Chemical vapour deposition

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CPC
H05K2203/1338

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1338Chemical vapour deposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process for laminating graphene-coated printed circuit boards
- Patent number 12,004,308
- Issue date Jun 4, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Protective coating
- Patent number 11,786,930
- Issue date Oct 17, 2023
- Shailendra Vikram Singh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Arrays of light emitters and methods of forming thereof
- Patent number 11,682,746
- Issue date Jun 20, 2023
- DIFTEK LASERS, INC.
- Douglas R. Dykaar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable, printable, patterned sheet of high mobility graphene on f...
- Patent number 11,546,987
- Issue date Jan 3, 2023
- The Trustees of the University of Pennsylvania
- Alan T Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Encapsulation of downhole microelectronics and method the same
- Patent number 10,897,824
- Issue date Jan 19, 2021
- Baker Hughes, a GE company, LLC
- Aleksey Reiderman
- E21 - EARTH DRILLING MINING
Information Patent Grant
Evacuated core circuit board
- Patent number 10,670,255
- Issue date Jun 2, 2020
- Thin Thermal Exchange Pte. Ltd.
- Aldo Contarino
- F21 - LIGHTING
Information Patent Grant
Micro-fabricated group electroplating technique
- Patent number 10,617,011
- Issue date Apr 7, 2020
- California Institute of Technology
- Yu-Chong Tai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure comprising an inductor and resistor
- Patent number 10,586,774
- Issue date Mar 10, 2020
- Rohm Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable, printable, patterned sheet of high mobility graphene on f...
- Patent number 10,165,679
- Issue date Dec 25, 2018
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waterproof structure for implanted electronic device
- Patent number 10,070,535
- Issue date Sep 4, 2018
- GiMer Medical Co., Ltd.
- Chi-Heng Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scalable, printable, patterned sheet of high mobility graphene on f...
- Patent number 9,930,777
- Issue date Mar 27, 2018
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof structure for implanted electronic device
- Patent number 9,848,497
- Issue date Dec 19, 2017
- GiMer Medical Co., Ltd.
- Chi-Heng Chang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Long-term packaging for the protection of implant electronics
- Patent number 9,781,842
- Issue date Oct 3, 2017
- California Institute of Technology
- Yu-Chong Tai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for forming thin film conductors on a substrate
- Patent number 9,743,516
- Issue date Aug 22, 2017
- NCC Nano, LLC
- Andrew E. Edd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic chuck for high temperature process applications
- Patent number 9,711,386
- Issue date Jul 18, 2017
- Applied Materials, Inc.
- Michael S. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for applying protective coatings to internal surfaces of fu...
- Patent number 9,596,794
- Issue date Mar 14, 2017
- HZO, INC.
- Blake Stevens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic substrate, and method of manufacturing the same
- Patent number 9,338,897
- Issue date May 10, 2016
- NGK Spark Plug Co., Ltd.
- Yuma Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming copper wiring
- Patent number 9,101,067
- Issue date Aug 4, 2015
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating process of structure with embedded circuit
- Patent number 8,187,478
- Issue date May 29, 2012
- Unimicron Technology Corp.
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for selective deposition and devices
- Patent number 8,168,546
- Issue date May 1, 2012
- Eastman Kodak Company
- David H. Levy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 8,069,560
- Issue date Dec 6, 2011
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer wiring board
- Patent number 7,690,109
- Issue date Apr 6, 2010
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for modifying circuit within substrate
- Patent number 7,422,970
- Issue date Sep 9, 2008
- Integrated Service Technology Inc.
- Wei-Been Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and manufacture method thereof
- Patent number 7,091,589
- Issue date Aug 15, 2006
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure having laser ablated features and method of fabricating
- Patent number 6,919,514
- Issue date Jul 19, 2005
- International Business Machines Corporation
- John Joseph Konrad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing via-connections in a substrate and substrate e...
- Patent number 6,756,304
- Issue date Jun 29, 2004
- Thales Avionics S.A.
- Philippe Robert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure having laser ablated features and method of fabricating
- Patent number 6,730,857
- Issue date May 4, 2004
- International Business Machines Corporation
- John Joseph Konrad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for reducing signal timing skew on a printed c...
- Patent number 6,675,313
- Issue date Jan 6, 2004
- Micron Technology, Inc.
- David Cuthbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanolaminated thin film circuitry materials
- Patent number 6,632,591
- Issue date Oct 14, 2003
- Andrew T. Hunt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20230337358
- Publication date Oct 19, 2023
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF PRODUCING WIRING BOARD
- Publication number 20230254983
- Publication date Aug 10, 2023
- TOPPAN INC.
- Takeshi TAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS
- Publication number 20220377912
- Publication date Nov 24, 2022
- MELLANOX TECHNOLOGIES, LTD.
- Boaz ATIAS
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20220078908
- Publication date Mar 10, 2022
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAYS OF LIGHT EMITTERS AND METHODS OF FORMING THEREOF
- Publication number 20210098648
- Publication date Apr 1, 2021
- DIFTEK LASERS, INC.
- Douglas R. DYKAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION OF DOWNHOLE MICROELECTRONICS
- Publication number 20190132959
- Publication date May 2, 2019
- BAKER HUGHES, A GE COMPANY, LLC
- Aleksey Reiderman
- E21 - EARTH DRILLING MINING
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20190116666
- Publication date Apr 18, 2019
- The Trustees of the University of Pennsylvania
- Alan T. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190090358
- Publication date Mar 21, 2019
- Semblant Limited
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190037705
- Publication date Jan 31, 2019
- Semblant Limited
- Shailendra Vikram SINGH
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Scalable, Printable, Patterned Sheet of High Mobility Graphene On F...
- Publication number 20180160530
- Publication date Jun 7, 2018
- The Trustees of the University of Pennsylvania
- Alan T. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERPROOF STRUCTURE FOR IMPLANTED ELECTRONIC DEVICE
- Publication number 20180042120
- Publication date Feb 8, 2018
- GiMer Medical Co., Ltd.
- Chi-Heng CHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WATERPROOF STRUCTURE FOR IMPLANTED ELECTRONIC DEVICE
- Publication number 20170135225
- Publication date May 11, 2017
- GiMer Medical Co., Ltd.
- Chi-Heng CHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SCALABLE, PRINTABLE, PATTERNED SHEET OF HIGH MOBILITY GRAPHENE ON F...
- Publication number 20170048975
- Publication date Feb 16, 2017
- The Trustees of the University of Pennsylvania
- Alan T. JOHNSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF...
- Publication number 20160014878
- Publication date Jan 14, 2016
- Rogers Corporation
- Brett W. Kilhenny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Repairing Process For Barrier Layer
- Publication number 20150201501
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING COPPER WIRING
- Publication number 20140175046
- Publication date Jun 26, 2014
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140166346
- Publication date Jun 19, 2014
- NGK Spark Plug Co., Ltd.
- Yuma OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR APPLYING PROTECTIVE COATINGS TO INTERNAL SU...
- Publication number 20140160650
- Publication date Jun 12, 2014
- HZO, INC.
- Blake Stevens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING THIN FILM CONDUCTORS ON A SUBSTRATE
- Publication number 20140154427
- Publication date Jun 5, 2014
- NCC NANO, LLC
- ANDREW E. EDD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...
- Publication number 20140102767
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR APPLYING PROTECTIVE COATINGS TO INTERNAL SU...
- Publication number 20130335898
- Publication date Dec 19, 2013
- Blake Stevens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PREVENTING CONDUCTIVE ANODIC FILAMENT (CAF) FORMATION BY SEALING DI...
- Publication number 20130052409
- Publication date Feb 28, 2013
- International Business Machines Corporation
- Gregory E. Balcome
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR SELECTIVE DEPOSITION AND DEVICES
- Publication number 20110120757
- Publication date May 26, 2011
- David H. Levy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF
- Publication number 20110035939
- Publication date Feb 17, 2011
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING PROCESS OF STRUCTURE WITH EMBEDDED CIRCUIT
- Publication number 20090301997
- Publication date Dec 10, 2009
- Unimicron Technology Corp.
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PATTERNING OF CONDUCTIVE POLYMER
- Publication number 20090114430
- Publication date May 7, 2009
- Industry Academic Cooperation Foundation of Kukmin University
- Jin Yeol KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate and manufacturing method thereof
- Publication number 20080012120
- Publication date Jan 17, 2008
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for modifying circuit within substrate
- Publication number 20070166842
- Publication date Jul 19, 2007
- Wei-Been Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chemical vapour deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process for laminating graphene-coated printed circuit boards

