CMP end point analysis, measure parameters on points to detect end of polishing process

Industry

CPC
G05B2219/49085

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Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/49085CMP end point analysis, measure parameters on points to detect end of polishing process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,969,855
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,679,466
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,446,783
- Issue date Sep 20, 2022
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Adaptive endpoint method for pad life effect on chemical mechanical...
- Patent number 9,333,619
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu-An Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Adaptive endpoint method for pad life effect on chemical mechanical...
- Patent number 8,367,429
- Issue date Feb 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu-An Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Algorithm for real-time process control of electro-polishing
- Patent number 7,628,905
- Issue date Dec 8, 2009
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended Kalman filter incorporating offline metrology
- Patent number 7,329,168
- Issue date Feb 12, 2008
- Micron Technology, Inc.
- Jim Hofmann
- B24 - GRINDING POLISHING
Information Patent Grant
Algorithm for real-time process control of electro-polishing
- Patent number 7,112,270
- Issue date Sep 26, 2006
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended kalman filter incorporating offline metrology
- Patent number 7,087,527
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Jim Hofmann
- B24 - GRINDING POLISHING
Information Patent Grant
CMP process involving frequency analysis-based monitoring
- Patent number 6,431,953
- Issue date Aug 13, 2002
- Cabot Microelectronics Corporation
- Phillip W. Carter
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and system for in-situ optimization for semiconductor wafers...
- Patent number 6,159,075
- Issue date Dec 12, 2000
- VLSI Technology, Inc.
- Liming Zhang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 5,904,609
- Issue date May 18, 1999
- Fujitsu Limited
- Atsushi Fukuroda
- G05 - CONTROLLING REGULATING
Information Patent Grant
End point polishing apparatus and polishing method
- Patent number 5,876,265
- Issue date Mar 2, 1999
- Fujitsu Limited
- Tadayuki Kojima
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
REMOTE MONITORING SYSTEM FOR POLISHING END POINT DETECTION UNITS
- Publication number 20130268106
- Publication date Oct 10, 2013
- Ryuichiro MITANI
- B24 - GRINDING POLISHING
Information Patent Application
ADAPATIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICA...
- Publication number 20130146224
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu-An Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL...
- Publication number 20120231555
- Publication date Sep 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu-An Lee
- G05 - CONTROLLING REGULATING
Information Patent Application
EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY
- Publication number 20060246820
- Publication date Nov 2, 2006
- Micron Technology, Inc.
- Jim Hofmann
- G05 - CONTROLLING REGULATING
Information Patent Application
Algorithm for real-time process control of electro-polishing
- Publication number 20060237330
- Publication date Oct 26, 2006
- APPLIED MATERIALS, INC.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY
- Publication number 20060191870
- Publication date Aug 31, 2006
- Micron Technology, Inc.
- Jim Hofmann
- G05 - CONTROLLING REGULATING
Information Patent Application
ALGORITHM FOR REAL-TIME PROCESS CONTROL OF ELECTRO-POLISHING
- Publication number 20060163074
- Publication date Jul 27, 2006
- APPLIED MATERIALS, INC.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extended kalman filter incorporating offline metrology
- Publication number 20050284569
- Publication date Dec 29, 2005
- Micron Technology, Inc.
- Jim Hofmann
- G05 - CONTROLLING REGULATING
Information Patent Application
Extended kalman filter incorporating offline metrology
- Publication number 20040043700
- Publication date Mar 4, 2004
- Jim Hofmann
- G05 - CONTROLLING REGULATING

CMP end point analysis, measure parameters on points to detect end of polishing process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Filtering during in-situ monitoring of polishing

Filtering during in-situ monitoring of polishing

Filtering during in-situ monitoring of polishing

Adaptive endpoint method for pad life effect on chemical mechanical...

Adaptive endpoint method for pad life effect on chemical mechanical...

Algorithm for real-time process control of electro-polishing

Extended Kalman filter incorporating offline metrology

Algorithm for real-time process control of electro-polishing

Extended kalman filter incorporating offline metrology

CMP process involving frequency analysis-based monitoring

Method and system for in-situ optimization for semiconductor wafers...

Polishing apparatus and polishing method

End point polishing apparatus and polishing method

Patents Applicationslast 30 patents

REMOTE MONITORING SYSTEM FOR POLISHING END POINT DETECTION UNITS

ADAPATIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICA...

ADAPTIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL...

EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY

Algorithm for real-time process control of electro-polishing

EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY

ALGORITHM FOR REAL-TIME PROCESS CONTROL OF ELECTRO-POLISHING

Extended kalman filter incorporating offline metrology

Extended kalman filter incorporating offline metrology