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CPC
H05K2201/0989

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0989Coating free areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 11,837,554
- Issue date Dec 5, 2023
- Kioxia Corporation
- Ryujiro Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 11,830,833
- Issue date Nov 28, 2023
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensing module and display apparatus
- Patent number 11,815,391
- Issue date Nov 14, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiahua Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,792,929
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,723,153
- Issue date Aug 8, 2023
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board
- Patent number 11,696,408
- Issue date Jul 4, 2023
- Shinko Electric Industries Co., Ltd.
- Kenichi Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposure system, circuit board, and method for making circuit board
- Patent number 11,647,592
- Issue date May 9, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ching-Lung Chuang
- G02 - OPTICS
Information Patent Grant
Substrate bonding pad having a multi-surface trace interface
- Patent number 11,569,155
- Issue date Jan 31, 2023
- Western Digital Technologies, Inc.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board module
- Patent number 11,460,015
- Issue date Oct 4, 2022
- ebm-papst St. Georgen GmbH & Co. KG
- Volker Ehlers
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Printed circuit board
- Patent number 11,297,714
- Issue date Apr 5, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young-Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,297,720
- Issue date Apr 5, 2022
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display substrate, display device and method for manufacturing disp...
- Patent number 11,122,684
- Issue date Sep 14, 2021
- BOE Technology Group Co., Ltd.
- Bin Qin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,019,731
- Issue date May 25, 2021
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Differential signal traces including a solder mask disposed thereon
- Patent number 10,973,117
- Issue date Apr 6, 2021
- FCI USA LLC
- Benjamin Reed Staudt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,973,130
- Issue date Apr 6, 2021
- FANUC CORPORATION
- Shinichirou Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Key structure and keyboard module
- Patent number 10,963,072
- Issue date Mar 30, 2021
- Lite-On Electronics (Guangzhou) Limited
- Kuo-Hui Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Keyboard module
- Patent number 10,921,905
- Issue date Feb 16, 2021
- Lite-On Electronics (Guangzhou) Limited
- Ming-Fu Yen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board, printed circuit board, and electronic device
- Patent number 10,897,820
- Issue date Jan 19, 2021
- Canon Kabushiki Kaisha
- Koji Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with a gap control electrode and method of man...
- Patent number 10,867,950
- Issue date Dec 15, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,849,225
- Issue date Nov 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young-Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for production thereof
- Patent number 10,834,810
- Issue date Nov 10, 2020
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 10,798,827
- Issue date Oct 6, 2020
- LG Innotek Co., Ltd
- Yun Mi Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit
- Patent number 10,701,810
- Issue date Jun 30, 2020
- Sivantos Pte. Ltd.
- Stefanie Beyfuss
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device
- Patent number 10,651,118
- Issue date May 12, 2020
- Denso Corporation
- Kosuke Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20240055370
- Publication date Feb 15, 2024
- KIOXIA Corporation
- Ryujiro BANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240047393
- Publication date Feb 8, 2024
- Innolux Corporation
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EXPOSURE SYSTEM, CIRCUIT BOARD, AND METHOD FOR MAKING CIRCUIT BOARD
- Publication number 20220312599
- Publication date Sep 29, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- CHING-LUNG CHUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light Sensing Module and Display Apparatus
- Publication number 20220291038
- Publication date Sep 15, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiahua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220248533
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20220240390
- Publication date Jul 28, 2022
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20220132671
- Publication date Apr 28, 2022
- Shinko Electric Industries Co., Ltd.
- Kenichi MORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20220028809
- Publication date Jan 27, 2022
- InnoLux Corporation
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20210243901
- Publication date Aug 5, 2021
- LG Innotek Co., Ltd.
- Yun Mi BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210029825
- Publication date Jan 28, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Young-Kuk KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20200396846
- Publication date Dec 17, 2020
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20200344885
- Publication date Oct 29, 2020
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Kuei-Ming Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Module
- Publication number 20200173431
- Publication date Jun 4, 2020
- EBM-PAPST ST. GEORGEN GMBH & CO. KG
- Volker Ehlers
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20200163213
- Publication date May 21, 2020
- Canon Kabushiki Kaisha
- Koji Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20200146156
- Publication date May 7, 2020
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190364673
- Publication date Nov 28, 2019
- FANUC CORPORATION
- Shinichirou Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF
- Publication number 20190223286
- Publication date Jul 18, 2019
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20190122976
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180376582
- Publication date Dec 27, 2018
- Shanghai Zhaoxin Semiconductor Co., Ltd.
- Nai-Shung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH INTEGRATED PASSIVE DEVICES
- Publication number 20150230338
- Publication date Aug 13, 2015
- Intel Corporation
- Md Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20140319692
- Publication date Oct 30, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE
- Publication number 20140307359
- Publication date Oct 16, 2014
- Yuuki MIKAMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...
- Publication number 20140202740
- Publication date Jul 24, 2014
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAPPED ATTACHMENT STRUCTURES
- Publication number 20140168909
- Publication date Jun 19, 2014
- Tieyu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUC...
- Publication number 20140124254
- Publication date May 8, 2014
- NVIDIA Corporation
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH INTEGRATED PASSIVE DEVICES
- Publication number 20140116765
- Publication date May 1, 2014
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140041920
- Publication date Feb 13, 2014
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
- Publication number 20140027160
- Publication date Jan 30, 2014
- Seok Yoon HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Coating free areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic metallized via with improved reliability

Semiconductor package and semiconductor device

Electronic substrate and electronic device

Light sensing module and display apparatus

Semiconductor module and electronic apparatus

Wiring substrate and method for manufacturing wiring substrate

Printed circuit board and method of fabricating the same

Circuit board

Exposure system, circuit board, and method for making circuit board

Substrate bonding pad having a multi-surface trace interface

Module installation on printed circuit boards with embedded trace t...

Printed circuit board module

Printed circuit board

Printed circuit board and method of fabricating the same

Hermetic metallized via with improved reliability

Hermetic metallized via with improved reliability

Display substrate, display device and method for manufacturing disp...

Printed circuit board and method of fabricating the same

Differential signal traces including a solder mask disposed thereon

Printed wiring board

Key structure and keyboard module

Keyboard module

Printed wiring board, printed circuit board, and electronic device

Semiconductor device with a gap control electrode and method of man...

Printed circuit board

Circuit board and method for production thereof

Protrusion bump pads for bond-on-trace processing

Printed circuit board and method of fabricating the same

Method for manufacturing a circuit

Electronic device

Patents Applicationslast 30 patents

Printed Circuit Board And Method For Soldering A Chip Housing In A...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

EXPOSURE SYSTEM, CIRCUIT BOARD, AND METHOD FOR MAKING CIRCUIT BOARD

Light Sensing Module and Display Apparatus

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD

ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT STRUCTURE

Printed Circuit Board Module

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED WIRING BOARD

CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF

Protrusion Bump Pads for Bond-on-Trace Processing

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE STRUCTURE

CIRCUIT BOARD WITH INTEGRATED PASSIVE DEVICES

Semiconductor Device and Method of Forming High Routing Density Int...

ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE

Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...

GAPPED ATTACHMENT STRUCTURES

NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUC...

CIRCUIT BOARD WITH INTEGRATED PASSIVE DEVICES

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF