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H05K2201/09718

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09718Clearance holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise suppression structure for differential pair
- Patent number 11,877,385
- Issue date Jan 16, 2024
- First Hi-tec Enterprise Co., Ltd.
- Ching-Shan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for break out of interconnections for high-dens...
- Patent number 11,778,731
- Issue date Oct 3, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,546,983
- Issue date Jan 3, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter plate for HF structures
- Patent number 10,935,057
- Issue date Mar 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Jörg Langenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 10,849,218
- Issue date Nov 24, 2020
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board, and connection structure of multil...
- Patent number 10,548,220
- Issue date Jan 28, 2020
- Hosiden Corporation
- Hayato Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 10,455,689
- Issue date Oct 22, 2019
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 10,375,820
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for impedance compensation in printed circuit boards
- Patent number 10,154,581
- Issue date Dec 11, 2018
- Cray Inc.
- Andy Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board via configurations for high frequency signaling
- Patent number 9,986,634
- Issue date May 29, 2018
- Curtis-Wright Controls, Inc.
- Michael Rose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board with switching power supply capaci...
- Patent number 9,967,969
- Issue date May 8, 2018
- Hitachi, Ltd.
- Osamu Takahashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 9,955,567
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Base substrate which prevents burrs generated during the cutting pr...
- Patent number 9,913,381
- Issue date Mar 6, 2018
- Point Engineering Co., Ltd.
- Bum Mo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards and methods for manufacturing same
- Patent number 9,900,978
- Issue date Feb 20, 2018
- Peking University Founder Group Co., Ltd.
- Xinhong Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, electronic device, and wiring connection method
- Patent number 9,859,603
- Issue date Jan 2, 2018
- NEC Corporation
- Kazuhiro Kashiwakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 9,773,725
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a circuitized substrate
- Patent number 9,756,724
- Issue date Sep 5, 2017
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack structure of high frequency printed circuit board
- Patent number 9,686,863
- Issue date Jun 20, 2017
- Kuang Ying Computer Equipment Co., Ltd.
- Hsuan-Ho Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic field manipulation around vias
- Patent number 9,603,250
- Issue date Mar 21, 2017
- Fujitsu Limited
- Yasuo Hidaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attenuation reduction structure for high frequency signal connectio...
- Patent number 9,577,304
- Issue date Feb 21, 2017
- Advanced Flexible Circuits Co., Ltd.
- Chih-Heng Chuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board via configurations for high frequency signaling
- Patent number 9,560,741
- Issue date Jan 31, 2017
- Curtiss-Wright Controls, Inc.
- Michael Rose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector footprints in printed circuit board (PCB)
- Patent number 9,545,003
- Issue date Jan 10, 2017
- FCI Americas Technology LLC
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,466,891
- Issue date Oct 11, 2016
- Coriant Oy
- Antti Holma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Element housing package and mounting structure body
- Patent number 9,462,709
- Issue date Oct 4, 2016
- KYOCERA Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring boards having thermal management features and therma...
- Patent number 9,433,074
- Issue date Aug 30, 2016
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for a semiconductor device having differential sig...
- Patent number 9,330,992
- Issue date May 3, 2016
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,265,149
- Issue date Feb 16, 2016
- NEC Corporation
- Kazuhiro Kashiwakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct current capacitor module
- Patent number 9,236,189
- Issue date Jan 12, 2016
- Samhwa Capacitor Co., Ltd.
- Young Joo Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in capacitor
- Patent number 9,226,399
- Issue date Dec 29, 2015
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR
- Publication number 20240023227
- Publication date Jan 18, 2024
- FIRST HI-TEC ENTERPRISE Co., Ltd.
- Ching-Shan CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20230113153
- Publication date Apr 13, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20210076486
- Publication date Mar 11, 2021
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20200022252
- Publication date Jan 16, 2020
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20180324941
- Publication date Nov 8, 2018
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20180213636
- Publication date Jul 26, 2018
- JINWOO CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20140331482
- Publication date Nov 13, 2014
- JINWOO CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE PRINTED CIRCUIT BOARD
- Publication number 20140326495
- Publication date Nov 6, 2014
- Amphenol Corporation
- Jose Ricardo Paniagua
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MA...
- Publication number 20140318758
- Publication date Oct 30, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMA...
- Publication number 20140318829
- Publication date Oct 30, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR A SEMICONDUCTOR DEVICE HAVING DIFFERENTIAL SIG...
- Publication number 20140252612
- Publication date Sep 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED VIA CUTOUTS WITH GROUND REFERENCES
- Publication number 20140196941
- Publication date Jul 17, 2014
- FUJITSU LIMITED
- Yasuo Hidaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
- Publication number 20140190733
- Publication date Jul 10, 2014
- PEKING UNIVERSITY FOUNDER GROUP CO., LTD.
- George Dudnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS
- Publication number 20140182891
- Publication date Jul 3, 2014
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CURRENT CAPACITOR MODULE
- Publication number 20140085772
- Publication date Mar 27, 2014
- SAMHWA CAPACITOR CO., LTD.
- Young Joo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR DESIGNING SUBSTRATES HAVING REFERENCE PLANE VOIDS WITH S...
- Publication number 20140033146
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CI...
- Publication number 20140005818
- Publication date Jan 2, 2014
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Midplane Especially Applicable to an Orthogonal Architecture Electr...
- Publication number 20130337665
- Publication date Dec 19, 2013
- Amphenol Corporation
- Thomas S. COHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...
- Publication number 20130316534
- Publication date Nov 28, 2013
- International Business Machines Corporation
- Daniel Douriet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Structure for Multi-Gigahertz Signaling
- Publication number 20130299225
- Publication date Nov 14, 2013
- Shengli LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20130215587
- Publication date Aug 22, 2013
- Kenichi KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED WIRING SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20130215588
- Publication date Aug 22, 2013
- Fujitsu Limited
- Kenichi KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURED CIRCUIT BOARD AND METHOD
- Publication number 20130199834
- Publication date Aug 8, 2013
- FCI
- Jan De Geest
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIDPLANE ESPECIALLY APPLICABLE TO AN ORTHOGONAL ARCHITECTURE ELECTR...
- Publication number 20130112468
- Publication date May 9, 2013
- Thomas S. COHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...
- Publication number 20130033827
- Publication date Feb 7, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130008696
- Publication date Jan 10, 2013
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING LAMINATED DEVICE
- Publication number 20130011972
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT BOARD
- Publication number 20130000956
- Publication date Jan 3, 2013
- Furukawa Automotive Systems Inc.
- Yoshiyuki ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130003335
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS

Clearance holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mating backplane for high speed, high density electrical connector

Noise suppression structure for differential pair

Systems and methods for break out of interconnections for high-dens...

Mating backplane for high speed, high density electrical connector

Adapter plate for HF structures

Mating backplane for high speed, high density electrical connector

Multilayer printed wiring board, and connection structure of multil...

Mating backplane for high speed, high density electrical connector

Crosstalk reduction between signal layers in a multilayered package...

Method for impedance compensation in printed circuit boards

Circuit board via configurations for high frequency signaling

Multilayer printed circuit board with switching power supply capaci...

Crosstalk reduction between signal layers in a multilayered package...

Base substrate which prevents burrs generated during the cutting pr...

Printed circuit boards and methods for manufacturing same

Printed wiring board, electronic device, and wiring connection method

Coreless multi-layer circuit substrate with minimized pad capacitance

Method of making a circuitized substrate

Stack structure of high frequency printed circuit board

Electromagnetic field manipulation around vias

Attenuation reduction structure for high frequency signal connectio...

Circuit board via configurations for high frequency signaling

Connector footprints in printed circuit board (PCB)

Circuit board

Element housing package and mounting structure body

Printed wiring boards having thermal management features and therma...

Wiring substrate for a semiconductor device having differential sig...

Printed wiring board and method for manufacturing the same

Direct current capacitor module

Wiring board with built-in capacitor

Patents Applicationslast 30 patents

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

HIGH PERFORMANCE PRINTED CIRCUIT BOARD

COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MA...

PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMA...

WIRING SUBSTRATE FOR A SEMICONDUCTOR DEVICE HAVING DIFFERENTIAL SIG...

OPTIMIZED VIA CUTOUTS WITH GROUND REFERENCES

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS

DIRECT CURRENT CAPACITOR MODULE

SYSTEM FOR DESIGNING SUBSTRATES HAVING REFERENCE PLANE VOIDS WITH S...

IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CI...

Midplane Especially Applicable to an Orthogonal Architecture Electr...

FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...

Via Structure for Multi-Gigahertz Signaling

MULTILAYER WIRING BOARD AND ELECTRONIC DEVICE

MULTILAYERED WIRING SUBSTRATE AND ELECTRONIC APPARATUS

STRUCTURED CIRCUIT BOARD AND METHOD

MIDPLANE ESPECIALLY APPLICABLE TO AN ORTHOGONAL ARCHITECTURE ELECTR...

ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...

CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

METHOD OF PRODUCING LAMINATED DEVICE

HIGH-FREQUENCY CIRCUIT BOARD

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE