Component carrying a connection agent

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CPC
H05K2201/10984

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10984Component carrying a connection agent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board, electronic device, and production method for circuit...
- Patent number 12,156,346
- Issue date Nov 26, 2024
- HONOR DEVICE CO., LTD.
- Leiwen Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module
- Patent number 12,156,339
- Issue date Nov 26, 2024
- LG Innotek Co., Ltd
- Suk Ho Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device including thermosetting bonding sheet
- Patent number 12,144,115
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 12,120,818
- Issue date Oct 15, 2024
- LG Innotek Co., Ltd
- Myung Gu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module
- Patent number 12,113,566
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Shou Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 12,108,533
- Issue date Oct 1, 2024
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board configuration blocks and edge projections
- Patent number 12,082,342
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency front-end module, manufacturing method thereof and...
- Patent number 12,022,616
- Issue date Jun 25, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power system
- Patent number 11,881,344
- Issue date Jan 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate structure
- Patent number 11,711,887
- Issue date Jul 25, 2023
- Autonetworks Technologies, Ltd.
- Shungo Hiratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate and manufacturing method th...
- Patent number 11,516,923
- Issue date Nov 29, 2022
- Koito Manufacturing Co., Ltd.
- Shinya Kusazaki
- F21 - LIGHTING
Information Patent Grant
Process for manufacturing a roll of flexible carrier for electronic...
- Patent number 11,412,620
- Issue date Aug 9, 2022
- Linxens Holding
- Christophe Mathieu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuous extrusion method for manufacturing a Z-directed componen...
- Patent number 11,390,005
- Issue date Jul 19, 2022
- Lexmark International, Inc.
- Keith Bryan Hardin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components attached to fabric
- Patent number 11,388,817
- Issue date Jul 12, 2022
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Board-to-board connecting structure and method for manufacturing th...
- Patent number 11,310,922
- Issue date Apr 19, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,272,614
- Issue date Mar 8, 2022
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, display panel and fabrication method thereof, and splice...
- Patent number 11,102,888
- Issue date Aug 24, 2021
- Beijing Boe Display Technology Co., Ltd.
- Wei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED flexible light bar
- Patent number 11,092,318
- Issue date Aug 17, 2021
- Zhongshan Lande Electronics Co., Ltd.
- Xiongwei Li
- F21 - LIGHTING
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,959,331
- Issue date Mar 23, 2021
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Chip component having groove formed therein
- Patent number 10,905,015
- Issue date Jan 26, 2021
- LG Chem, Ltd.
- Ga Young Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, air conditioner, and method for manufacturin...
- Patent number 10,897,809
- Issue date Jan 19, 2021
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transient liquid phase material bonding and sealing structures and...
- Patent number 10,840,108
- Issue date Nov 17, 2020
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,813,220
- Issue date Oct 20, 2020
- TDK Corporation
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 10,784,613
- Issue date Sep 22, 2020
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding component with pre-connected pillar in component carrier
- Patent number 10,765,005
- Issue date Sep 1, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,701,802
- Issue date Jun 30, 2020
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Grant
Electrical connector having solder posts with heights greater than...
- Patent number 10,490,910
- Issue date Nov 26, 2019
- Lotes Co., Ltd.
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,485,103
- Issue date Nov 19, 2019
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING

