CMP chemical mechanical polishing of wafer

Industry

CPC
G05B2219/45232

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Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/45232CMP chemical mechanical polishing of wafer

Industries

Patents Grantslast 30 patents

Information Patent Grant
CMP polishing system and associated pilot management system
- Patent number 11,397,425
- Issue date Jul 26, 2022
- United Semiconductor (Xiamen) Co., Ltd.
- Zhen Yu Sui
- B24 - GRINDING POLISHING
Information Patent Grant
Display of spectra contour plots versus time for semiconductor proc...
- Patent number 10,948,900
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Selection of polishing parameters to generate removal or pressure p...
- Patent number 10,493,590
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Computer controlled work tool apparatus and method
- Patent number 10,289,096
- Issue date May 14, 2019
- Zeeko Limited
- David Walker
- B24 - GRINDING POLISHING
Information Patent Grant
High temperature silicon oxide atomic layer deposition technology
- Patent number 10,170,298
- Issue date Jan 1, 2019
- Applied Materials, Inc.
- Wenbo Yan
- G05 - CONTROLLING REGULATING
Information Patent Grant
Computer controlled work tool apparatus and method
- Patent number 9,952,585
- Issue date Apr 24, 2018
- Zeeko Limited
- David Walker
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint method using peak location of spectra contour plots versus...
- Patent number 9,886,026
- Issue date Feb 6, 2018
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
High temperature silicon oxide atomic layer deposition technology
- Patent number 9,875,888
- Issue date Jan 23, 2018
- Applied Materials, Inc.
- Wenbo Yan
- G05 - CONTROLLING REGULATING
Information Patent Grant
Polishing with pre deposition spectrum
- Patent number 9,811,077
- Issue date Nov 7, 2017
- Applied Materials, Inc.
- Tomohiko Kitajima
- G05 - CONTROLLING REGULATING
Information Patent Grant
Selecting reference libraries for monitoring of multiple zones on a...
- Patent number 8,954,186
- Issue date Feb 10, 2015
- Applied Materials, Inc.
- Jun Qian
- G05 - CONTROLLING REGULATING
Information Patent Grant
Selection of polishing parameters to generate removal profile
- Patent number 8,774,958
- Issue date Jul 8, 2014
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and program thereof
- Patent number 8,206,197
- Issue date Jun 26, 2012
- Ebara Corporation
- Hidetaka Nakao
- B24 - GRINDING POLISHING
Information Patent Grant
Algorithm for real-time process control of electro-polishing
- Patent number 7,628,905
- Issue date Dec 8, 2009
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced workpiece finishing
- Patent number 7,575,501
- Issue date Aug 18, 2009
- Beaver Creek Concepts Inc
- Charles J. Molnar
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization controller
- Patent number 7,437,206
- Issue date Oct 14, 2008
- SC Solutions, Inc.
- Dirk de Roover
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Extended Kalman filter incorporating offline metrology
- Patent number 7,329,168
- Issue date Feb 12, 2008
- Micron Technology, Inc.
- Jim Hofmann
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for prediction of polishing condition, and com...
- Patent number 7,289,872
- Issue date Oct 30, 2007
- Fujitsu Limited
- Daisuke Fukuda
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback controlled polishing processes
- Patent number 7,247,080
- Issue date Jul 24, 2007
- Applied Materials, Inc.
- Doyle E. Bennett
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Algorithm for real-time process control of electro-polishing
- Patent number 7,112,270
- Issue date Sep 26, 2006
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended kalman filter incorporating offline metrology
- Patent number 7,087,527
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Jim Hofmann
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization controller
- Patent number 7,050,880
- Issue date May 23, 2006
- SC Solutions
- Dirk de Roover
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Advanced wafer planarizing
- Patent number 7,037,172
- Issue date May 2, 2006
- Beaver Creek Concepts Inc
- Charles J. Molnar
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback controlled polishing processes
- Patent number 7,024,268
- Issue date Apr 4, 2006
- Applied Materials Inc.
- Doyle E. Bennett
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for adjusting processing parameters of at least one plate-sh...
- Patent number 6,892,108
- Issue date May 10, 2005
- Infineon Technologies SC300 GmbH & Co. KG
- Karl Mautz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and tool for data mining in automatic decision making systems
- Patent number 6,820,070
- Issue date Nov 16, 2004
- Insyst Ltd.
- Arnold J. Goldman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,739,944
- Issue date May 25, 2004
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Run-to-run control over semiconductor processing tool based upon mi...
- Patent number 6,625,513
- Issue date Sep 23, 2003
- Applied Materials, Inc.
- Dimitris Lymberopoulos
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,488,566
- Issue date Dec 3, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,560
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,561
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION PROCESSING DEVICE, SUBSTRATE PROCESSING DEVICE, AND INF...
- Publication number 20240302817
- Publication date Sep 12, 2024
- EBARA CORPORATION
- HIROFUMI OTAKI
- G05 - CONTROLLING REGULATING
Information Patent Application
PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTIN...
- Publication number 20240123566
- Publication date Apr 18, 2024
- SUMCO CORPORATION
- Yuji MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20230411227
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Nan. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP POLISHING SYSTEM AND ASSOCIATED PILOT MANAGEMENT SYSTEM
- Publication number 20210271232
- Publication date Sep 2, 2021
- United Semiconductor (Xiamen) Co., Ltd.
- ZHEN YU SUI
- G05 - CONTROLLING REGULATING
Information Patent Application
COMPUTER CONTROLLED WORK TOOL APPARATUS AND METHOD
- Publication number 20180203432
- Publication date Jul 19, 2018
- Zeeko Limited
- David Walker
- B24 - GRINDING POLISHING
Information Patent Application
Display of Spectra Contour Plots Versus Time For Semiconductor Proc...
- Publication number 20180113440
- Publication date Apr 26, 2018
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
High Temperature Silicon Oxide Atomic Layer Deposition Technology
- Publication number 20180076023
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Wenbo Yan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selection of Polishing Parameters to Generate Removal or Pressure P...
- Publication number 20160096251
- Publication date Apr 7, 2016
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING WITH PRE DEPOSITION SPECTRUM
- Publication number 20160018815
- Publication date Jan 21, 2016
- Applied Materials, Inc.
- Tomohiko Kitajima
- G05 - CONTROLLING REGULATING
Information Patent Application
ADJUSTMENT APPARATUS FOR ADJUSTING PROCESSING UNITS PROVIDED IN A S...
- Publication number 20150241866
- Publication date Aug 27, 2015
- EBARA CORPORATION
- Koichi TAKEDA
- G05 - CONTROLLING REGULATING
Information Patent Application
ENDPOINT METHOD USING PEAK LOCATION OF SPECTRA CONTOUR PLOTS VERSUS...
- Publication number 20150160649
- Publication date Jun 11, 2015
- Applied Materials, Inc.
- Jeffrey Drue David
- G05 - CONTROLLING REGULATING
Information Patent Application
Selection of Polishing Parameters to Generate Removal or Pressure P...
- Publication number 20140277670
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE
- Publication number 20120277897
- Publication date Nov 1, 2012
- Huanbo Zhang
- G05 - CONTROLLING REGULATING
Information Patent Application
Selecting Reference Libraries For Monitoring Of Multiple Zones On A...
- Publication number 20120028813
- Publication date Feb 2, 2012
- Applied Materials, Inc.
- Jun Qian
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for Controlling Polishing Wafer
- Publication number 20110195636
- Publication date Aug 11, 2011
- United Microelectronics Corporation
- Ji-Gang PAN
- G05 - CONTROLLING REGULATING
Information Patent Application
COMPUTER CONTROLLED WORK TOOL APPARATUS AND METHOD
- Publication number 20110190922
- Publication date Aug 4, 2011
- ZEEKO LIMITED
- David Walker
- G05 - CONTROLLING REGULATING
Information Patent Application
ENDPOINT METHOD USING PEAK LOCATION OF SPECTRA CONTOUR PLOTS VERSUS...
- Publication number 20110104987
- Publication date May 5, 2011
- Jeffrey Drue David
- G05 - CONTROLLING REGULATING
Information Patent Application
POLISHING APPARATUS AND PROGRAM THEREOF
- Publication number 20100130103
- Publication date May 27, 2010
- Hidetaka Nakao
- G05 - CONTROLLING REGULATING
Information Patent Application
Monitoring Device of Chemical Mechanical Polishing Apparatus
- Publication number 20070149094
- Publication date Jun 28, 2007
- Jae Young Choi
- G05 - CONTROLLING REGULATING
Information Patent Application
EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY
- Publication number 20060246820
- Publication date Nov 2, 2006
- Micron Technology, Inc.
- Jim Hofmann
- G05 - CONTROLLING REGULATING
Information Patent Application
Algorithm for real-time process control of electro-polishing
- Publication number 20060237330
- Publication date Oct 26, 2006
- APPLIED MATERIALS, INC.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY
- Publication number 20060191870
- Publication date Aug 31, 2006
- Micron Technology, Inc.
- Jim Hofmann
- G05 - CONTROLLING REGULATING
Information Patent Application
ALGORITHM FOR REAL-TIME PROCESS CONTROL OF ELECTRO-POLISHING
- Publication number 20060163074
- Publication date Jul 27, 2006
- APPLIED MATERIALS, INC.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chemical-mechanical planarization controller
- Publication number 20060106479
- Publication date May 18, 2006
- Dirk de Roover
- G05 - CONTROLLING REGULATING
Information Patent Application
Extended kalman filter incorporating offline metrology
- Publication number 20050284569
- Publication date Dec 29, 2005
- Micron Technology, Inc.
- Jim Hofmann
- G05 - CONTROLLING REGULATING
Information Patent Application
Chemical-mechanical planarization controller
- Publication number 20050143852
- Publication date Jun 30, 2005
- Dirk de Roover
- G05 - CONTROLLING REGULATING
Information Patent Application
Intergrated micro-optical and photonics elements batch preparation...
- Publication number 20040237331
- Publication date Dec 2, 2004
- Ory Sarfaty
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for adjusting processing parameters of at least one plate-sh...
- Publication number 20040125191
- Publication date Jul 1, 2004
- Karl Mautz
- G05 - CONTROLLING REGULATING
Information Patent Application
Extended kalman filter incorporating offline metrology
- Publication number 20040043700
- Publication date Mar 4, 2004
- Jim Hofmann
- G05 - CONTROLLING REGULATING
Information Patent Application
Polishing device and method of manufacturing semiconductor device
- Publication number 20040029333
- Publication date Feb 12, 2004
- Eiji Matsukawa
- G05 - CONTROLLING REGULATING

