Component carrying a connection agent

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  • Information Patent Application

    ILLUMINATED SIGNAGE AND BADGES

    • Publication number 20250040040
    • Publication date Jan 30, 2025
    • CoreLED Systems, LLC
    • John Kahl
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TERMINAL STRUCTURE AND WIRING SUBSTRATE

    • Publication number 20240413063
    • Publication date Dec 12, 2024
    • Shinko Electric Industries Co., Ltd.
    • Junichi NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE

    • Publication number 20240397617
    • Publication date Nov 28, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • JOO-NYUNG JANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...

    • Publication number 20240397624
    • Publication date Nov 28, 2024
    • Western Digital Technologies, Inc.
    • Tew Wei Hong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR STORAGE DEVICE

    • Publication number 20240314929
    • Publication date Sep 19, 2024
    • KIOXIA Corporation
    • Kiyokazu ISHIZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD WITH ALTERNATE COMPONENT INTEGRATION CAPABILITY

    • Publication number 20240298405
    • Publication date Sep 5, 2024
    • Johnson Controls Tyco IP Holdings LLP
    • Shaun Bradley Atchison
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

    • Publication number 20240260188
    • Publication date Aug 1, 2024
    • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
    • Brian Mark Hostetler
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...

    • Publication number 20240260194
    • Publication date Aug 1, 2024
    • Western Digital Technologies, Inc.
    • Fu Xing Chan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FASTENER AND SEALANT

    • Publication number 20240224427
    • Publication date Jul 4, 2024
    • LEAR CORPORATION
    • Antoni PUJOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RECHARGEABLE BATTERY PACK

    • Publication number 20240222727
    • Publication date Jul 4, 2024
    • Samsung SDI Co., Ltd.
    • Jaepil AHN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT

    • Publication number 20240215162
    • Publication date Jun 27, 2024
    • Micron Technology, Inc.
    • Shriram Harihara Subramanian
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY

    • Publication number 20240206069
    • Publication date Jun 20, 2024
    • Micron Technology, Inc.
    • Bradley Russell BITZ
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL EQUIPMENT

    • Publication number 20240206073
    • Publication date Jun 20, 2024
    • Valeo eAutomotive France SAS
    • Baptiste PARIGOT
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Board, Electronic Device, and Production Method for Circuit...

    • Publication number 20240196543
    • Publication date Jun 13, 2024
    • Honor Device Co., Ltd.
    • Leiwen Gao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD GROUNDING

    • Publication number 20240196516
    • Publication date Jun 13, 2024
    • AES Global Holdings PTE Ltd.
    • Yihong Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE AND APPARATUS

    • Publication number 20240194390
    • Publication date Jun 13, 2024
    • Delta Electronics, Inc.
    • Yahong Xiong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING

    • Publication number 20240188266
    • Publication date Jun 6, 2024
    • Deere & Company
    • Ryan J. King
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL DEVICE, CAMERA, AND CIRCUIT MODULE

    • Publication number 20240179841
    • Publication date May 30, 2024
    • Canon Kabushiki Kaisha
    • HIDETO TAKAHASHI
    • G02 - OPTICS
  • Information Patent Application

    TOUCHPAD ASSEMBLY

    • Publication number 20240176440
    • Publication date May 30, 2024
    • TPK ADVANCED SOLUTIONS INC.
    • Cai Jin Ye
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240147622
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Yoon LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE AND SUBSTRATE MODULE

    • Publication number 20240107676
    • Publication date Mar 28, 2024
    • Murata Manufacturing Co., Ltd.
    • Tomohiko SUGIYAMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    APPARATUS AND POWER MODULE

    • Publication number 20240096543
    • Publication date Mar 21, 2024
    • DELTA ELECTRONICS, INC.
    • Yahong Xiong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Circuit Board Assembly and Radio Unit Comprising the Same

    • Publication number 20240080981
    • Publication date Mar 7, 2024
    • Telefonaktiebolaget LM Ericsson (publ)
    • Donghai Yu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    • Publication number 20240074068
    • Publication date Feb 29, 2024
    • InnoLux Corporation
    • Yuan-Cheng LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

    • Publication number 20240064907
    • Publication date Feb 22, 2024
    • FICT LIMITED
    • Taiji Sakai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240057251
    • Publication date Feb 15, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hong MIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

    • Publication number 20240040691
    • Publication date Feb 1, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Kwon Su YUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION

    • Publication number 20230413419
    • Publication date Dec 21, 2023
    • SERCOMM CORPORATION
    • Yujian Hou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD CONFIGURATION BLOCKS AND EDGE PROJECTIONS

    • Publication number 20230413447
    • Publication date Dec 21, 2023
    • MACOM Technology Solutions Holdings, Inc.
    • Rathnait Long
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ASSEMBLING METHOD OF ELECTRONIC MODULE

    • Publication number 20230413450
    • Publication date Dec 21, 2023
    • Delta Electronics, Inc.
    • Kun Jiang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR