Cleaning

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CPC
H01L21/4835

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4835Cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chemically anchored mold compounds in semiconductor packages
- Patent number 12,180,595
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods related to wire bond cleaning and wire bonding...
- Patent number 12,087,728
- Issue date Sep 10, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning process for source/drain epitaxial structures
- Patent number 11,854,831
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond cleaning method and wire bonding recovery process
- Patent number 11,302,669
- Issue date Apr 12, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating carrier for wafer level package by using lead...
- Patent number 11,227,775
- Issue date Jan 18, 2022
- HAESUNGDS CO., LTD.
- Dong Young Pyeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including roughening features
- Patent number 10,937,744
- Issue date Mar 2, 2021
- Infineon Technologies AG
- Wern Ken Daryl Wee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 10,297,536
- Issue date May 21, 2019
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system and method for providing a heated etching solution
- Patent number 9,911,631
- Issue date Mar 6, 2018
- Tel FSI, Inc.
- Kevin L Siefering
- G05 - CONTROLLING REGULATING
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 9,704,786
- Issue date Jul 11, 2017
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,704,844
- Issue date Jul 11, 2017
- Renesas Electronics Corporation
- Katsuhiko Funatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,601,415
- Issue date Mar 21, 2017
- Renesas Electronics Corporation
- Yasutomo Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip on leadframe semiconductor packaging structure and fabric...
- Patent number 9,502,337
- Issue date Nov 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,343,451
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Katsuhiko Funatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal surface treatment aqueous solution and method for inhibiting...
- Patent number 9,200,168
- Issue date Dec 1, 2015
- Rohm and Haas Electronic Materials LLC
- Yutaka Morii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,196,505
- Issue date Nov 24, 2015
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching metals
- Patent number 9,029,268
- Issue date May 12, 2015
- Dynaloy, LLC
- Richard Dalton Peters
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Joined body having an anti-corrosion film formed around a junction...
- Patent number 9,013,029
- Issue date Apr 21, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Minamio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal surface treatment aqueous solution and method for inhibiting...
- Patent number 8,591,638
- Issue date Nov 26, 2013
- Rohm and Haas Electronic Materials LLC
- Yutaka Morii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solution and process for increasing the solderability and corrosion...
- Patent number 8,491,713
- Issue date Jul 23, 2013
- Atotech Deutschland GmbH
- Jürgen Barthelmes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 8,450,856
- Issue date May 28, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame sulfur removal
- Patent number 8,440,507
- Issue date May 14, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and method of manufact...
- Patent number 8,435,867
- Issue date May 7, 2013
- Renesas Electronics Corporation
- Atsushi Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with the leads projected from sealing body
- Patent number 8,338,927
- Issue date Dec 25, 2012
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective removal of gold from a lead frame
- Patent number 8,114,706
- Issue date Feb 14, 2012
- Texas Instruments Incorporated
- Takahiko Kudoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor integrated circuit device
- Patent number 8,026,130
- Issue date Sep 27, 2011
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged integrated circuit having gold removed from a lead frame
- Patent number 7,956,445
- Issue date Jun 7, 2011
- Texas Instruments Incorporated
- Takahiko Kudoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated lead frame
- Patent number 7,887,928
- Issue date Feb 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Chao Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES
- Publication number 20240096646
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20230420340
- Publication date Dec 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20230411175
- Publication date Dec 21, 2023
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20230272536
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CLEANING AGENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230095013
- Publication date Mar 30, 2023
- Kabushiki Kaisha Toshiba
- Daisuke Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE SUPPORT SYSTEM FOR PLASMA TREATMENT AND METHOD OF USING T...
- Publication number 20230018842
- Publication date Jan 19, 2023
- Nordson Corporation
- Zhao JIANGANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...
- Publication number 20220336413
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COMPONENT
- Publication number 20220285252
- Publication date Sep 8, 2022
- MITSUI HIGH-TEC, INC.
- Kento KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20220208665
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES
- Publication number 20220165581
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...
- Publication number 20210098268
- Publication date Apr 1, 2021
- HAESUNG DS CO., LTD
- Dong Young PYEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200335431
- Publication date Oct 22, 2020
- Advanced Semiconductor Engineering, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ROUGHENING FEATURES
- Publication number 20200273813
- Publication date Aug 27, 2020
- INFINEON TECHNOLOGIES AG
- Wern Ken Daryl Wee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180076118
- Publication date Mar 15, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAWN LEADLESS PACKAGE HAVING WETTABLE FLANK LEADS
- Publication number 20180033647
- Publication date Feb 1, 2018
- TEXAS INSTRUMENTS INCORPORATED
- MOHAMAD ASHRAF BIN MOHD ARSHAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20170271245
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20170092569
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING SAME
- Publication number 20170025329
- Publication date Jan 26, 2017
- MITSUI HIGH-TEC, INC.
- Takahiro ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20160254214
- Publication date Sep 1, 2016
- RENESAS ELECTRONICS CORPORATON
- Yasutomo Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160233204
- Publication date Aug 11, 2016
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko Funatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ON LEADFRAME SEMICONDUCTOR PACKAGING STRUCTURE AND FABRIC...
- Publication number 20160126166
- Publication date May 5, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- LEI SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING GROUNDING SUBSTRATE FOR SEMICONDUCTOR DEVICE
- Publication number 20160102394
- Publication date Apr 14, 2016
- Shenyang Fortune Precision Equipment Co., Ltd.
- Tianying XIONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPOND...
- Publication number 20160099200
- Publication date Apr 7, 2016
- STMicroelectronics S.r.l.
- Laura Ceriati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING CAVITY PACKAGE
- Publication number 20160020177
- Publication date Jan 21, 2016
- Ubotic Company Limited
- Ming-Wa TAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20160005712
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20150262918
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20150214209
- Publication date Jul 30, 2015
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko Funatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR ETCHING METALS
- Publication number 20140141622
- Publication date May 22, 2014
- DYNALOY, LLC
- Richard Dalton Peters
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemically anchored mold compounds in semiconductor packages

Semiconductor package with nickel-silver pre-plated leadframe

Systems and methods related to wire bond cleaning and wire bonding...

Cleaning process for source/drain epitaxial structures

Semiconductor package with nickel-silver pre-plated leadframe

Wire bond cleaning method and wire bonding recovery process

Method of fabricating carrier for wafer level package by using lead...

Direct selective adhesion promotor plating

Semiconductor packages including roughening features

Direct selective adhesion promotor plating

Processing system and method for providing a heated etching solution

Direct selective adhesion promotor plating

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Flip-chip on leadframe semiconductor packaging structure and fabric...

Method of manufacturing semiconductor device

Metal surface treatment aqueous solution and method for inhibiting...

Semiconductor device and method of forming the same

Process for etching metals

Joined body having an anti-corrosion film formed around a junction...

Metal surface treatment aqueous solution and method for inhibiting...

Solution and process for increasing the solderability and corrosion...

Semiconductor device and method of forming the same

Lead frame sulfur removal

Method of manufacturing semiconductor device and method of manufact...

Semiconductor device with the leads projected from sealing body

Selective removal of gold from a lead frame

Method for manufacturing a semiconductor integrated circuit device

Packaged integrated circuit having gold removed from a lead frame

Coated lead frame

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

CLEANING AGENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WORKPIECE SUPPORT SYSTEM FOR PLASMA TREATMENT AND METHOD OF USING T...

SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...

METAL COMPONENT

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

CLEANING PROCESS FOR SOURCE/DRAIN EPITAXIAL STRUCTURES

METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING ROUGHENING FEATURES

Direct Selective Adhesion Promotor Plating

SEMICONDUCTOR DEVICE PACKAGE

SAWN LEADLESS PACKAGE HAVING WETTABLE FLANK LEADS

Direct Selective Adhesion Promotor Plating

Direct Selective Adhesion Promotor Plating

LEAD FRAME AND METHOD FOR MANUFACTURING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FLIP-CHIP ON LEADFRAME SEMICONDUCTOR PACKAGING STRUCTURE AND FABRIC...

METHOD FOR PREPARING GROUNDING SUBSTRATE FOR SEMICONDUCTOR DEVICE

ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPOND...

RADIO FREQUENCY SHIELDING CAVITY PACKAGE

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

Method of Manufacturing Semiconductor Device

PROCESS FOR ETCHING METALS