Protective coating

Arrays of light emitters and methods of forming thereof

Scalable, printable, patterned sheet of high mobility graphene on f...

Methods and processes for forming electrical circuitries on three-d...

Encapsulation of downhole microelectronics and method the same

Evacuated core circuit board

Micro-fabricated group electroplating technique

Structure comprising an inductor and resistor

Scalable, printable, patterned sheet of high mobility graphene on f...

Waterproof structure for implanted electronic device

Scalable, printable, patterned sheet of high mobility graphene on f...

Waterproof structure for implanted electronic device

Long-term packaging for the protection of implant electronics

Method for forming thin film conductors on a substrate

Electrostatic chuck for high temperature process applications

Methods for applying protective coatings to internal surfaces of fu...

Ceramic substrate, and method of manufacturing the same

Method for forming copper wiring

Fabricating process of structure with embedded circuit

Method for selective deposition and devices

Method of manufacturing multilayer wiring board

Method of manufacturing a multilayer wiring board

Method for modifying circuit within substrate

Multilayer wiring board and manufacture method thereof

Structure having laser ablated features and method of fabricating

Method for producing via-connections in a substrate and substrate e...

Structure having laser ablated features and method of fabricating

Method and apparatus for reducing signal timing skew on a printed c...

Nanolaminated thin film circuitry materials

Patents Applicationslast 30 patents

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

WIRING BOARD AND METHOD OF PRODUCING WIRING BOARD

PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

ARRAYS OF LIGHT EMITTERS AND METHODS OF FORMING THEREOF

ENCAPSULATION OF DOWNHOLE MICROELECTRONICS

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

COATED ELECTRICAL ASSEMBLY

COATED ELECTRICAL ASSEMBLY

Scalable, Printable, Patterned Sheet of High Mobility Graphene On F...

WATERPROOF STRUCTURE FOR IMPLANTED ELECTRONIC DEVICE

WATERPROOF STRUCTURE FOR IMPLANTED ELECTRONIC DEVICE

SCALABLE, PRINTABLE, PATTERNED SHEET OF HIGH MOBILITY GRAPHENE ON F...

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF...

Selective Repairing Process For Barrier Layer

METHOD FOR FORMING COPPER WIRING

CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR APPLYING PROTECTIVE COATINGS TO INTERNAL SU...

METHOD FOR FORMING THIN FILM CONDUCTORS ON A SUBSTRATE

MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...

SYSTEMS AND METHODS FOR APPLYING PROTECTIVE COATINGS TO INTERNAL SU...

PREVENTING CONDUCTIVE ANODIC FILAMENT (CAF) FORMATION BY SEALING DI...

METHOD FOR SELECTIVE DEPOSITION AND DEVICES

MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF

FABRICATING PROCESS OF STRUCTURE WITH EMBEDDED CIRCUIT

METHOD FOR PATTERNING OF CONDUCTIVE POLYMER

Multilayer wiring substrate and manufacturing method thereof

Method for modifying circuit within substrate