characterized by using an inorganic intermediate insulating layer

Industry

CPC
H05K3/4667

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4667characterized by using an inorganic intermediate insulating layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic carrier substrate and power module
- Patent number 12,028,974
- Issue date Jul 2, 2024
- Robert Bosch GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive insulating paste and electronic component
- Patent number 11,886,114
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Kenta Kondo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Additive manufactured 3D electronic substrate
- Patent number 11,765,839
- Issue date Sep 19, 2023
- Schlumberger Technology Corporation
- Steven O. Dunford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite part with integral electronic instrumentation circuit and...
- Patent number 11,639,916
- Issue date May 2, 2023
- SAFRAN
- Sabri Janfaoui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wiring board
- Patent number 11,528,810
- Issue date Dec 13, 2022
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and multilayer board using the same
- Patent number 10,153,066
- Issue date Dec 11, 2018
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hajime Nakazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, manufacturing method therefor, and sub...
- Patent number 9,961,768
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrates including thin film signal lines
- Patent number 9,854,687
- Issue date Dec 26, 2017
- Finisar Corporation
- Maziar Amirkiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered manufacturing of free-form multi-material micro-components
- Patent number 9,545,669
- Issue date Jan 17, 2017
- Digital Metal AB
- Thorbjörn Åklint
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
High speed differential wiring in glass ceramic MCMS
- Patent number 9,232,645
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Jinwoo Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High speed differential wiring in glass ceramic MCMS
- Patent number 9,232,646
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Jinwoo Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for the production of a ceramic multilayer circuit arrangement
- Patent number 9,003,653
- Issue date Apr 14, 2015
- Robert Bosch GmbH
- Juergen Egerter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, manufacturing method of the wiring board, and semicon...
- Patent number 8,674,514
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating metallized ceramics substrate, metallized ce...
- Patent number 8,071,187
- Issue date Dec 6, 2011
- Tokuyama Corporation
- Yasuyuki Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer thick-film RF package
- Patent number 8,034,666
- Issue date Oct 11, 2011
- Microsemi Corporation
- Benjamin A. Samples
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate for electric circuit...
- Patent number 8,021,920
- Issue date Sep 20, 2011
- Curamik Electronics GmbH
- Jürgen Schulz-Harder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive substrate
- Patent number 7,897,877
- Issue date Mar 1, 2011
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive substrate and method of making same
- Patent number 7,803,688
- Issue date Sep 28, 2010
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 7,781,328
- Issue date Aug 24, 2010
- Medtronic MiniMed, Inc.
- Rajiv Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-ceramic substrate for electric circuits or modules, method fo...
- Patent number 7,750,461
- Issue date Jul 6, 2010
- Curamix Electronics GmbH
- Jürgen Schulz-Harder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 7,297,627
- Issue date Nov 20, 2007
- Medtronic MiniMed, Inc.
- Rajiv Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic electronic part, circuit board and method for pr...
- Patent number 7,232,496
- Issue date Jun 19, 2007
- TDK Corporation
- Masayuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit component and method for manufacturing the same
- Patent number 7,146,719
- Issue date Dec 12, 2006
- Murata Manufacturing Co., Ltd.
- Michiaki Iha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer composite and method for preparing the same
- Patent number 7,144,618
- Issue date Dec 5, 2006
- Murata Manufacturing Co., Ltd.
- Yoshiyuki Tonami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick film dielectric compositions for use on aluminum nitride subs...
- Patent number 7,087,293
- Issue date Aug 8, 2006
- E. I. Du Pont de Nemours and Company
- Yong Cho
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Thick film dielectric compositions for use on aluminum nitride subs...
- Patent number 7,030,048
- Issue date Apr 18, 2006
- E. I. Du Pont de Nemours and Company
- Yong Cho
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Methods and apparatus for printing conductive thickfilms over thick...
- Patent number 7,014,784
- Issue date Mar 21, 2006
- Agilent Technologies, Inc.
- Lewis R. Dove
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic substrate utilizing an intaglio plate with a plu...
- Patent number 6,861,744
- Issue date Mar 1, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masaaki Hayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing same
- Patent number 6,844,659
- Issue date Jan 18, 2005
- NGK Insulators, Ltd.
- Koji Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing ceramic multi-layered board
- Patent number 6,811,634
- Issue date Nov 2, 2004
- Matsushita Electric Industrial Co., Ltd.
