Coating only between conductors

Industry

CPC
H05K2201/09881

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09881Coating only between conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for improving performance of sliding rheostat of 5G communi...
- Patent number 10,813,226
- Issue date Oct 20, 2020
- Kunshan TVS Electronic Technology Co., Ltd
- Jiting Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing a metal-ceramic substrate
- Patent number 10,759,714
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for manufacturing a high-current printed circuit board
- Patent number 10,561,026
- Issue date Feb 11, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Rih-Sin Jian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 10,492,309
- Issue date Nov 26, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Rih-Sin Jian
- G11 - INFORMATION STORAGE
Information Patent Grant
Reduced capacitance land pad
- Patent number 10,433,421
- Issue date Oct 1, 2019
- Intel Corporation
- Zhichao Zhang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible LED assembly with UV protection
- Patent number 10,424,707
- Issue date Sep 24, 2019
- 3M Innovative Properties Company
- Ravi Palaniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting heat-dissipating substrate
- Patent number 10,249,558
- Issue date Apr 2, 2019
- NSK Ltd.
- Shigeru Shimakawa
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Flexible LED assembly with UV protection
- Patent number 10,121,947
- Issue date Nov 6, 2018
- 3M Innovative Properties Company
- Ravi Palaniswamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 10,080,295
- Issue date Sep 18, 2018
- Unimicron Technology Corp.
- Kun-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,045,436
- Issue date Aug 7, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 9,814,129
- Issue date Nov 7, 2017
- LG Innotek Co., Ltd
- Yong Seok Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,560,739
- Issue date Jan 31, 2017
- NGK Spark Plug Co., Ltd.
- Tomohiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer resin substrate and method of manufacturing multi-layer...
- Patent number 9,532,447
- Issue date Dec 27, 2016
- Murata Manufacturing Co., Ltd.
- Hiroyuki Ohata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate having a plurality of connection terminals and a f...
- Patent number 9,485,853
- Issue date Nov 1, 2016
- NGK Spark Plug Co., Ltd.
- Tatsuya Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method of the same
- Patent number 9,420,703
- Issue date Aug 16, 2016
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing conductive member, conductive member, and...
- Patent number 9,411,080
- Issue date Aug 9, 2016
- FUJIFILM Corporation
- Kensuke Katagiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 9,392,684
- Issue date Jul 12, 2016
- Shinko Electric Industries Co., Ltd.
- Akio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multi-layer printed circuit board
- Patent number 9,357,640
- Issue date May 31, 2016
- Oce-Technologies B.V.
- Hendrikus J. T. M. Van den Bersselaar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate composite and method for manufacturing ceramic su...
- Patent number 9,320,155
- Issue date Apr 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taiji Kuroiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an interlayer connection substrate
- Patent number 9,320,154
- Issue date Apr 19, 2016
- Hitachi, Ltd.
- Akira Soeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and die spacer layers having a ceramic backbone
- Patent number 9,258,880
- Issue date Feb 9, 2016
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board
- Patent number 9,204,553
- Issue date Dec 1, 2015
- Lear Corporation
- Jose Antonio Cubero Pitel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,179,552
- Issue date Nov 3, 2015
- NRK SPARK PLUG CO., LTD.
- Tomohiro Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board with planarized cover layer structure
- Patent number 9,173,284
- Issue date Oct 27, 2015
- Advanced Flexible Circuits Co., Ltd.
- Kuo-Fu Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,161,445
- Issue date Oct 13, 2015
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,137,890
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor and multilayer circuit board using same
- Patent number 9,101,074
- Issue date Aug 4, 2015
- Hon Hai Precision Industry Co., Ltd.
- Ying-Tso Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the production of a ceramic multilayer circuit arrangement
- Patent number 9,003,653
- Issue date Apr 14, 2015
- Robert Bosch GmbH
- Juergen Egerter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a capacitor-embedded printed circuit board
- Patent number 8,943,685
- Issue date Feb 3, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Young Do Kweon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD
- Publication number 20190289726
- Publication date Sep 19, 2019
- Avary Holding (Shenzhen) Co., Limited.
- RIH-SIN JIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE LED ASSEMBLY WITH UV PROTECTION
- Publication number 20190035993
- Publication date Jan 31, 2019
- 3M Innovative Properties Company
- Ravi Palaniswamy
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic...
- Publication number 20180093927
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20140353018
- Publication date Dec 4, 2014
- Hitachi, Ltd
- Akira SOEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN PROTRUSION FORMING METHOD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20140295065
- Publication date Oct 2, 2014
- Fujitsu Limited
- Tomomi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140226346
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20140196939
- Publication date Jul 17, 2014
- Tomohiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20140174940
- Publication date Jun 26, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED CAPACITANCE LAND PAD
- Publication number 20140174808
- Publication date Jun 26, 2014
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SU...
- Publication number 20140131076
- Publication date May 15, 2014
- PANASONIC CORPORATION
- Taiji Kuroiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140124242
- Publication date May 8, 2014
- NGK Spark Plug Co., Ltd.
- Tatsuya Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUC...
- Publication number 20140124254
- Publication date May 8, 2014
- NVIDIA Corporation
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140097007
- Publication date Apr 10, 2014
- NGK SPARK PLUG CO., LTD.
- Makoto NAGAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140041902
- Publication date Feb 13, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND MULTILAYER CIRCUIT BOARD USING SAME
- Publication number 20140000949
- Publication date Jan 2, 2014
- YING-TSO LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate and die spacer layers having a ceramic backbone
- Publication number 20130341076
- Publication date Dec 26, 2013
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20130292166
- Publication date Nov 7, 2013
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Substrate and Method for Manufacturing Wiring Substrate
- Publication number 20130264100
- Publication date Oct 10, 2013
- Shinko Electric Industries Co., LTD.
- Akio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...
- Publication number 20130240254
- Publication date Sep 19, 2013
- HON HAI Precision Industry CO., LTD.
- XIAO-ZHAN PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...
- Publication number 20130220683
- Publication date Aug 29, 2013
- ZHEN DING TECHNOLOGY CO., LTD.
- ZONG-QING CAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEARANCE FILLING PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...
- Publication number 20130118779
- Publication date May 16, 2013
- Duke Kyu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20130062100
- Publication date Mar 14, 2013
- Unimicron Technology Corporation
- Kun-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Schemes, and Materials and Methods for Producing the Same
- Publication number 20130021758
- Publication date Jan 24, 2013
- Jonathan J. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Having Aluminum Traces with a Solderable Laye...
- Publication number 20120317805
- Publication date Dec 20, 2012
- LEAR CORPORATION
- Jose Antonio Cubero Pitel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20120186867
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED WIRING BOARD, LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING L...
- Publication number 20120181560
- Publication date Jul 19, 2012
- IBIDEN CO., LTD.
- Yasuji HIRAMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate and die spacer layers having a ceramic backbone
- Publication number 20120152601
- Publication date Jun 21, 2012
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION...
- Publication number 20110297424
- Publication date Dec 8, 2011
- Hideki Yoshida
- G02 - OPTICS
Information Patent Application
Method of using white resin in an electronic device
- Publication number 20110294241
- Publication date Dec 1, 2011
- Hitachi Chemical Company, Ltd.
- Naoyuki Urasaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Coating only between conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reduced capacitance land pad

Process for improving performance of sliding rheostat of 5G communi...

Method for producing a metal-ceramic substrate

Method for manufacturing a high-current printed circuit board

Printed circuit board and method for manufacturing the same

Reduced capacitance land pad

Flexible LED assembly with UV protection

Electronic part mounting heat-dissipating substrate

Flexible LED assembly with UV protection

Circuit board structure

Printed circuit board and method of manufacturing the same

Printed circuit board and method of fabricating the same

Wiring board

Multi-layer resin substrate and method of manufacturing multi-layer...

Wiring substrate having a plurality of connection terminals and a f...

Wiring board and manufacturing method of the same

Method for manufacturing conductive member, conductive member, and...

Wiring substrate and method for manufacturing wiring substrate

Method of manufacturing a multi-layer printed circuit board

Ceramic substrate composite and method for manufacturing ceramic su...

Method of manufacturing an interlayer connection substrate

Package substrate and die spacer layers having a ceramic backbone

Method for producing a printed circuit board

Wiring board

Flexible circuit board with planarized cover layer structure

Printed wiring board and method for manufacturing printed wiring board

Wiring board and light emitting device

Capacitor and multilayer circuit board using same

Method for the production of a ceramic multilayer circuit arrangement

Method of manufacturing a capacitor-embedded printed circuit board

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A HIGH-CURRENT PRINTED CIRCUIT BOARD

FLEXIBLE LED ASSEMBLY WITH UV PROTECTION

Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic...

INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD

RESIN PROTRUSION FORMING METHOD AND WIRING BOARD MANUFACTURING METHOD

WIRING BOARD AND LIGHT EMITTING DEVICE

WIRING BOARD

HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF

REDUCED CAPACITANCE LAND PAD

CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SU...

WIRING SUBSTRATE

NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUC...

WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CAPACITOR AND MULTILAYER CIRCUIT BOARD USING SAME

Package substrate and die spacer layers having a ceramic backbone

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Wiring Substrate and Method for Manufacturing Wiring Substrate

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...

CLEARANCE FILLING PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...

CIRCUIT BOARD STRUCTURE

Interconnect Schemes, and Materials and Methods for Producing the Same

Printed Circuit Board Having Aluminum Traces with a Solderable Laye...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

LED WIRING BOARD, LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING L...

Package substrate and die spacer layers having a ceramic backbone

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION...

Method of using white resin in an electronic device