Clamping a component by an element or a set of elements

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CPC
H05K2201/10393

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10393Clamping a component by an element or a set of elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Motor fan and guard for directing coolant air
- Patent number 12,160,158
- Issue date Dec 3, 2024
- Nidec Motor Corporation
- Richard L. Eason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory card and memory system
- Patent number 12,136,606
- Issue date Nov 5, 2024
- Kioxia Corporation
- Yuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interface terminal having outer shell a...
- Patent number 12,126,122
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Juho Yi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heatsink clamp for multiple electronic components
- Patent number 12,127,378
- Issue date Oct 22, 2024
- Nidec Motor Corporation
- James L. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring device having a plurality of protrusions
- Patent number 12,119,574
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Kenichi Agawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure between printed circuit board and terminal blo...
- Patent number 11,955,739
- Issue date Apr 9, 2024
- Daikin Industries, Ltd.
- Kazunari Fukagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics-to-textile interconnection method and system
- Patent number 11,943,863
- Issue date Mar 26, 2024
- Michelle Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slider-based HBA internal lock
- Patent number 11,839,029
- Issue date Dec 5, 2023
- Hewlett Packard Enterprise Development LP
- Warren A. Kartadinata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless BGA interconnect
- Patent number 11,811,182
- Issue date Nov 7, 2023
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling device, assembly and method
- Patent number 11,728,607
- Issue date Aug 15, 2023
- MD Elektronik GmbH
- Thomas Halbig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screw boss assembly
- Patent number 11,664,614
- Issue date May 30, 2023
- Dell Products L.P.
- Spike Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor component, pre-assembly arrangement for a sensor component,...
- Patent number 11,536,594
- Issue date Dec 27, 2022
- Vitesco Technologies Germany GmbH
- Jürgen Rietsch
- G01 - MEASURING TESTING
Information Patent Grant
Implantable connector including at least one electrical component
- Patent number 11,450,977
- Issue date Sep 20, 2022
- Verily Life Sciences LLC
- Kedar Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,439,018
- Issue date Sep 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic matrix connector for high density, soft neural interface
- Patent number 11,417,987
- Issue date Aug 16, 2022
- Northeastern University
- Hui Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,412,618
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation assembly of M.2 expansion card and electronic device
- Patent number 11,191,149
- Issue date Nov 30, 2021
- Giga-Byte Technology Co., Ltd.
- Yuan-Li Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner module with a retainer
- Patent number 11,178,766
- Issue date Nov 16, 2021
- Concraft Holding Co., Ltd.
- Chin-Hsing Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermal conductivity for integrated circuit packaging
- Patent number 11,147,153
- Issue date Oct 12, 2021
- Intel Corporation
- Brian J. Long
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and method for producing the printed circuit...
- Patent number 11,134,565
- Issue date Sep 28, 2021
- ENDRESS+HAUSER SE+CO.KG
- Harald Schäuble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Keyboard device
- Patent number 11,107,649
- Issue date Aug 31, 2021
- Chicony Electronics Co., Ltd.
- Mitsuo Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink fastening mechanism for use with electrical connector
- Patent number 11,109,477
- Issue date Aug 31, 2021
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- Heng-Kang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Keyboard device
- Patent number 11,094,480
- Issue date Aug 17, 2021
- Chicony Electronics Co., Ltd.
- Mitsuo Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning fastener
- Patent number 11,018,452
- Issue date May 25, 2021
- Hanwit Precision Industries Ltd.
- Ming-De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Securing mechanism for use with processor module
- Patent number 10,993,326
- Issue date Apr 27, 2021
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- Heng-Kang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance heat sink for double sided printed circuit boards
- Patent number 10,986,722
- Issue date Apr 20, 2021
- Goodrich Corporation
- Philippe Lapujade
- F21 - LIGHTING
Information Patent Grant
Memory module connector, memory module, and pivotable latch
- Patent number 10,950,958
- Issue date Mar 16, 2021
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module, power module assembly and assembling method thereof
- Patent number 10,917,999
- Issue date Feb 9, 2021
- DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
- Zhenrong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable socket connector assembly for an electronic
- Patent number 10,910,748
- Issue date Feb 2, 2021
- TE Connectivity Corporation
- Jeffery Walter Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bi-directional heatsink dampening force system
- Patent number 10,903,140
- Issue date Jan 26, 2021
- Cisco Technology, Inc.
- Phil Slight
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR PCB FIXATION WITH BATTERY TABS IN A HOUSING
- Publication number 20250107002
- Publication date Mar 27, 2025
- Continental Automotive Technologies GmbH
- Ilie Atanasoe
- B60 - VEHICLES IN GENERAL
Information Patent Application
ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF
- Publication number 20240314918
- Publication date Sep 19, 2024
- FIVETECH TECHNOLOGY INC.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multicomponent Connector
- Publication number 20240292540
- Publication date Aug 29, 2024
- KYOCERA AVX Components Corporation
- Ronald Demcko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...
- Publication number 20240179834
- Publication date May 30, 2024
- Darwin Precisions Corporation
- Hsuan Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPRESSION STRUCTURES FOR IC PACKAGES
- Publication number 20240105639
- Publication date Mar 28, 2024
- Apple Inc.
- Helia Rahmani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIDER-BASED HBA INTERNAL LOCK
- Publication number 20230389182
- Publication date Nov 30, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Warren A. Kartadinata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREW BOSS ASSEMBLY
- Publication number 20230037468
- Publication date Feb 9, 2023
- Dell Products L.P.
- Spike Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER DEVICE FOR AN M.2 TYPE CONNECTOR
- Publication number 20230041681
- Publication date Feb 9, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Pascal GUYOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
- Publication number 20220374051
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- Kwangeun GO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONICS-TO-TEXTILE INTERCONNECTION METHOD AND SYSTEM
- Publication number 20220346227
- Publication date Oct 27, 2022
- Myant Inc.
- Michelle ZHENG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WIRING DEVICE
- Publication number 20220302615
- Publication date Sep 22, 2022
- Kabushiki Kaisha Toshiba
- Kenichi Agawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH AN EDGE STIFFENER STRUCTURE
- Publication number 20220217848
- Publication date Jul 7, 2022
- Intel Corporation
- Juha Tapani Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20220210919
- Publication date Jun 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220210920
- Publication date Jun 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COUPLING DEVICE, ASSEMBLY AND METHOD
- Publication number 20220059980
- Publication date Feb 24, 2022
- MD ELEKTRONIK GmbH
- Thomas Halbig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE BETWEEN PRINTED CIRCUIT BOARD AND TERMINAL BLO...
- Publication number 20220037814
- Publication date Feb 3, 2022
- DAIKIN INDUSTRIES, LTD.
- Kazunari Fukagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20210144840
- Publication date May 13, 2021
- Micron Technology, Inc.
- George E. Pax
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-MOUNTED SILICONE LENS
- Publication number 20210048593
- Publication date Feb 18, 2021
- CoreLED Systems, LLC
- Brian C. Wells
- G02 - OPTICS
Information Patent Application
KEYBOARD DEVICE
- Publication number 20200402746
- Publication date Dec 24, 2020
- CHICONY ELECTRONICS CO., LTD.
- Mitsuo HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK FASTENING MECHANISM FOR USE WITH ELECTRICAL CONNECTOR
- Publication number 20200396825
- Publication date Dec 17, 2020
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- HENG-KANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK FIXING MEMBER AND ELECTRONIC DEVICE
- Publication number 20200329551
- Publication date Oct 15, 2020
- Fujitsu Limited
- Tsuyoshi Yamamoto
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT BOARD HEAT DISSIPATION ASSEMBLY
- Publication number 20200296819
- Publication date Sep 17, 2020
- GIGA-BYTE TECHNOLOGY CO., LTD.
- Hung-Cheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20200245464
- Publication date Jul 30, 2020
- Kyocera Corporation
- Seiji HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING FASTENER
- Publication number 20200244008
- Publication date Jul 30, 2020
- HANWIT PRECISION INDUSTRIES LTD.
- Ming-De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEMALE FASTENER HOLDER FOR FIXING STRUCTURE AND FIXING STRUCTURE FO...
- Publication number 20200235036
- Publication date Jul 23, 2020
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTABLE CONNECTOR INCLUDING AT LEAST ONE ELECTRICAL COMPONENT
- Publication number 20200220285
- Publication date Jul 9, 2020
- Verily Life Sciences LLC
- Kedar Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER MODULE WITH A RETAINER
- Publication number 20200205287
- Publication date Jun 25, 2020
- CONCRAFT HOLDING CO., LTD.
- Chin-Hsing LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR COMPONENT, PRE-ASSEMBLY ARRANGEMENT FOR A SENSOR COMPONENT,...
- Publication number 20200191619
- Publication date Jun 18, 2020
- Vitesco Technologies Germany GmbH
- Jürgen Rietsch
- G01 - MEASURING TESTING
Information Patent Application
SECURING MECHANISM FOR USE WITH PROCESSOR MODULE
- Publication number 20200178394
- Publication date Jun 4, 2020
- FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.
- HENG-KANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Clamping a component by an element or a set of elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Motor fan and guard for directing coolant air

