Component not directly connected to the PCB

Industry

CPC
H05K2201/10962

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10962Component not directly connected to the PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface for riding heatsink
- Patent number 11,686,907
- Issue date Jun 27, 2023
- Lumentum Operations LLC
- Roozbeh Ahmadi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermal interface for riding heatsink
- Patent number 11,391,899
- Issue date Jul 19, 2022
- Lumentum Operations LLC
- Roozbeh Ahmadi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Display device and electronic equipment
- Patent number 11,329,038
- Issue date May 10, 2022
- BOE Technology Group Co., Ltd.
- Pan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact assembly
- Patent number 11,019,730
- Issue date May 25, 2021
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- G01 - MEASURING TESTING
Information Patent Grant
Terminal and method for retaining a component to a surface, and man...
- Patent number 10,869,416
- Issue date Dec 15, 2020
- HARWIN PLC
- Robert Webber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multi-component packages
- Patent number 10,757,810
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module for display device, method for manufacturing t...
- Patent number 10,687,423
- Issue date Jun 16, 2020
- LG Display Co., Ltd.
- YeonTaek Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multi-component packages
- Patent number 10,681,814
- Issue date Jun 9, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated electronic component and mounting structure thereof
- Patent number 10,629,372
- Issue date Apr 21, 2020
- Murata Manufacturing Co., Ltd.
- Yasuo Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting structure for circuit board and output terminal of power...
- Patent number 10,617,022
- Issue date Apr 7, 2020
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup unit, wiring board with cable, and manufacturing metho...
- Patent number 10,582,839
- Issue date Mar 10, 2020
- Olympus Corporation
- Takatoshi Igarashi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Power semiconductor module and power semiconductor device
- Patent number 10,561,021
- Issue date Feb 11, 2020
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High bandwidth RF or microwave interconnects for optical modulators
- Patent number 10,502,987
- Issue date Dec 10, 2019
- Lumentum Operations LLC
- Siu Kwan Cheung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor component and board having the same
- Patent number 10,468,193
- Issue date Nov 5, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodeposited contact terminal for use as an electrical connecto...
- Patent number 10,453,789
- Issue date Oct 22, 2019
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical power supply device for at least one LED and at least on...
- Patent number 10,427,585
- Issue date Oct 1, 2019
- Valeo Iluminacion
- Jose-David Roldan
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed board, display device, and method of manufacturing the disp...
- Patent number 10,426,033
- Issue date Sep 24, 2019
- Joled Inc
- Hirofumi Miyashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board module for display device, method for manufacturing t...
- Patent number 10,390,432
- Issue date Aug 20, 2019
- LG Display Co., Ltd.
- YeonTaek Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly
- Patent number 10,342,117
- Issue date Jul 2, 2019
- Marquardt GmbH
- Andreas Hamma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact assembly
- Patent number 10,314,176
- Issue date Jun 4, 2019
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with wire conductive pads and method for fixing the w...
- Patent number 10,249,971
- Issue date Apr 2, 2019
- Kao-Kung Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 10,237,977
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Ai Kiar Ang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 10,231,334
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sliding thermal contact for pluggable optic modules
- Patent number 10,197,754
- Issue date Feb 5, 2019
- Lumentum Operations LLC
- David Moore
- G02 - OPTICS
Information Patent Grant
Passive device assembly for accurate ground plane control
- Patent number 10,154,591
- Issue date Dec 11, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single element wire to board connector
- Patent number 10,116,067
- Issue date Oct 30, 2018
- AVX Corporation
- Peter Bishop
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control module and method for producing an electronic co...
- Patent number 10,098,240
- Issue date Oct 9, 2018
- Robert Bosch GmbH
- Uwe Liskow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor component and board having the same
- Patent number 10,074,481
- Issue date Sep 11, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bussed electrical center
- Patent number 10,028,391
- Issue date Jul 17, 2018
- Delphi Technologies, Inc.
- Naiki A. Reynoso Galvan
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Optoelectronic assembly and method for producing an optoelectronic...
- Patent number 9,974,177
- Issue date May 15, 2018
- Osram GmbH
- Thomas Preuschl
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...
- Publication number 20240006391
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Sangho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE FOR RIDING HEATSINK
- Publication number 20220350098
- Publication date Nov 3, 2022
- Lumentum Operations LLC
- Roozbeh AHMADI
- B32 - LAYERED PRODUCTS
Information Patent Application
DISPLAY DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20210193642
- Publication date Jun 24, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Pan XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING FASTENING ELEMENT AND METHOD FOR MOUNTING THE SAME
- Publication number 20200154589
- Publication date May 14, 2020
- DTECH PRECISION INDUSTRIES CO., LTD.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL AND METHOD FOR RETAINING A COMPONENT TO A SURFACE, AND MAN...
- Publication number 20200107477
- Publication date Apr 2, 2020
- HARWIN PLC
- Robert Webber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE FOR DISPLAY DEVICE, METHOD FOR MANUFACTURING T...
- Publication number 20190342998
- Publication date Nov 7, 2019
- LG Display Co., Ltd.
- YeonTaek Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD, DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE DISP...
- Publication number 20190124769
- Publication date Apr 25, 2019
- JOLED INC.
- Hirofumi MIYASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION CONTACTOR
- Publication number 20190097363
- Publication date Mar 28, 2019
- MODA-INNOCHIPS CO., LTD.
- Seung Hun CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR DEVICE
- Publication number 20180338376
- Publication date Nov 22, 2018
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR COMPONENT AND BOARD HAVING THE SAME
- Publication number 20180286593
- Publication date Oct 4, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MODULE FOR DISPLAY DEVICE, METHOD FOR MANUFACTURING T...
- Publication number 20180184523
- Publication date Jun 28, 2018
- LG Display Co., Ltd.
- YeonTaek Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180168038
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180153035
- Publication date May 31, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTO...
- Publication number 20180012832
- Publication date Jan 11, 2018
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE ELEMENT WIRE TO BOARD CONNECTOR
- Publication number 20180006383
- Publication date Jan 4, 2018
- AVX CORPORATION
- PETER BISHOP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIDING THERMAL CONTACT FOR PLUGGABLE OPTIC MODULES
- Publication number 20170075083
- Publication date Mar 16, 2017
- Lumentum Operations LLC
- David Moore
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE CONNECTOR AND PRINTED BOARD ASSEMBLY
- Publication number 20170068055
- Publication date Mar 9, 2017
- Fujitsu Limited
- Yasushi Masuda
- G02 - OPTICS
Information Patent Application
Electronic Control Module and Method for Producing an Electronic Co...
- Publication number 20170006711
- Publication date Jan 5, 2017
- ROBERT BOSCH GmbH
- Uwe Liskow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20150382467
- Publication date Dec 31, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR
- Publication number 20150373848
- Publication date Dec 24, 2015
- Samsung Electronics Co., Ltd.
- Jong-hyun SEOK
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVIT...
- Publication number 20150332995
- Publication date Nov 19, 2015
- STMicroelectronics Pte Ltd
- Kim-Yong GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20150287670
- Publication date Oct 8, 2015
- Mitsubishi Electric Corporation
- Tatsuya Fukase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED MODULE AND LED LAMP EMPLOYING SAME
- Publication number 20140362573
- Publication date Dec 11, 2014
- Citizen Electronics Co., Ltd.
- Sadato Imai
- F21 - LIGHTING
Information Patent Application
MULTI-CHIP SOCKET
- Publication number 20140315435
- Publication date Oct 23, 2014
- Kevin B. Leigh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SOCKET
- Publication number 20140313686
- Publication date Oct 23, 2014
- Kevin B. Leigh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE ELEMENT WIRE TO BOARD CONNECTOR
- Publication number 20140302693
- Publication date Oct 9, 2014
- Peter BISHOP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
- Publication number 20140284091
- Publication date Sep 25, 2014
- Murata Manufacturing Co., Ltd.
- Yasuo FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MOUNTING A PIEZOELECTRIC DEVICE ON A CIRCUIT BOARD AND...
- Publication number 20140268624
- Publication date Sep 18, 2014
- Adaptive Methods, Inc.
- Peter Owen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE, CIRCUIT BOARD
- Publication number 20140217608
- Publication date Aug 7, 2014
- NGK SPARK PLUG CO., LTD.
- Yasushi Takayama
- H01 - BASIC ELECTRIC ELEMENTS

Component not directly connected to the PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal interface for riding heatsink

Thermal interface for riding heatsink

Display device and electronic equipment

Contact assembly

Terminal and method for retaining a component to a surface, and man...

High density multi-component packages

Circuit board module for display device, method for manufacturing t...

High density multi-component packages

Laminated electronic component and mounting structure thereof

Connecting structure for circuit board and output terminal of power...

Image pickup unit, wiring board with cable, and manufacturing metho...

Power semiconductor module and power semiconductor device

High bandwidth RF or microwave interconnects for optical modulators

Capacitor component and board having the same

Electrodeposited contact terminal for use as an electrical connecto...

Electrical power supply device for at least one LED and at least on...

Printed board, display device, and method of manufacturing the disp...

Circuit board module for display device, method for manufacturing t...

Assembly

Contact assembly

Circuit board with wire conductive pads and method for fixing the w...

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Sliding thermal contact for pluggable optic modules

Passive device assembly for accurate ground plane control

Single element wire to board connector

Electronic control module and method for producing an electronic co...

Capacitor component and board having the same

Bussed electrical center

Optoelectronic assembly and method for producing an optoelectronic...

Patents Applicationslast 30 patents

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

THERMAL INTERFACE FOR RIDING HEATSINK

DISPLAY DEVICE AND ELECTRONIC EQUIPMENT

SOLDERING FASTENING ELEMENT AND METHOD FOR MOUNTING THE SAME

TERMINAL AND METHOD FOR RETAINING A COMPONENT TO A SURFACE, AND MAN...

CIRCUIT BOARD MODULE FOR DISPLAY DEVICE, METHOD FOR MANUFACTURING T...

PRINTED BOARD, DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE DISP...

PROTECTION CONTACTOR

POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR DEVICE

CAPACITOR COMPONENT AND BOARD HAVING THE SAME

CIRCUIT BOARD MODULE FOR DISPLAY DEVICE, METHOD FOR MANUFACTURING T...

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTO...

SINGLE ELEMENT WIRE TO BOARD CONNECTOR

SLIDING THERMAL CONTACT FOR PLUGGABLE OPTIC MODULES

OPTICAL MODULE CONNECTOR AND PRINTED BOARD ASSEMBLY

Electronic Control Module and Method for Producing an Electronic Co...

PACKAGE STRUCTURE

SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR

ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVIT...

POWER SEMICONDUCTOR DEVICE

LED MODULE AND LED LAMP EMPLOYING SAME

MULTI-CHIP SOCKET

MULTI-CHIP SOCKET

SINGLE ELEMENT WIRE TO BOARD CONNECTOR

LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF

CARRIER FOR MOUNTING A PIEZOELECTRIC DEVICE ON A CIRCUIT BOARD AND...

SEMICONDUCTOR MODULE, CIRCUIT BOARD