Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces

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H05K1/0228

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hatching ground under a pad in a printed circuit board
- Patent number 12,207,391
- Issue date Jan 21, 2025
- Dell Products L.P.
- Zhenli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component comprising first and second conductive traces...
- Patent number 12,207,392
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-stripline with crosstalk cancellation
- Patent number 12,113,265
- Issue date Oct 8, 2024
- Intel Corporation
- Albert Sutono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed communication jack
- Patent number 12,051,878
- Issue date Jul 30, 2024
- SENTINEL CONNECTOR SYSTEMS
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wetness pad assembly, system and method
- Patent number 12,029,631
- Issue date Jul 9, 2024
- Franklin Edward Ward
- G01 - MEASURING TESTING
Information Patent Grant
Crosstalk cancellation for signal lines
- Patent number 11,979,979
- Issue date May 7, 2024
- Micron Technology, Inc.
- M. Ataul Karim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package differential pin pattern for cross-talk...
- Patent number 11,917,749
- Issue date Feb 27, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-interference circuit board and terminal
- Patent number 11,903,122
- Issue date Feb 13, 2024
- Huawei Technologies Co., Ltd.
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Telecommunications device
- Patent number 11,888,263
- Issue date Jan 30, 2024
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnet coils made from flexible circuits
- Patent number 11,882,661
- Issue date Jan 23, 2024
- KLA Corporation
- Oscar G. Florendo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise suppression structure for differential pair
- Patent number 11,877,385
- Issue date Jan 16, 2024
- First Hi-tec Enterprise Co., Ltd.
- Ching-Shan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency signal coupling to surface emitters
- Patent number 11,855,415
- Issue date Dec 26, 2023
- CREDO TECHNOLOGY GROUP LIMITED
- Xike Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit finger layout for low crosstalk
- Patent number 11,818,834
- Issue date Nov 14, 2023
- Western Digital Technologies, Inc.
- Masahiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for providing a scalable ball grid array (BGA)...
- Patent number 11,817,378
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Nelly Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Breakout structure for an integrated circuit device
- Patent number 11,812,544
- Issue date Nov 7, 2023
- Xilinx, Inc.
- Shad Shepston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer-readable recording medium storing design program, design m...
- Patent number 11,812,560
- Issue date Nov 7, 2023
- Fujitsu Limited
- Toshiaki Ozawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for break out of interconnections for high-dens...
- Patent number 11,778,731
- Issue date Oct 3, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission circuit packaging structure
- Patent number 11,778,733
- Issue date Oct 3, 2023
- LeRain Technology Co., Ltd.
- Miaobin Gao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Signal transmission circuit packaging structure
- Patent number 11,778,732
- Issue date Oct 3, 2023
- LeRain Technology Co., Ltd.
- Miaobin Gao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device comprising printed circuit board with slits
- Patent number 11,765,812
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Namseok Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and design of high-performance interconnects with improved s...
- Patent number 11,744,006
- Issue date Aug 29, 2023
- University of South Carolina
- Guoan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic device
- Patent number 11,612,053
- Issue date Mar 21, 2023
- Murata Manufacturing Co., Ltd.
- Nobuyuki Tenno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Telecommunications device
- Patent number 11,581,685
- Issue date Feb 14, 2023
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel with internal traces proofed against electromagentic...
- Patent number 11,553,587
- Issue date Jan 10, 2023
- JADARD TECHNOLOGY INC.
- Yi-Wei Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Differential signal routing line of circuit board and circuit board
- Patent number 11,546,985
- Issue date Jan 3, 2023
- HKC CORPORATION LIMITED
- Shuixiu Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed RJ45 connector
- Patent number 11,532,916
- Issue date Dec 20, 2022
- Panduit Corp.
- Satish I. Patel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR STRUCTURES
- Publication number 20250056711
- Publication date Feb 13, 2025
- Cisco Technology, Inc.
- D. Brice Achkir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Circuit For A Vehicle
- Publication number 20250040035
- Publication date Jan 30, 2025
- Vitesco Technologies GMBH
- Emmanuel GOULIER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250031299
- Publication date Jan 23, 2025
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240397611
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Koji MIYAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...
- Publication number 20240389223
- Publication date Nov 21, 2024
- Dell Products L.P.
- SANDOR TIBOR FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK CANCELLATION FOR SIGNAL LINES
- Publication number 20240260171
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- M. Ataul Karim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS
- Publication number 20240243496
- Publication date Jul 18, 2024
- CIENA CORPORATION
- Russell Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TELECOMMUNICATIONS DEVICE
- Publication number 20240204460
- Publication date Jun 20, 2024
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISTAGE CAPACITIVE CROSSTALK COMPENSATION ARRANGEMENT
- Publication number 20240195125
- Publication date Jun 13, 2024
- CommScope Technologies LLC
- David Patrick Murray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING
- Publication number 20240188266
- Publication date Jun 6, 2024
- Deere & Company
- Ryan J. King
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP CROSSTALK REDUCTION
- Publication number 20240098882
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Matthew Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT FINGER LAYOUT FOR LOW CROSSTALK
- Publication number 20240040688
- Publication date Feb 1, 2024
- Western Digital Technologies, Inc.
- Masahiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR
- Publication number 20240023227
- Publication date Jan 18, 2024
- FIRST HI-TEC ENTERPRISE Co., Ltd.
- Ching-Shan CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR ASSEMBLY FOR SENSOR DEVICE
- Publication number 20230352862
- Publication date Nov 2, 2023
- Analog Devices, Inc.
- Michael J. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20230345621
- Publication date Oct 26, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES
- Publication number 20230345626
- Publication date Oct 26, 2023
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HATCHING GROUND UNDER A PAD IN A PRINTED CIRCUIT BOARD
- Publication number 20230345620
- Publication date Oct 26, 2023
- Dell Products L.P.
- Zhenli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TELECOMMUNICATIONS DEVICE
- Publication number 20230307875
- Publication date Sep 28, 2023
- CommScope Technologies LLC
- Bernard Harold Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BREAKOUT STRUCTURE FOR AN INTEGRATED CIRCUIT DEVICE
- Publication number 20230199941
- Publication date Jun 22, 2023
- Xilinx, Inc.
- Shad SHEPSTON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BREAK OUT OF INTERCONNECTIONS FOR HIGH-DENS...
- Publication number 20230121836
- Publication date Apr 20, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Frequency Signal Coupling to Surface Emitters
- Publication number 20230086154
- Publication date Mar 23, 2023
- Credo Technology Group Ltd.
- XIKE LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnet Coils Made From Flexible Circuits
- Publication number 20230072723
- Publication date Mar 9, 2023
- KLA Corporation
- Oscar G. Florendo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT FINGER LAYOUT FOR LOW CROSSTALK
- Publication number 20220418092
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Masahiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER-READABLE RECORDING MEDIUM STORING DESIGN PROGRAM, DESIGN M...
- Publication number 20220386471
- Publication date Dec 1, 2022
- Fujitsu Limited
- Toshiaki Ozawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING POWER INTEGRITY CHARACTERISTICS
- Publication number 20220361339
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- Junghwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK CANCELLATION FOR SIGNAL LINES
- Publication number 20220346220
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- M. Ataul Karim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHASE HETEROGENEOUS INTERCONNECTS FOR CROSSTALK REDUCTION
- Publication number 20220338344
- Publication date Oct 20, 2022
- Intel Corporation
- Zhen Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRANSMISSION CIRCUIT PACKAGING STRUCTURE
- Publication number 20220312580
- Publication date Sep 29, 2022
- LeRain Technology Co., Ltd.
- MIAOBIN GAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DUAL-STRIPLINE WITH CROSSTALK CANCELLATION
- Publication number 20220311114
- Publication date Sep 29, 2022
- Intel Corporation
- Albert Sutono
- H01 - BASIC ELECTRIC ELEMENTS

Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package for improving power integrity characteristics

Hatching ground under a pad in a printed circuit board

Electronic component comprising first and second conductive traces...

Resetting different pair skew of printed circuit board traces

Dual-stripline with crosstalk cancellation

High speed communication jack

Wetness pad assembly, system and method

Crosstalk cancellation for signal lines

Integrated circuit package differential pin pattern for cross-talk...

Fine feature formation techniques for printed circuit boards

Anti-interference circuit board and terminal

Telecommunications device

Electromagnet coils made from flexible circuits

Noise suppression structure for differential pair

High frequency signal coupling to surface emitters

Flexible printed circuit finger layout for low crosstalk

Apparatus and method for providing a scalable ball grid array (BGA)...

Breakout structure for an integrated circuit device

Computer-readable recording medium storing design program, design m...

Systems and methods for break out of interconnections for high-dens...

Signal transmission circuit packaging structure

Signal transmission circuit packaging structure

Electronic device comprising printed circuit board with slits

Method and design of high-performance interconnects with improved s...

Microelectronic assemblies having conductive structures with differ...

Circuit board and electronic device

Telecommunications device

Display panel with internal traces proofed against electromagentic...

Differential signal routing line of circuit board and circuit board

High speed RJ45 connector

Patents Applicationslast 30 patents

CONNECTOR STRUCTURES

Electronic Circuit For A Vehicle

PRINTED WIRING BOARD

WIRING BOARD

SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...

High Speed Communication Jack

CROSSTALK CANCELLATION FOR SIGNAL LINES

METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS

TELECOMMUNICATIONS DEVICE

MULTISTAGE CAPACITIVE CROSSTALK COMPENSATION ARRANGEMENT

ELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING

MICROSTRIP CROSSTALK REDUCTION

FLEXIBLE PRINTED CIRCUIT FINGER LAYOUT FOR LOW CROSSTALK

NOISE SUPPRESSION STRUCTURE FOR DIFFERENTIAL PAIR

CONNECTOR ASSEMBLY FOR SENSOR DEVICE

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES

HATCHING GROUND UNDER A PAD IN A PRINTED CIRCUIT BOARD

TELECOMMUNICATIONS DEVICE

BREAKOUT STRUCTURE FOR AN INTEGRATED CIRCUIT DEVICE

SYSTEMS AND METHODS FOR BREAK OUT OF INTERCONNECTIONS FOR HIGH-DENS...

High Frequency Signal Coupling to Surface Emitters

Electromagnet Coils Made From Flexible Circuits

FLEXIBLE PRINTED CIRCUIT FINGER LAYOUT FOR LOW CROSSTALK

COMPUTER-READABLE RECORDING MEDIUM STORING DESIGN PROGRAM, DESIGN M...

SEMICONDUCTOR PACKAGE FOR IMPROVING POWER INTEGRITY CHARACTERISTICS

CROSSTALK CANCELLATION FOR SIGNAL LINES

PHASE HETEROGENEOUS INTERCONNECTS FOR CROSSTALK REDUCTION

SIGNAL TRANSMISSION CIRCUIT PACKAGING STRUCTURE

DUAL-STRIPLINE WITH CROSSTALK CANCELLATION