Memory card and memory system

Electronic device including interface terminal having outer shell a...

Heatsink clamp for multiple electronic components

Wiring device having a plurality of protrusions

Connection structure between printed circuit board and terminal blo...

Electronics-to-textile interconnection method and system

Slider-based HBA internal lock

Solderless BGA interconnect

Coupling device, assembly and method

Screw boss assembly

Sensor component, pre-assembly arrangement for a sensor component,...

Implantable connector including at least one electrical component

Component carrier and method of manufacturing the same

Magnetic matrix connector for high density, soft neural interface

Component carrier and method of manufacturing the same

Heat dissipation assembly of M.2 expansion card and electronic device

Inner module with a retainer

Thermal conductivity for integrated circuit packaging

Printed circuit board and method for producing the printed circuit...

Keyboard device

Heat sink fastening mechanism for use with electrical connector

Keyboard device

Positioning fastener

Securing mechanism for use with processor module

High performance heat sink for double sided printed circuit boards

Memory module connector, memory module, and pivotable latch

Power module, power module assembly and assembling method thereof

Cable socket connector assembly for an electronic

Bi-directional heatsink dampening force system

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR PCB FIXATION WITH BATTERY TABS IN A HOUSING

ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF

Multicomponent Connector

DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...

COMPRESSION STRUCTURES FOR IC PACKAGES

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

SLIDER-BASED HBA INTERNAL LOCK

SCREW BOSS ASSEMBLY

STIFFENER DEVICE FOR AN M.2 TYPE CONNECTOR

ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD

ELECTRONICS-TO-TEXTILE INTERCONNECTION METHOD AND SYSTEM

WIRING DEVICE

PRINTED CIRCUIT BOARD WITH AN EDGE STIFFENER STRUCTURE

Component Carrier and Method of Manufacturing the Same

COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME

COUPLING DEVICE, ASSEMBLY AND METHOD

CONNECTION STRUCTURE BETWEEN PRINTED CIRCUIT BOARD AND TERMINAL BLO...

HEAT SPREADERS FOR SEMICONDUCTOR DEVICE MODULES

SURFACE-MOUNTED SILICONE LENS

KEYBOARD DEVICE

HEAT SINK FASTENING MECHANISM FOR USE WITH ELECTRICAL CONNECTOR

HEAT SINK FIXING MEMBER AND ELECTRONIC DEVICE

CIRCUIT BOARD HEAT DISSIPATION ASSEMBLY

MOUNTING STRUCTURE

POSITIONING FASTENER

FEMALE FASTENER HOLDER FOR FIXING STRUCTURE AND FIXING STRUCTURE FO...

IMPLANTABLE CONNECTOR INCLUDING AT LEAST ONE ELECTRICAL COMPONENT

INNER MODULE WITH A RETAINER

SENSOR COMPONENT, PRE-ASSEMBLY ARRANGEMENT FOR A SENSOR COMPONENT,...

SECURING MECHANISM FOR USE WITH PROCESSOR MODULE