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H01L27/1207

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/1207combined with devices in contact with the semiconductor body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,289,878
- Issue date Apr 29, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and electronic device
- Patent number 12,260,898
- Issue date Mar 25, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistor, integrated circuit, and manufacturing method of transistor
- Patent number 12,249,656
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Marcus Johannes Henricus Van Dal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,249,608
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yun-Feng Kao
- G11 - INFORMATION STORAGE
Information Patent Grant
Imaging device and electronic device
- Patent number 12,243,885
- Issue date Mar 4, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshiyuki Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising wiring layer over driver circuit
- Patent number 12,225,711
- Issue date Feb 11, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,218,246
- Issue date Feb 4, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,534
- Issue date Jan 28, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 12,205,622
- Issue date Jan 21, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Imaging device and electronic device
- Patent number 12,199,122
- Issue date Jan 14, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure for separating different transistor regions on...
- Patent number 12,199,102
- Issue date Jan 14, 2025
- Infineon Technologies Austria AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including ferroelectric material, neuromorphic...
- Patent number 12,191,311
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of metal oxide and manufacturing method of sem...
- Patent number 12,176,210
- Issue date Dec 24, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacked semiconductor device with nanostructure channels
- Patent number 12,170,227
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, driving method, and electronic device having memory...
- Patent number 12,165,557
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Susumu Kawashima
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,159,873
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices having a semiconductor material that is semimetal in bulk a...
- Patent number 12,148,816
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of Si-based transistors with non-Si technologies by sem...
- Patent number 12,148,757
- Issue date Nov 19, 2024
- Intel Corporation
- Nidhi Nidhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,148,828
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon transformer integrated chip
- Patent number 12,148,693
- Issue date Nov 19, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC structure for high voltage device on a SOI substrate
- Patent number 12,136,627
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,136,663
- Issue date Nov 5, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multinary bit cells for memory devices and network applications and...
- Patent number 12,136,457
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Katherine H. Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS transistor having substantially parallelepiped-shaped insulatin...
- Patent number 12,125,899
- Issue date Oct 22, 2024
- STMicroelectronics (Rousset) SAS
- Arnaud Regnier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,125,878
- Issue date Oct 22, 2024
- Kioxia Corporation
- Tomonari Shioda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure including porous semiconductor layer in bulk substrate...
- Patent number 12,119,352
- Issue date Oct 15, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Uzma B. Rana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer crystalline back gated thin film transistor
- Patent number 12,119,409
- Issue date Oct 15, 2024
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,118,333
- Issue date Oct 15, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki Ikeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,120,443
- Issue date Oct 15, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshiyuki Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function substrate
- Patent number 12,113,071
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NANOSHEET BASED EXTENDED-GATE DEVICE INTEGRATION
- Publication number 20250072116
- Publication date Feb 27, 2025
- International Business Machines Corporation
- Juntao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072100
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250072031
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures for Dual-Thickness Active Area SOI FETS
- Publication number 20250063822
- Publication date Feb 20, 2025
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE
- Publication number 20250063821
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR (SOI) STRUCTURES FOR CHARGE DAMAGE PROTECTION
- Publication number 20250063828
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250056894
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-CHIH TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient FET Body and Substrate Contacts
- Publication number 20250056875
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250056893
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS TRANSISTOR HAVING SUBSTANTIALLY PARALLELPIPED-SHAPED INSULATING...
- Publication number 20250040165
- Publication date Jan 30, 2025
- STMicroelectronics (Rousset) SAS
- Arnaud REGNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250014615
- Publication date Jan 9, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Jun Koyama
- G11 - INFORMATION STORAGE
Information Patent Application
METAL OXIDE FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE
- Publication number 20250011916
- Publication date Jan 9, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STACKED MULTI-GATE DEVICE WITH LOW CONTACT VIA RESISTANCE AND METHO...
- Publication number 20250006742
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuting CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250006744
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING FDSOI DEVICE LEAKAGE
- Publication number 20250006743
- Publication date Jan 2, 2025
- Shanghai Huali Integrated Circuit Corporation
- Xing Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Thickness Active Area Architecture for SOI FETS
- Publication number 20240429239
- Publication date Dec 26, 2024
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE
- Publication number 20240413130
- Publication date Dec 12, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kazunori WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE WITH THINNER Si LAYER
- Publication number 20240413164
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Hydrogen Diffused Within Two or Mo...
- Publication number 20240413154
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE CMOS INVERTER WITH VERTICAL CHANNELS AND METHODS O...
- Publication number 20240395824
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240395602
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Soon-Kang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONI...
- Publication number 20240395825
- Publication date Nov 28, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Wataru UESUGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395823
- Publication date Nov 28, 2024
- RENESAS ELECTRONICS CORPORATION
- Takaaki TSUNOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Having a Semiconductor Material That Is Semimetal in Bulk a...
- Publication number 20240387711
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ISOLATION FEATURE
- Publication number 20240387738
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE SEMICONDUCTOR DEVICE STRUCTURE PROVIDING A NOT-GAT...
- Publication number 20240379685
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION
- Publication number 20240379410
- Publication date Nov 14, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICO...
- Publication number 20240371883
- Publication date Nov 7, 2024
- ATOMERA INCORPORATED
- DONGHUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE
- Publication number 20240371884
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS

combined with devices in contact with the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Memory device and electronic device

Transistor, integrated circuit, and manufacturing method of transistor

Method for manufacturing semiconductor structure and semiconductor...

Imaging device and electronic device

Semiconductor device comprising wiring layer over driver circuit

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Semiconductor device

Imaging device and electronic device

Isolation structure for separating different transistor regions on...

Semiconductor device including ferroelectric material, neuromorphic...

Manufacturing method of metal oxide and manufacturing method of sem...

Stacked semiconductor device with nanostructure channels

Display device, driving method, and electronic device having memory...

Semiconductor structure and manufacturing method thereof

Devices having a semiconductor material that is semimetal in bulk a...

Integration of Si-based transistors with non-Si technologies by sem...

Semiconductor device and manufacturing method thereof

Silicon transformer integrated chip

3DIC structure for high voltage device on a SOI substrate

Semiconductor device and manufacturing method of semiconductor device

Multinary bit cells for memory devices and network applications and...

MOS transistor having substantially parallelepiped-shaped insulatin...

Semiconductor device and manufacturing method thereof

IC structure including porous semiconductor layer in bulk substrate...

Multi-layer crystalline back gated thin film transistor

Semiconductor device

Semiconductor device and electronic device

Multi-function substrate

Patents Applicationslast 30 patents

NANOSHEET BASED EXTENDED-GATE DEVICE INTEGRATION

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME

Contact Structures for Dual-Thickness Active Area SOI FETS

MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE

SILICON-ON-INSULATOR (SOI) STRUCTURES FOR CHARGE DAMAGE PROTECTION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Efficient FET Body and Substrate Contacts

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

MOS TRANSISTOR HAVING SUBSTANTIALLY PARALLELPIPED-SHAPED INSULATING...

MEMORY DEVICE AND SEMICONDUCTOR DEVICE

METAL OXIDE FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

STACKED MULTI-GATE DEVICE WITH LOW CONTACT VIA RESISTANCE AND METHO...

SEMICONDUCTOR STRUCTURE

METHOD FOR IMPROVING FDSOI DEVICE LEAKAGE

Dual-Thickness Active Area Architecture for SOI FETS

DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE

PASSIVE DEVICE WITH THINNER Si LAYER

Integrated Assemblies Comprising Hydrogen Diffused Within Two or Mo...

BACK-END-OF-LINE CMOS INVERTER WITH VERTICAL CHANNELS AND METHODS O...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Devices Having a Semiconductor Material That Is Semimetal in Bulk a...

SEMICONDUCTOR STRUCTURE WITH ISOLATION FEATURE

HYBRID INTEGRATED CIRCUIT DIES

BACK-END-OF-LINE SEMICONDUCTOR DEVICE STRUCTURE PROVIDING A NOT-GAT...

METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION

METHODS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICO...

3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE