co-operating by sliding

Industry

CPC
H05K7/103

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/103co-operating by sliding

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Vital relay assembly for modular solid-state current-limiting
- Patent number 11,539,177
- Issue date Dec 27, 2022
- SIEMENS MOBILITY, INC.
- Matthew Dingman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,560,066
- Issue date Feb 11, 2020
- Murata Manufacturing Co., Ltd.
- Kosuke Ishida
- B32 - LAYERED PRODUCTS
Information Patent Grant
Socket receiving an electronic component having a plurality of cont...
- Patent number 10,483,666
- Issue date Nov 19, 2019
- Tyco Electronics Japan G.K.
- Hidenori Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing zone-based configuration of...
- Patent number 10,278,302
- Issue date Apr 30, 2019
- Intel Corporation
- Anne M. Sepic
- G01 - MEASURING TESTING
Information Patent Grant
Miniaturized electrical connector for connecting a CPU
- Patent number 10,276,956
- Issue date Apr 30, 2019
- Lotes Co., Ltd.
- Chang Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping component for clamping a chip module
- Patent number 10,186,469
- Issue date Jan 22, 2019
- Lotes Co., Ltd.
- Gui Bin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component assembly, connection structure between electro...
- Patent number 9,516,776
- Issue date Dec 6, 2016
- Yazaki Corporation
- Yukihiro Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable electronic circuit assembling and testing system and uses...
- Patent number 8,991,040
- Issue date Mar 31, 2015
- 5eTek, LLC
- Erli Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board sensor mounting and alignment
- Patent number 8,194,410
- Issue date Jun 5, 2012
- Apple Inc.
- Derek J. DiCarlo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket for electronic module
- Patent number 7,029,308
- Issue date Apr 18, 2006
- Hirose Electric Co., Ltd.
- Shuntaro Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier
- Patent number 6,932,637
- Issue date Aug 23, 2005
- Visteon Global Technologies, Inc.
- Paul Simon Ewers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connector having elastic pins
- Patent number 6,764,317
- Issue date Jul 20, 2004
- Chou Hsuan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC socket with two point-contacts
- Patent number 6,540,537
- Issue date Apr 1, 2003
- Yamaichi Electronics Co., Ltd.
- Nobuo Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of a ball grid array IC mounting seat
- Patent number 6,501,665
- Issue date Dec 31, 2002
- Lotes Co., Ltd.
- Ju Ted
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular support and casing for electrical and electronic circuit co...
- Patent number 6,459,587
- Issue date Oct 1, 2002
- Eric K. D. Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector for leaded electronic component
- Patent number 6,231,370
- Issue date May 15, 2001
- The Whitaker Corporation
- Scott Frederick Morin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having alternate functionalities
- Patent number 6,111,758
- Issue date Aug 29, 2000
- Scientific-Atlanta, Inc.
- Doyle N. Dowd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin connector, pin connector holder and packaging board for mountin...
- Patent number 5,911,606
- Issue date Jun 15, 1999
- Advantest Corporation
- Shigeru Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assembly
- Patent number 5,790,381
- Issue date Aug 4, 1998
- Mitsubishi Semiconductor America, Inc.
- Nour Eddine Derouiche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket having a staggered conductive path through multiple memory m...
- Patent number 5,788,510
- Issue date Aug 4, 1998
- The Whitaker Corporation
- Kevin Eugene Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for mounting an electrical component
- Patent number 5,735,698
- Issue date Apr 7, 1998
- Lucent Technologies Inc.
- Jan Bakker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting CPU heat dissipator
- Patent number 5,651,688
- Issue date Jul 29, 1997
- Chuen-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carriers for IC packages
- Patent number 5,644,473
- Issue date Jul 1, 1997
- Mitsubishi Semiconductor America, Inc.
- Nour Eddine Derouiche
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package assembly
- Patent number 5,623,395
- Issue date Apr 22, 1997
- Mitsubishi Semiconductor America, Inc.
- Nour E. Derouiche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector module with molded upper section including molded socket,...
- Patent number 5,611,697
- Issue date Mar 18, 1997
- Xerox Corporation
- David W. Rall
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical socket for high-frequency applications
- Patent number 5,586,891
- Issue date Dec 24, 1996
- Electronic Designs Inc.
- David J. Kelly
- G01 - MEASURING TESTING
Information Patent Grant
Method for performing a burn-in test
- Patent number 5,568,057
- Issue date Oct 22, 1996
- Samsung Electronics Co., Ltd.
- Gu Sung Kim
- G01 - MEASURING TESTING
Information Patent Grant
Reusable vibration resistant integrated circuit mounting socket
- Patent number 5,445,532
- Issue date Aug 29, 1995
- The United States of America as represented by the United States Department o...
- Craig N. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC accommodation apparatus having retaining latches
- Patent number 5,373,938
- Issue date Dec 20, 1994
- Yamaichi Electric Co., Ltd.
- Masaaki Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for interconnecting electrical contacts
- Patent number 5,336,094
- Issue date Aug 9, 1994
- Johnstech International Corporation
- David A. Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER MODULE APPARATUS FOR RETROFIT IN CONTROL CABINETS AND METHO...
- Publication number 20230320017
- Publication date Oct 5, 2023
- ABB Schweiz AG
- David Mielnik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE
- Publication number 20230046581
- Publication date Feb 16, 2023
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VITAL RELAY ASSEMBLY FOR MODULAR SOLID-STATE CURRENT-LIMITING
- Publication number 20210218206
- Publication date Jul 15, 2021
- Siemens Mobility, Inc.
- Matthew Dingman
- B61 - RAILWAYS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20180061670
- Publication date Mar 1, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke ISHIDA
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY, CONNECTION STRUCTURE BETWEEN ELECTRO...
- Publication number 20150163943
- Publication date Jun 11, 2015
- YAZAKI CORPORATION
- Yukihiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIP SOCKET
- Publication number 20140073177
- Publication date Mar 13, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kang Hyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reusable electronic circuit assembling and testing system and uses...
- Publication number 20120317801
- Publication date Dec 20, 2012
- Erli Chen
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD SENSOR MOUNTING AND ALIGNMENT
- Publication number 20110242776
- Publication date Oct 6, 2011
- Apple Inc.
- Derek J. DiCarlo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Socket for electronic module
- Publication number 20050239302
- Publication date Oct 27, 2005
- Shuntaro Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric connector having elastic pins
- Publication number 20030096518
- Publication date May 22, 2003
- Chou Hsuan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC SOCKET WITH TWO POINT-CONTACTS
- Publication number 20030073355
- Publication date Apr 17, 2003
- Yamaichi Electronics Co.
- Nobuo Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component carrier
- Publication number 20020146928
- Publication date Oct 10, 2002
- Paul Simon Ewers
- H01 - BASIC ELECTRIC ELEMENTS

co-operating by sliding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vital relay assembly for modular solid-state current-limiting

Electronic component

Socket receiving an electronic component having a plurality of cont...

Device, system and method for providing zone-based configuration of...

Miniaturized electrical connector for connecting a CPU

Clamping component for clamping a chip module

Electronic component assembly, connection structure between electro...

Reusable electronic circuit assembling and testing system and uses...

Printed circuit board sensor mounting and alignment

Socket for electronic module

Component carrier

Electric connector having elastic pins

IC socket with two point-contacts

Structure of a ball grid array IC mounting seat

Modular support and casing for electrical and electronic circuit co...

Electrical connector for leaded electronic component

Electronic component having alternate functionalities

Pin connector, pin connector holder and packaging board for mountin...

Integrated circuit package assembly

Socket having a staggered conductive path through multiple memory m...

Connector for mounting an electrical component

Apparatus for mounting CPU heat dissipator

Carriers for IC packages

Integrated circuit package assembly

Connector module with molded upper section including molded socket,...

Electrical socket for high-frequency applications

Method for performing a burn-in test

Reusable vibration resistant integrated circuit mounting socket

IC accommodation apparatus having retaining latches

Apparatus for interconnecting electrical contacts

Patents Applicationslast 30 patents

CARRIER MODULE APPARATUS FOR RETROFIT IN CONTROL CABINETS AND METHO...

LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE

VITAL RELAY ASSEMBLY FOR MODULAR SOLID-STATE CURRENT-LIMITING

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT ASSEMBLY, CONNECTION STRUCTURE BETWEEN ELECTRO...

DIP SOCKET

Reusable electronic circuit assembling and testing system and uses...

PRINTED CIRCUIT BOARD SENSOR MOUNTING AND ALIGNMENT

Socket for electronic module

Electric connector having elastic pins

IC SOCKET WITH TWO POINT-CONTACTS

Component carrier