- Akira Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC CARRIER SUBSTRATE AND POWER MODULE
- Publication number 20230051374
- Publication date Feb 16, 2023
- ROBERT BOSCH GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20210243902
- Publication date Aug 5, 2021
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE INSULATING PASTE AND ELECTRONIC COMPONENT
- Publication number 20210096464
- Publication date Apr 1, 2021
- Murata Manufacturing Co., Ltd.
- Kenta KONDO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
WIRING BOARD AND PLANAR TRANSFORMER
- Publication number 20190090347
- Publication date Mar 21, 2019
- NGK Spark Plug Co., Ltd.
- Masahito MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFAC...
- Publication number 20190089044
- Publication date Mar 21, 2019
- SnapTrack, Inc.
- Hisashi KOBUKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE AND MULTILAYER BOARD USING THE SAME
- Publication number 20170358381
- Publication date Dec 14, 2017
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hajime NAKAZONO
- C07 - ORGANIC CHEMISTRY
Information Patent Application
MULTILAYER CIRCUIT BOARD AND INSPECTION APPARATUS INCLUDING THE SAME
- Publication number 20160323996
- Publication date Nov 3, 2016
- MURATA MANUFACTURING CO., LTD.
- Tadaji Takemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC PRINTED CIRCUIT BOARD STRUCTURE
- Publication number 20130068508
- Publication date Mar 21, 2013
- JINGDEZHEN FARED TECHNOLOGY CO., LTD.
- Jeong-Shiun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Screening Process for Manufacturing a Z-directed Component for a Pr...
- Publication number 20130052338
- Publication date Feb 28, 2013
- Paul Kevin Hall
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHOD FOR FORMING CIRCUIT PATTERNS ON SURFACE OF SUBSTRATE
- Publication number 20110318886
- Publication date Dec 29, 2011
- NATIONAL PINGTUNG UNIVERSITY OF SCIENCE & TECHNOLOGY
- LUNG-CHUAN TSAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...
- Publication number 20110133342
- Publication date Jun 9, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER THICK-FILM RF PACKAGE
- Publication number 20110117705
- Publication date May 19, 2011
- MICROSEMI CORPORATION
- Benjamin A. Samples
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE PRODUCTION OF A CERAMIC MULTILAYER CIRCUIT ARRANGEME...
- Publication number 20100187000
- Publication date Jul 29, 2010
- ROBERT BOSCH GmbH
- Juergen Egerter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a metal-ceramic substrate for electric circuit...
- Publication number 20100186231
- Publication date Jul 29, 2010
- Jurgen Schulz-Harder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING METALLIZED CERAMICS SUBSTRATE, METALLIZED CE...
- Publication number 20100178461
- Publication date Jul 15, 2010
- Yasuyuki Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitive substrate and method of making same
- Publication number 20090206051
- Publication date Aug 20, 2009
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHR...
- Publication number 20090114434
- Publication date May 7, 2009
- Samsung Electro-Mechnics Co., Ltd.
- Min Ji Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT DEVICES AND MANUFACTURING METHODS USING ELECTROP...
- Publication number 20090098643
- Publication date Apr 16, 2009
- MEDTRONIC MINIMED, INC.
- John J. Mastrototaro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Metallized Ceramic Substrate
- Publication number 20080131673
- Publication date Jun 5, 2008
- Yasuyuki Yamamoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CIRCUIT BOARD
- Publication number 20080093114
- Publication date Apr 24, 2008
- Yu-Tuan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20080026592
- Publication date Jan 31, 2008
- MEDTRONIC MINIMED, INC.
- Rajiv Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitive substrate and method of making same
- Publication number 20070275525
- Publication date Nov 29, 2007
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor composition for use in LTCC photosensitive tape on substr...
- Publication number 20070023388
- Publication date Feb 1, 2007
- Kumaran Manikantan Nair
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer ceramic electronic component and production method thereof
- Publication number 20060213603
- Publication date Sep 28, 2006
- Kwi-Jong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processes for planarizing substrates and encapsulating printable el...
- Publication number 20060160373
- Publication date Jul 20, 2006
- Cabot Corporation
- Mark H. Kowalski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate for electric circuits or modules, method fo...
- Publication number 20060103005
- Publication date May 18, 2006
- Jurgen Schulz-Harder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thick film dielectric compositions for use on aluminum nitride subs...
- Publication number 20060083906
- Publication date Apr 20, 2006
- Yong Cho
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Methods and apparatus for printing conductive thickfilms over thick...
- Publication number 20050195052
- Publication date Sep 8, 2005
- Lewis R. Dove
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer ceramic electronic part, circuit board and method for pr...
- Publication number 20050194084
- Publication date Sep 8, 2005
- TDK Corporation
- Masayuki Yoshida
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Thick film dielectric compositions for use on aluminum nitride subs...
- Publication number 20050031837
- Publication date Feb 10, 2005
- Yong Cho
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

