCTOR DEVICE CARRYING BOA...

CHIP CARRIER

HOLDING DEVICE, AND USE OF THE HOLDING DEVICE

MICRO-SEMICONDUCTOR CHIP TRANSFER APPARATUS AND CHIP EXTRACTION APP...

TRAY CARRIER AND CORRESPONDING METHOD

APPARATUS FOR TRANSFERRING SUBSTRATE AND METHOD FOR TRANSFERRING SU...