Coherent radiation

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CPC
H01L2021/60112

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60112Coherent radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 12,085,518
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
- Patent number 12,033,926
- Issue date Jul 9, 2024
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,935,840
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 11,815,471
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for laser assisted bonding of an electronic device
- Patent number 11,742,216
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ho Yoon
- G02 - OPTICS
Information Patent Grant
Solder transfer integrated circuit packaging
- Patent number 11,631,650
- Issue date Apr 18, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 11,543,363
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 11,488,841
- Issue date Nov 1, 2022
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,444,035
- Issue date Sep 13, 2022
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a silicon carbide device and wafer composit...
- Patent number 11,373,863
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask changing unit for laser bonding apparatus
- Patent number 11,358,236
- Issue date Jun 14, 2022
- PROTEC CO., LTD.
- Geunsik Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for a multi-chip power semiconductor device
- Patent number 11,329,000
- Issue date May 10, 2022
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
- Patent number 11,145,582
- Issue date Oct 12, 2021
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 10,784,210
- Issue date Sep 22, 2020
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of an electronic device
- Patent number 10,763,129
- Issue date Sep 1, 2020
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 10,748,773
- Issue date Aug 18, 2020
- LASERSSEL CO., LTD.
- Jae Joon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of semiconductor die
- Patent number 10,304,698
- Issue date May 28, 2019
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of semiconductor die
- Patent number 9,916,989
- Issue date Mar 13, 2018
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 9,162,320
- Issue date Oct 20, 2015
- Shibuya Kogyo Co., Ltd.
- Eiji Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20240385124
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20240170416
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED BONDING PAD OF CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411261
- Publication date Dec 21, 2023
- Hefei SMAT Technology Co., LTD
- Guangyao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20230393081
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- G01 - MEASURING TESTING
Information Patent Application
SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING
- Publication number 20230230947
- Publication date Jul 20, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING
- Publication number 20220399298
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20220384360
- Publication date Dec 1, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20220365001
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20220028769
- Publication date Jan 27, 2022
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20200373249
- Publication date Nov 26, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Silicon Carbide Device and Wafer Composit...
- Publication number 20200357637
- Publication date Nov 12, 2020
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for a Multi-Chip Power Semiconductor Device
- Publication number 20200273802
- Publication date Aug 27, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20200266078
- Publication date Aug 20, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Changing Unit for Laser Bonding Apparatus
- Publication number 20200215645
- Publication date Jul 9, 2020
- PROTEC CO., LTD.
- GEUNSIK AHN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20200211976
- Publication date Jul 2, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20200203264
- Publication date Jun 25, 2020
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20190244818
- Publication date Aug 8, 2019
- CRUCIAL MACHINES CO., LTD.
- Jae Joon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE
- Publication number 20180204740
- Publication date Jul 19, 2018
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE
- Publication number 20170301560
- Publication date Oct 19, 2017
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20140001163
- Publication date Jan 2, 2014
- Eiji TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Coherent radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with partial EMI shielding removal using laser...

Systems and methods for wafer bond monitoring

Method of manufacturing semiconductor devices with a paddle and ele...

Semiconductor device with partial EMI shielding removal using laser...

Systems and methods for wafer bond monitoring

Laser bonding apparatus for three-dimensional molded sculptures

System and method for laser assisted bonding of an electronic device

Solder transfer integrated circuit packaging

Systems and methods for wafer bond monitoring

Method for manufacturing semiconductor package

Semiconductor device with partial EMI shielding removal using laser...

Method of manufacturing a silicon carbide device and wafer composit...

Mask changing unit for laser bonding apparatus

Package for a multi-chip power semiconductor device

Method of manufacturing semiconductor devices with a paddle and ele...

Semiconductor device with partial EMI shielding removal using laser...

System and method for laser assisted bonding of an electronic device

Laser bonding apparatus for three-dimensional molded sculptures

System and method for laser assisted bonding of semiconductor die

System and method for laser assisted bonding of semiconductor die

Bonding device

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

EXPOSED BONDING PAD OF CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING

SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

Method of Manufacturing a Silicon Carbide Device and Wafer Composit...

Package for a Multi-Chip Power Semiconductor Device

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Mask Changing Unit for Laser Bonding Apparatus

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE

SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE

BONDING DEVICE