Patents Applicationslast 30 patents

Information Patent Application
TERMINAL STRUCTURE AND WIRING SUBSTRATE
- Publication number 20240413063
- Publication date Dec 12, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240397617
- Publication date Nov 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- JOO-NYUNG JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...
- Publication number 20240397624
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240314929
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Kiyokazu ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH ALTERNATE COMPONENT INTEGRATION CAPABILITY
- Publication number 20240298405
- Publication date Sep 5, 2024
- Johnson Controls Tyco IP Holdings LLP
- Shaun Bradley Atchison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...
- Publication number 20240260194
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FASTENER AND SEALANT
- Publication number 20240224427
- Publication date Jul 4, 2024
- LEAR CORPORATION
- Antoni PUJOL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECHARGEABLE BATTERY PACK
- Publication number 20240222727
- Publication date Jul 4, 2024
- Samsung SDI Co., Ltd.
- Jaepil AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT
- Publication number 20240215162
- Publication date Jun 27, 2024
- Micron Technology, Inc.
- Shriram Harihara Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240206069
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Bradley Russell BITZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL EQUIPMENT
- Publication number 20240206073
- Publication date Jun 20, 2024
- Valeo eAutomotive France SAS
- Baptiste PARIGOT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board, Electronic Device, and Production Method for Circuit...
- Publication number 20240196543
- Publication date Jun 13, 2024
- Honor Device Co., Ltd.
- Leiwen Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD GROUNDING
- Publication number 20240196516
- Publication date Jun 13, 2024
- AES Global Holdings PTE Ltd.
- Yihong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE AND APPARATUS
- Publication number 20240194390
- Publication date Jun 13, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING
- Publication number 20240188266
- Publication date Jun 6, 2024
- Deere & Company
- Ryan J. King
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL DEVICE, CAMERA, AND CIRCUIT MODULE
- Publication number 20240179841
- Publication date May 30, 2024
- Canon Kabushiki Kaisha
- HIDETO TAKAHASHI
- G02 - OPTICS
Information Patent Application
TOUCHPAD ASSEMBLY
- Publication number 20240176440
- Publication date May 30, 2024
- TPK ADVANCED SOLUTIONS INC.
- Cai Jin Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147622
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Yoon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND SUBSTRATE MODULE
- Publication number 20240107676
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiko SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit Board Assembly and Radio Unit Comprising the Same
- Publication number 20240080981
- Publication date Mar 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Donghai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240074068
- Publication date Feb 29, 2024
- InnoLux Corporation
- Yuan-Cheng LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240057251
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240040691
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kwon Su YUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION
- Publication number 20230413419
- Publication date Dec 21, 2023
- SERCOMM CORPORATION
- Yujian Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD CONFIGURATION BLOCKS AND EDGE PROJECTIONS
- Publication number 20230413447
- Publication date Dec 21, 2023
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLING METHOD OF ELECTRONIC MODULE
- Publication number 20230413450
- Publication date Dec 21, 2023
- Delta Electronics, Inc.
- Kun Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20230389185
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Component carrying a connection agent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board, electronic device, and production method for circuit...

Camera module

Electronic device including thermosetting bonding sheet

Printed circuit board

Radio frequency module

Circuit board and method for manufacturing thereof

Printed circuit board configuration blocks and edge projections

Radio frequency front-end module, manufacturing method thereof and...

Power module

Power system

Substrate structure

Multilayered transient liquid phase bonding

Electronic component mounting substrate and manufacturing method th...

Process for manufacturing a roll of flexible carrier for electronic...

Continuous extrusion method for manufacturing a Z-directed componen...

Electrical components attached to fabric

Board-to-board connecting structure and method for manufacturing th...

Printed wiring board and method for manufacturing the same

Substrate, display panel and fabrication method thereof, and splice...

LED flexible light bar

Electrical components attached to fabric

Chip component having groove formed therein

Printed circuit board, air conditioner, and method for manufacturin...

Transient liquid phase material bonding and sealing structures and...

Electronic component embedded substrate

Electrical connector

Embedding component with pre-connected pillar in component carrier

Electrical components attached to fabric

Electrical connector having solder posts with heights greater than...

Electrical components attached to fabric

Patents Applicationslast 30 patents

TERMINAL STRUCTURE AND WIRING SUBSTRATE

DISPLAY DEVICE

ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...

SEMICONDUCTOR STORAGE DEVICE

CIRCUIT BOARD WITH ALTERNATE COMPONENT INTEGRATION CAPABILITY

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...

FASTENER AND SEALANT

RECHARGEABLE BATTERY PACK

PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT

PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY

ELECTRICAL EQUIPMENT

Circuit Board, Electronic Device, and Production Method for Circuit...

PRINTED CIRCUIT BOARD GROUNDING

POWER MODULE AND APPARATUS

ELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING

OPTICAL DEVICE, CAMERA, AND CIRCUIT MODULE

TOUCHPAD ASSEMBLY

PRINTED CIRCUIT BOARD

CIRCUIT MODULE AND SUBSTRATE MODULE

APPARATUS AND POWER MODULE

Circuit Board Assembly and Radio Unit Comprising the Same

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION

PRINTED CIRCUIT BOARD CONFIGURATION BLOCKS AND EDGE PROJECTIONS

ASSEMBLING METHOD OF ELECTRONIC MODULE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF