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CMP end point analysis, measure parameters on points to detect end of polishing process

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Industry

  • CPC
  • G05B2219/49085
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Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/49085CMP end point analysis, measure parameters on points to detect end of polishing process
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