CMP chemical mechanical polishing of wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

CMP polishing system and associated pilot management system

Display of spectra contour plots versus time for semiconductor proc...

Selection of polishing parameters to generate removal or pressure p...

Computer controlled work tool apparatus and method

High temperature silicon oxide atomic layer deposition technology

Computer controlled work tool apparatus and method

Endpoint method using peak location of spectra contour plots versus...

High temperature silicon oxide atomic layer deposition technology

Polishing with pre deposition spectrum

Selecting reference libraries for monitoring of multiple zones on a...

Selection of polishing parameters to generate removal profile

Polishing apparatus and program thereof

Algorithm for real-time process control of electro-polishing

Advanced workpiece finishing

Chemical-mechanical planarization controller

Extended Kalman filter incorporating offline metrology

Method and apparatus for prediction of polishing condition, and com...

Feedback controlled polishing processes

Algorithm for real-time process control of electro-polishing

Extended kalman filter incorporating offline metrology

Chemical-mechanical planarization controller

Advanced wafer planarizing

Feedback controlled polishing processes

Method for adjusting processing parameters of at least one plate-sh...

Method and tool for data mining in automatic decision making systems

System for real-time control of semiconductor wafer polishing

Run-to-run control over semiconductor processing tool based upon mi...

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

Patents Applicationslast 30 patents

INFORMATION PROCESSING DEVICE, SUBSTRATE PROCESSING DEVICE, AND INF...

PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTIN...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

CMP POLISHING SYSTEM AND ASSOCIATED PILOT MANAGEMENT SYSTEM

COMPUTER CONTROLLED WORK TOOL APPARATUS AND METHOD

Display of Spectra Contour Plots Versus Time For Semiconductor Proc...

High Temperature Silicon Oxide Atomic Layer Deposition Technology

Selection of Polishing Parameters to Generate Removal or Pressure P...

POLISHING WITH PRE DEPOSITION SPECTRUM

ADJUSTMENT APPARATUS FOR ADJUSTING PROCESSING UNITS PROVIDED IN A S...

ENDPOINT METHOD USING PEAK LOCATION OF SPECTRA CONTOUR PLOTS VERSUS...

Selection of Polishing Parameters to Generate Removal or Pressure P...

SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE

Selecting Reference Libraries For Monitoring Of Multiple Zones On A...

Method for Controlling Polishing Wafer

COMPUTER CONTROLLED WORK TOOL APPARATUS AND METHOD

ENDPOINT METHOD USING PEAK LOCATION OF SPECTRA CONTOUR PLOTS VERSUS...

POLISHING APPARATUS AND PROGRAM THEREOF

Monitoring Device of Chemical Mechanical Polishing Apparatus

EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY

Algorithm for real-time process control of electro-polishing

EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY

ALGORITHM FOR REAL-TIME PROCESS CONTROL OF ELECTRO-POLISHING

Chemical-mechanical planarization controller

Extended kalman filter incorporating offline metrology

Chemical-mechanical planarization controller

Intergrated micro-optical and photonics elements batch preparation...

Method for adjusting processing parameters of at least one plate-sh...

Extended kalman filter incorporating offline metrology

Polishing device and method of manufacturing semiconductor device