Coating by immersion in coating bath

Industry

CPC
H05K2203/1361

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1361Coating by immersion in coating bath

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Potting method
- Patent number 11,206,739
- Issue date Dec 21, 2021
- Goodrich Actuation Systems Limited
- David Abraham
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing implantable tissue stimulators
- Patent number 11,109,490
- Issue date Aug 31, 2021
- Micron Medical LLC
- Benjamin Speck
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for treating millimetre and/or micrometre and/or nanometre s...
- Patent number 11,027,481
- Issue date Jun 8, 2021
- EV Group E. Thallner GmbH
- Gerald Mittendorfer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of fast fabrication of single and multilayer circuit with h...
- Patent number 10,660,217
- Issue date May 19, 2020
- Jun Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing machine
- Patent number 10,531,570
- Issue date Jan 7, 2020
- Eric Sari
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Machine control unit
- Patent number 10,197,982
- Issue date Feb 5, 2019
- Eric Sari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making electrically conductive micro-wires
- Patent number 9,328,253
- Issue date May 3, 2016
- Eastman Kodak Company
- Yongcai Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Apparatus and method of coating flux
- Patent number 8,544,713
- Issue date Oct 1, 2013
- Senju Metal Industry Co., Ltd.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor unit, and its manufacturing method
- Patent number 8,064,191
- Issue date Nov 22, 2011
- Panasonic Corporation
- Kazuki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting method and bump formation method
- Patent number 7,927,997
- Issue date Apr 19, 2011
- Panasonic Corporation
- Koichi Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package and method for manufacturing the same
- Patent number 7,859,108
- Issue date Dec 28, 2010
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method of forming a low profile conformal shield
- Patent number 7,752,751
- Issue date Jul 13, 2010
- General Electric Company
- Christopher James Kapusta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board assembly and method of producing the same
- Patent number 7,361,031
- Issue date Apr 22, 2008
- Yazaki Corporation
- Kaoru Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic vertical dip coater with simultaneous ultraviolet cure
- Patent number 5,368,899
- Issue date Nov 29, 1994
- Delco Electronics Corp.
- Mary O'Connell Litteral
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
3638605
- Patent number 3,638,605
- Issue date Feb 1, 1972
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Manufacturing Implantable Tissue Stimulators
- Publication number 20210298182
- Publication date Sep 23, 2021
- Micron Medical LLC
- Benjamin Speck
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROCESSING MACHINE
- Publication number 20190302721
- Publication date Oct 3, 2019
- Eric Sari
- G05 - CONTROLLING REGULATING
Information Patent Application
MAKING A CONDUCTIVE ARTICLE HAVING MICRO-CHANNELS
- Publication number 20140216784
- Publication date Aug 7, 2014
- Yongcai Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD
- Publication number 20110162578
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Koichi Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF COATING FLUX
- Publication number 20100163606
- Publication date Jul 1, 2010
- SENJU METAL INDUSTRY CO., LTD.
- Issaku SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF FORMING A LOW PROFILE CONFORMAL SHIELD
- Publication number 20090242263
- Publication date Oct 1, 2009
- Christopher James Kapusta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090140426
- Publication date Jun 4, 2009
- Woong Sun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR UNIT, AND ITS MANUFACTURING METHOD
- Publication number 20090059470
- Publication date Mar 5, 2009
- Matushita Electric Industrial Co., Ltd.
- Kazuki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board assembly and method of producing the same
- Publication number 20070270001
- Publication date Nov 22, 2007
- YAZAKI CORPORATION
- Kaoru Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-Chip Mounting Method and Bump Formation Method
- Publication number 20070243664
- Publication date Oct 18, 2007
- Koichi Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Coating by immersion in coating bath

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic metallized via with improved reliability

Potting method

Hermetic metallized via with improved reliability

Hermetic metallized via with improved reliability

Manufacturing implantable tissue stimulators

Method for treating millimetre and/or micrometre and/or nanometre s...

Methods of fast fabrication of single and multilayer circuit with h...

Processing machine

Machine control unit

Method of making electrically conductive micro-wires

Apparatus and method of coating flux

Capacitor unit, and its manufacturing method

Flip-chip mounting method and bump formation method

Flip chip package and method for manufacturing the same

System and method of forming a low profile conformal shield

Printed circuit board assembly and method of producing the same

Automatic vertical dip coater with simultaneous ultraviolet cure

3638605

Patents Applicationslast 30 patents

Manufacturing Implantable Tissue Stimulators

PROCESSING MACHINE

MAKING A CONDUCTIVE ARTICLE HAVING MICRO-CHANNELS

FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD

APPARATUS AND METHOD OF COATING FLUX

SYSTEM AND METHOD OF FORMING A LOW PROFILE CONFORMAL SHIELD

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CAPACITOR UNIT, AND ITS MANUFACTURING METHOD

Printed circuit board assembly and method of producing the same

Flip-Chip Mounting Method and Bump Formation Method