characterized by particular after-treatment steps

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H01L21/76853

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76853characterized by particular after-treatment steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a barrier layer in an interconnect structure of s...
- Patent number 12,266,567
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bit line structure, method for manufacturi...
- Patent number 11,985,814
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ning Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for inhibiting line bending during conductive material depo...
- Patent number 11,935,782
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pass plating process with intermediate rinse and dry
- Patent number 11,887,888
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Peter John Holverson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount thin-film components having terminals configured for...
- Patent number 11,798,896
- Issue date Oct 24, 2023
- KYOCERA AVX Components Corporation
- Yehuda Seidman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods and apparatuses for forming the...
- Patent number 11,694,899
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to monitor particulate accumulation for bake ch...
- Patent number 11,339,733
- Issue date May 24, 2022
- Tokyo Electron Limited
- Michael Carcasi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interconnect structure of semiconductor device including barrier la...
- Patent number 11,335,593
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with species on or in conductive material on elongate lines
- Patent number 11,270,909
- Issue date Mar 8, 2022
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contacts and methods for manufacturing the same
- Patent number 11,195,721
- Issue date Dec 7, 2021
- Princeton Optronics, Inc.
- Guoyang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pass plating process with intermediate rinse and dry
- Patent number 11,081,390
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Peter John Holverson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount thin-film components having terminals configured for...
- Patent number 11,056,444
- Issue date Jul 6, 2021
- AVX Corporation
- Yehuda Seidman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust gate cap for protecting a gate from downstream metallization...
- Patent number 10,916,431
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-etch treatment of an electrically conductive feature
- Patent number 10,566,232
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature molybdenum film deposition utilizing boron nucleati...
- Patent number 10,453,744
- Issue date Oct 22, 2019
- Entegris, Inc.
- Shuang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etch removal of Ru selective to other metals
- Patent number 10,242,909
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu wiring forming method and semiconductor device manufacturing method
- Patent number 10,163,699
- Issue date Dec 25, 2018
- Tokyo Electron Limited
- Hiroyuki Nagai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,922,974
- Issue date Mar 20, 2018
- United Microelectronics Corp.
- Chia Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,748,233
- Issue date Aug 29, 2017
- United Microelectronics Corp.
- Chia Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including modified liners and methods for fabri...
- Patent number 9,613,906
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES, INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing liner corrosion during metallization of semiconductor devices
- Patent number 9,595,493
- Issue date Mar 14, 2017
- GLOBALFOUNDRIES Inc.
- Zhiguo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilevel interconnect structure and...
- Patent number 8,709,939
- Issue date Apr 29, 2014
- Semiconductor Technology Academic Research Center
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilevel interconnect structure and...
- Patent number 8,304,908
- Issue date Nov 6, 2012
- Semiconductor Technology Academic Research Center
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and process for manufacturi...
- Patent number 5,981,369
- Issue date Nov 9, 1999
- Hitachi, Ltd.
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20230317459
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chun-Hsu Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20220384255
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device and Method of Formin...
- Publication number 20220254682
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BIT LINE STRUCTURE, METHOD FOR MANUFACTURI...
- Publication number 20220052054
- Publication date Feb 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ning XI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PASS PLATING PROCESS WITH INTERMEDIATE RINSE AND DRY
- Publication number 20210327753
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Peter John Holverson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-Mount Thin-Film Components having Terminals Configured for...
- Publication number 20210305176
- Publication date Sep 30, 2021
- AVX CORPORATION
- Yehuda Seidman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INHIBITING LINE BENDING DURING CONDUCTIVE MATERIAL DEPO...
- Publication number 20210233810
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...
- Publication number 20200335345
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PASS PLATING PROCESS WITH INTERMEDIATE RINSE AND DRY
- Publication number 20200211898
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Peter John Holverson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-Etch Treatment of an Electrically Conductive Feature
- Publication number 20200176308
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface- Mount Thin-Film Components having Terminals Configured for...
- Publication number 20200144201
- Publication date May 7, 2020
- AVX CORPORATION
- Yehuda Seidman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Hole
- Publication number 20190189509
- Publication date Jun 20, 2019
- Thomas Bertrams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-ETCH TREATMENT OF AN ELECTRICALLY CONDUCTIVE FEATURE
- Publication number 20180337090
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- BO-JHIH SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE MOLYBDENUM FILM DEPOSITION UTILIZING BORON NUCLEATI...
- Publication number 20180261503
- Publication date Sep 13, 2018
- Entegris, Inc.
- Shuang Meng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170301670
- Publication date Oct 19, 2017
- UNITED MICROELECTRONICS CORP.
- Chia Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170062416
- Publication date Mar 2, 2017
- UNITED MICROELECTRONICS CORP.
- Chia Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LINER CORROSION DURING METALLIZATION OF SEMICONDUCTOR DEVICES
- Publication number 20170047282
- Publication date Feb 16, 2017
- GLOBALFOUNDRIES INC.
- Zhiguo SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER AND CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20170012001
- Publication date Jan 12, 2017
- President and Fellows of Harvard College
- Roy Gerald GORDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A MULTILEVEL INTERCONNECT STRUCTURE AND...
- Publication number 20130089979
- Publication date Apr 11, 2013
- NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20090236747
- Publication date Sep 24, 2009
- SEMICONDUCTOR TECHNOLOGY ACADEMIC RESEARCH CENTER
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS

characterized by particular after-treatment steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a barrier layer in an interconnect structure of s...

Method for manufacturing bit line structure, method for manufacturi...

Methods for inhibiting line bending during conductive material depo...

Multi-pass plating process with intermediate rinse and dry

Surface-mount thin-film components having terminals configured for...

Interconnect structures and methods and apparatuses for forming the...

Systems and methods to monitor particulate accumulation for bake ch...

Interconnect structure of semiconductor device including barrier la...

Apparatus with species on or in conductive material on elongate lines

Ohmic contacts and methods for manufacturing the same

Multi-pass plating process with intermediate rinse and dry

Surface-mount thin-film components having terminals configured for...

Robust gate cap for protecting a gate from downstream metallization...

Post-etch treatment of an electrically conductive feature

Low temperature molybdenum film deposition utilizing boron nucleati...

Wet etch removal of Ru selective to other metals

Cu wiring forming method and semiconductor device manufacturing method

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Integrated circuits including modified liners and methods for fabri...

Reducing liner corrosion during metallization of semiconductor devices

Semiconductor device having a multilevel interconnect structure and...

Semiconductor device having a multilevel interconnect structure and...

Semiconductor integrated circuit device and process for manufacturi...

Patents Applicationslast 30 patents

Interconnect Structures and Methods and Apparatuses for Forming the...

Interconnect Structures and Methods and Apparatuses for Forming the...

Interconnect Structure of Semiconductor Device and Method of Formin...

METHOD FOR MANUFACTURING BIT LINE STRUCTURE, METHOD FOR MANUFACTURI...

MULTI-PASS PLATING PROCESS WITH INTERMEDIATE RINSE AND DRY

Surface-Mount Thin-Film Components having Terminals Configured for...

METHODS FOR INHIBITING LINE BENDING DURING CONDUCTIVE MATERIAL DEPO...

ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...

MULTI-PASS PLATING PROCESS WITH INTERMEDIATE RINSE AND DRY

Post-Etch Treatment of an Electrically Conductive Feature

Surface- Mount Thin-Film Components having Terminals Configured for...

Contact Hole

POST-ETCH TREATMENT OF AN ELECTRICALLY CONDUCTIVE FEATURE

LOW TEMPERATURE MOLYBDENUM FILM DEPOSITION UTILIZING BORON NUCLEATI...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

REDUCING LINER CORROSION DURING METALLIZATION OF SEMICONDUCTOR DEVICES

SELF-ALIGNED BARRIER AND CAPPING LAYERS FOR INTERCONNECTS

SEMICONDUCTOR DEVICE HAVING A MULTILEVEL INTERCONNECT STRUCTURE AND...

Semiconductor device and method for fabricating the same