characterized by using an inorganic intermediate insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic carrier substrate and power module

Photosensitive insulating paste and electronic component

Additive manufactured 3D electronic substrate

Composite part with integral electronic instrumentation circuit and...

Wiring board

Conductive paste and multilayer board using the same

Multilayer wiring substrate, manufacturing method therefor, and sub...

Multi-layer substrates including thin film signal lines

Layered manufacturing of free-form multi-material micro-components

High speed differential wiring in glass ceramic MCMS

High speed differential wiring in glass ceramic MCMS

Method for the production of a ceramic multilayer circuit arrangement

Wiring board, manufacturing method of the wiring board, and semicon...

Method for fabricating metallized ceramics substrate, metallized ce...

Multi-layer thick-film RF package

Method for producing a metal-ceramic substrate for electric circuit...

Capacitive substrate

Capacitive substrate and method of making same

Multilayer substrate

Metal-ceramic substrate for electric circuits or modules, method fo...

Multilayer substrate

Multilayer ceramic electronic part, circuit board and method for pr...

Multilayer circuit component and method for manufacturing the same

Multilayer composite and method for preparing the same

Thick film dielectric compositions for use on aluminum nitride subs...

Thick film dielectric compositions for use on aluminum nitride subs...

Methods and apparatus for printing conductive thickfilms over thick...

Multilayer ceramic substrate utilizing an intaglio plate with a plu...

Wiring board and method of manufacturing same

Method for manufacturing ceramic multi-layered board

Patents Applicationslast 30 patents

CERAMIC CARRIER SUBSTRATE AND POWER MODULE

WIRING BOARD

PHOTOSENSITIVE INSULATING PASTE AND ELECTRONIC COMPONENT

WIRING BOARD AND PLANAR TRANSFORMER

MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFAC...

CONDUCTIVE PASTE AND MULTILAYER BOARD USING THE SAME

MULTILAYER CIRCUIT BOARD AND INSPECTION APPARATUS INCLUDING THE SAME

CERAMIC PRINTED CIRCUIT BOARD STRUCTURE

Screening Process for Manufacturing a Z-directed Component for a Pr...

METHOD FOR FORMING CIRCUIT PATTERNS ON SURFACE OF SUBSTRATE

WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...

MULTI-LAYER THICK-FILM RF PACKAGE

METHOD FOR THE PRODUCTION OF A CERAMIC MULTILAYER CIRCUIT ARRANGEME...

Method for producing a metal-ceramic substrate for electric circuit...

METHOD FOR FABRICATING METALLIZED CERAMICS SUBSTRATE, METALLIZED CE...

Capacitive substrate and method of making same

METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHR...

MULTILAYER CIRCUIT DEVICES AND MANUFACTURING METHODS USING ELECTROP...

Method for Producing Metallized Ceramic Substrate

CIRCUIT BOARD

MULTILAYER SUBSTRATE

Capacitive substrate and method of making same

Conductor composition for use in LTCC photosensitive tape on substr...

Multi-layer ceramic electronic component and production method thereof

Processes for planarizing substrates and encapsulating printable el...

Metal-ceramic substrate for electric circuits or modules, method fo...

Thick film dielectric compositions for use on aluminum nitride subs...

Methods and apparatus for printing conductive thickfilms over thick...

Multilayer ceramic electronic part, circuit board and method for pr...

Thick film dielectric compositions for use on aluminum nitride subs...