Compliant clamping elements not primarily serving heat-conduction

Industry

CPC
H01L2023/4081

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4081Compliant clamping elements not primarily serving heat-conduction

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for evenly applying forces on a heat dissipation base plate
- Patent number 12,200,911
- Issue date Jan 14, 2025
- Asia Vital Components (China) Co., Ltd.
- Xue-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a pressure device acting on a swi...
- Patent number 12,112,994
- Issue date Oct 8, 2024
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Stefan Oehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backing plate assembly with jack screw for bare die device heat sin...
- Patent number 12,096,601
- Issue date Sep 17, 2024
- Ciena Corporation
- Maxwell Thomas McKerlie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with baseplate and heat dissipating element
- Patent number 12,062,591
- Issue date Aug 13, 2024
- HITACHI ENERGY LTD
- Milad Maleki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,533
- Issue date Jul 23, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor package comprising thermally conductive and electrically...
- Patent number 12,033,908
- Issue date Jul 9, 2024
- Lunar Energy, Inc.
- Charles Ingalz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical architecture for a multi-chip module
- Patent number 11,973,004
- Issue date Apr 30, 2024
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,728,240
- Issue date Aug 15, 2023
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure balancing clamp for press-pack insulated gate bipolar tran...
- Patent number 11,699,633
- Issue date Jul 11, 2023
- Beijing University of Technology
- Tong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating heat sink and elastic support thereof
- Patent number 11,658,096
- Issue date May 23, 2023
- Huawei Technologies Co., Ltd.
- Jingfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooler
- Patent number 11,652,024
- Issue date May 16, 2023
- Mitsubishi Electric Corporation
- Noriyuki Fukakusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a spring plate
- Patent number 11,621,213
- Issue date Apr 4, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backing plate with manufactured features on top surface
- Patent number 11,621,212
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit packages with mechanical braces
- Patent number 11,538,735
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding and ignition prevention device for semiconductor element, a...
- Patent number 11,502,018
- Issue date Nov 15, 2022
- Mitsubishi Electric Corporation
- Atsutoshi Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,502,019
- Issue date Nov 15, 2022
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High impact resistant heat sink
- Patent number 11,404,350
- Issue date Aug 2, 2022
- Cisco Technology, Inc.
- Vic Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Restricting pole equipped with captive ring to commonly restrain to...
- Patent number 11,373,926
- Issue date Jun 28, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Albert Harvey Terhune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for dynamic compensation of heatsink-...
- Patent number 11,158,564
- Issue date Oct 26, 2021
- Juniper Networks, Inc.
- Alexander I. Yatskov
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mechanical part for fastening processor, assembly, and computer device
- Patent number 11,133,239
- Issue date Sep 28, 2021
- Huawei Technologies Co., Ltd.
- Yonghai Mao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible base design for chipset heat sink
- Patent number 11,049,793
- Issue date Jun 29, 2021
- Quanta Computer Inc.
- Chao-Jung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,043,442
- Issue date Jun 22, 2021
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heatsink for information handling system
- Patent number 10,971,427
- Issue date Apr 6, 2021
- Dell Products L.P.
- Qinghong He
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus, system, and method for dynamic compensation of heatsink-...
- Patent number 10,943,848
- Issue date Mar 9, 2021
- Juniper Networks, Inc.
- Alexander I. Yatskov
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device for cooling electrical components
- Patent number 10,930,577
- Issue date Feb 23, 2021
- Robert Bosch GmbH
- Peter Taufer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module, power module assembly and assembling method thereof
- Patent number 10,917,999
- Issue date Feb 9, 2021
- DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
- Zhenrong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable socket connector assembly for an electronic
- Patent number 10,910,748
- Issue date Feb 2, 2021
- TE Connectivity Corporation
- Jeffery Walter Mason
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...
- Publication number 20240355759
- Publication date Oct 24, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20240355704
- Publication date Oct 24, 2024
- Hitachi Energy Ltd
- Milad Maleki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Assembly and Connector Comprising the Same
- Publication number 20240274502
- Publication date Aug 15, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Jiefeng (Lear) Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A PRESSURE DEVICE ACTING ON A SWI...
- Publication number 20240153844
- Publication date May 9, 2024
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Stefan OEHLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR PACKAGE CONSTRUCTION
- Publication number 20230395447
- Publication date Dec 7, 2023
- Lunar Energy, Inc.
- Charles Ingalz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE BALANCING CLAMP FOR PRESS-PACK INSULATED GATE BIPOLAR TRAN...
- Publication number 20230245946
- Publication date Aug 3, 2023
- BEIJING UNIVERSITY OF TECHNOLOGY
- Tong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A SUBSTRATE, POWER SEMICONDUC...
- Publication number 20230197561
- Publication date Jun 22, 2023
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Jörg AMMON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE AND ELECTRONIC DEVICE
- Publication number 20230084279
- Publication date Mar 16, 2023
- Huawei Technologies Co., Ltd
- Feng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220359344
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYER
- Publication number 20220210950
- Publication date Jun 30, 2022
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH CLAMPING DEVICE
- Publication number 20220093486
- Publication date Mar 24, 2022
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20220044984
- Publication date Feb 10, 2022
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE
- Publication number 20210351104
- Publication date Nov 11, 2021
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...
- Publication number 20210343621
- Publication date Nov 4, 2021
- Huawei Technologies Co., Ltd
- Shoubiao XU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Power Semiconductor Module
- Publication number 20210233831
- Publication date Jul 29, 2021
- ABB Power Grids Switzerland AG
- Milad Maleki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKING PLATE WITH MANUFACTURED FEATURES ON TOP SURFACE
- Publication number 20210193557
- Publication date Jun 24, 2021
- International Business Machines Corporation
- Yuan Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS
- Publication number 20210193558
- Publication date Jun 24, 2021
- Intel Corporation
- Ralph V. Miele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER
- Publication number 20200335424
- Publication date Oct 22, 2020
- Mitsubishi Electric Corporation
- Noriyuki Fukakusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESTRICTING POLE EQUIPPED WITH CAPTIVE RING TO COMMONLY RESTRAIN TO...
- Publication number 20200328135
- Publication date Oct 15, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- ALBERT HARVEY TERHUNE IV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH IMPACT RESISTANT HEAT SINK
- Publication number 20200328136
- Publication date Oct 15, 2020
- Cisco Technology, Inc.
- Vic Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE BASE DESIGN FOR CHIPSET HEAT SINK
- Publication number 20200303283
- Publication date Sep 24, 2020
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electronic Module Comprising a Semiconductor Package with Integrate...
- Publication number 20200294885
- Publication date Sep 17, 2020
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200286811
- Publication date Sep 10, 2020
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR INFORMATION HANDLING SYSTEM
- Publication number 20200251404
- Publication date Aug 6, 2020
- Dell Products L.P.
- Qinghong He
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Device for Cooling Electrical Components
- Publication number 20200243415
- Publication date Jul 30, 2020
- ROBERT BOSCH GmbH
- Peter TAUFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCATING UNIT WITH BASE SEAT LOCATING STRUCTURE
- Publication number 20200235035
- Publication date Jul 23, 2020
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H01 - BASIC ELECTRIC ELEMENTS

Compliant clamping elements not primarily serving heat-conduction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module comprising a semiconductor package with integrate...

Structure for evenly applying forces on a heat dissipation base plate

Power semiconductor module having a pressure device acting on a swi...

Backing plate assembly with jack screw for bare die device heat sin...

Power semiconductor module with baseplate and heat dissipating element

Semiconductor device

Transistor package comprising thermally conductive and electrically...

Mechanical architecture for a multi-chip module

Circuit carrier arrangement and method for producing such a circuit...

Circuit carrier arrangement and method for producing such a circuit...

Pressure balancing clamp for press-pack insulated gate bipolar tran...

Floating heat sink and elastic support thereof

Cooler

Semiconductor device including a spring plate

Backing plate with manufactured features on top surface

Method of forming integrated circuit packages with mechanical braces

Holding and ignition prevention device for semiconductor element, a...

Heat sink, heat dissipation apparatus, heat dissipation system, and...

High impact resistant heat sink

Restricting pole equipped with captive ring to commonly restrain to...

Server microprocessor carrier with guiding alignment anti-tilt and...

Apparatus, system, and method for dynamic compensation of heatsink-...

Mechanical part for fastening processor, assembly, and computer device

Flexible base design for chipset heat sink

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Heatsink for information handling system

Apparatus, system, and method for dynamic compensation of heatsink-...

Device for cooling electrical components

Power module, power module assembly and assembling method thereof

Cable socket connector assembly for an electronic

Patents Applicationslast 30 patents

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

Integrated Circuit Package and Method

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...

POWER SEMICONDUCTOR MODULE

Circuit Board Assembly and Connector Comprising the Same

POWER SEMICONDUCTOR MODULE HAVING A PRESSURE DEVICE ACTING ON A SWI...

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

Integrated Circuit Package and Method

TRANSISTOR PACKAGE CONSTRUCTION

PRESSURE BALANCING CLAMP FOR PRESS-PACK INSULATED GATE BIPOLAR TRAN...

POWER SEMICONDUCTOR MODULE COMPRISING A SUBSTRATE, POWER SEMICONDUC...

CHIP MODULE AND ELECTRONIC DEVICE

Integrated Circuit Package and Method

MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYER

POWER SEMICONDUCTOR MODULE WITH CLAMPING DEVICE

Circuit Carrier Arrangement And Method For Producing Such A Circuit...

MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE

Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...

Power Semiconductor Module

BACKING PLATE WITH MANUFACTURED FEATURES ON TOP SURFACE

TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS

COOLER

RESTRICTING POLE EQUIPPED WITH CAPTIVE RING TO COMMONLY RESTRAIN TO...

HIGH IMPACT RESISTANT HEAT SINK

FLEXIBLE BASE DESIGN FOR CHIPSET HEAT SINK

Electronic Module Comprising a Semiconductor Package with Integrate...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

HEATSINK FOR INFORMATION HANDLING SYSTEM

Device for Cooling Electrical Components

LOCATING UNIT WITH BASE SEAT LOCATING STRUCTURE