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C25D7/123

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D7/00Electroplating characterised by the article coated

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C25D7/123coated first with a seed layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 12,227,867
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical deposition systems with enhanced crystallization pr...
- Patent number 12,195,867
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device and method for pressure force inspection
- Patent number 12,181,362
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 12,157,950
- Issue date Dec 3, 2024
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 12,157,949
- Issue date Dec 3, 2024
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating and deplating currents for material co-planarity in semicon...
- Patent number 12,146,235
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF modules with an enclosure having a micromachined interior using...
- Patent number 12,126,098
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter adjustment model for semiconductor processing chambers
- Patent number 12,116,686
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for cobalt plating comprising additive for void-free su...
- Patent number 12,098,473
- Issue date Sep 24, 2024
- BASF SE
- Sathana Kitayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 12,054,846
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrofill on non-copper liner layers
- Patent number 12,012,667
- Issue date Jun 18, 2024
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,982,008
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 11,970,783
- Issue date Apr 30, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for metal plating comprising suppressing agent for void...
- Patent number 11,926,918
- Issue date Mar 12, 2024
- BASF SE
- Marcel Patrik Kienle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Detection of contact formation between a substrate and contact pins...
- Patent number 11,920,254
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for plating a recess in a substrate
- Patent number 11,908,698
- Issue date Feb 20, 2024
- SEMSYSCO GMBH
- Franz Markut
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device manufacturing jig and method for manufacturing...
- Patent number 11,891,713
- Issue date Feb 6, 2024
- Kabushiki Kaisha Toshiba
- Takeyuki Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Array substrate, method for preparing array substrate, and backligh...
- Patent number 11,894,394
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhanfeng Cao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt chemistry for smooth topology
- Patent number 11,807,951
- Issue date Nov 7, 2023
- MacDermid Enthone Inc.
- Shaopeng Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,781,235
- Issue date Oct 10, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating support system, plating support device, and recording medium
- Patent number 11,773,504
- Issue date Oct 3, 2023
- Ebara Corporation
- Mitsuhiro Shamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,723,153
- Issue date Aug 8, 2023
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multi-compartment electrochemical replenishment cell
- Patent number 11,697,887
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,697,884
- Issue date Jul 11, 2023
- MacDermid Enthone Inc.
- Thomas Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FABRICATION OF ELECTROPLATED NICKEL-IRON LAYERS WITH TITANIUM-COPPE...
- Publication number 20250057051
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Michael KIRSCH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20250051951
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...
- Publication number 20250054773
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...
- Publication number 20250051949
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20250051953
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
JET STREAM TYPE PLATING DEVICE
- Publication number 20250027225
- Publication date Jan 23, 2025
- ASKA CORPORATION
- Takayuki FURUSAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION
- Publication number 20240393199
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...
- Publication number 20240279839
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
- Publication number 20240279835
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Dielectric Material Layer, Surface Treatment Method, Package Substr...
- Publication number 20240250016
- Publication date Jul 25, 2024
- Honor Device Co., Ltd.
- Xueping Guo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...
- Publication number 20240240347
- Publication date Jul 18, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FORMING VIA HOLE AND FILLING VIA HOLE IN FLEXIBLE SUBST...
- Publication number 20240222141
- Publication date Jul 4, 2024
- Beijing BOE Technology Development Co., Ltd.
- Shuo Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURI...
- Publication number 20240194495
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING LAMINATE
- Publication number 20240179848
- Publication date May 30, 2024
- Namics Corporation
- Naoki OBATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...
- Publication number 20240167188
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device with fine pitch and thick conductors and method o...
- Publication number 20240128005
- Publication date Apr 18, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF MODULES WITH AN ENCLOSURE HAVING A MICROMACHINED INTERIOR USING...
- Publication number 20240106123
- Publication date Mar 28, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS...
- Publication number 20240105576
- Publication date Mar 28, 2024
- Intel Corporation
- Kyle MCELHINNY
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES
- Publication number 20240084473
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Improving Copper Alloy Electroplating Filling Process
- Publication number 20240060205
- Publication date Feb 22, 2024
- Shanghai Huali Integrated Circuit Corporation
- Yu Bao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240038550
- Publication date Feb 1, 2024
- InnoLux Corporation
- Chin-Lung TING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20240018678
- Publication date Jan 18, 2024
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240018681
- Publication date Jan 18, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LASER-LESS PACKAGING SUBSTRATE MANUFACTURE METHOD AND STRUCTURES FO...
- Publication number 20240021437
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ching HSU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

coated first with a seed layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating apparatus for plating semiconductor wafer and plating method

Printed circuit board and method of fabricating the same

Method of manufacturing semiconductor device

Electrochemical deposition systems with enhanced crystallization pr...

Device and method for pressure force inspection

Lipseals and contact elements for semiconductor electroplating appa...

Plating method, insoluble anode for plating, and plating apparatus

Cross flow conduit for foaming prevention in high convection platin...

Plating and deplating currents for material co-planarity in semicon...

Hermetic metallized via with improved reliability

RF modules with an enclosure having a micromachined interior using...

Parameter adjustment model for semiconductor processing chambers

Composition for cobalt plating comprising additive for void-free su...

Acidic aqueous composition for electrolytic copper plating

Electroplating apparatus and electroplating method

Copper electrofill on non-copper liner layers

Electroplating system

Systems and methods for manufacturing electrical components using e...

Composition for metal plating comprising suppressing agent for void...

Detection of contact formation between a substrate and contact pins...

Method and device for plating a recess in a substrate

Semiconductor device manufacturing jig and method for manufacturing...

Array substrate, method for preparing array substrate, and backligh...

Plated metallization structures

Cobalt chemistry for smooth topology

Plating apparatus and plating method

Plating support system, plating support device, and recording medium

Printed circuit board and method of fabricating the same

Multi-compartment electrochemical replenishment cell

Copper deposition in wafer level packaging of integrated circuits

Patents Applicationslast 30 patents

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

FABRICATION OF ELECTROPLATED NICKEL-IRON LAYERS WITH TITANIUM-COPPE...

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

JET STREAM TYPE PLATING DEVICE

DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

Dielectric Material Layer, Surface Treatment Method, Package Substr...

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...

METHODS FOR FORMING VIA HOLE AND FILLING VIA HOLE IN FLEXIBLE SUBST...

METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURI...

METHOD FOR MANUFACTURING LAMINATE

DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...

Electronic device with fine pitch and thick conductors and method o...

RF MODULES WITH AN ENCLOSURE HAVING A MICROMACHINED INTERIOR USING...

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS...

ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES

Method for Improving Copper Alloy Electroplating Filling Process

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Copper Electrodeposition in Microelectronics

PLATING APPARATUS AND PLATING METHOD

LASER-LESS PACKAGING SUBSTRATE MANUFACTURE METHOD AND STRUCTURES FO...