Components characterised by their electrical contacts

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CPC
H05K2201/10621

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10621Components characterised by their electrical contacts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Vehicular battery wiring module
- Patent number 12,119,460
- Issue date Oct 15, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electrical apparatus comprising a power semiconductor module and at...
- Patent number 12,058,805
- Issue date Aug 6, 2024
- HELLA GMBH & CO. KGAA
- Joël Afanou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Add-in card connector edge finger optimization for high-speed signa...
- Patent number 11,683,887
- Issue date Jun 20, 2023
- Dell Products L.P.
- Malikarjun Vasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module
- Patent number 11,521,906
- Issue date Dec 6, 2022
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 11,515,095
- Issue date Nov 29, 2022
- Taiyo Yuden Co., Ltd.
- Takashi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly having hybrid conductive polymer cont...
- Patent number 11,509,080
- Issue date Nov 22, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked scalable voltage regulator module for platform area miniatu...
- Patent number 11,343,906
- Issue date May 24, 2022
- Intel Corporation
- Tai Loong Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board trace for galvanic effect reduction
- Patent number 11,234,327
- Issue date Jan 25, 2022
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,166,372
- Issue date Nov 2, 2021
- Murata Manufacturing Co., Ltd.
- Junya Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly having variable height contacts
- Patent number 11,128,072
- Issue date Sep 21, 2021
- TE CONNECTIVITY SERVICES GMBH
- John Joseph Consoli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjustable circuit board assembly
- Patent number 11,081,820
- Issue date Aug 3, 2021
- Lear Corporation
- Montserrat Piñol Pedret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,973,130
- Issue date Apr 6, 2021
- FANUC CORPORATION
- Shinichirou Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module
- Patent number 10,818,566
- Issue date Oct 27, 2020
- Murata Manufacturing Co., Ltd.
- Ken Okada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device including at least one electronic chip and electr...
- Patent number 10,811,349
- Issue date Oct 20, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and method of manufacturing the same
- Patent number 10,741,465
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Katsuhiko Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical modulator
- Patent number 10,739,664
- Issue date Aug 11, 2020
- InnoLight Technology (Suzhou) LTD.
- Dongdong Yan
- G02 - OPTICS
Information Patent Grant
Solder paste with oxalic acid and amine component
- Patent number 10,434,610
- Issue date Oct 8, 2019
- Heraeus Deutschland GmbH & Co. KG
- Jens Nachreiner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 10,154,589
- Issue date Dec 11, 2018
- Hitachi Automotive Systems, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflected signal absorption in interconnect
- Patent number 9,814,130
- Issue date Nov 7, 2017
- Intel Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...
- Publication number 20230354525
- Publication date Nov 2, 2023
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR
- Publication number 20230059627
- Publication date Feb 23, 2023
- STMicroelectronics (Grenoble 2) SAS
- Justin CATANIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADD-IN CARD CONNECTOR EDGE FINGER OPTIMIZATION FOR HIGH-SPEED SIGNA...
- Publication number 20230025833
- Publication date Jan 26, 2023
- Dell Products L.P.
- Malikarjun Vasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC COMPONENT
- Publication number 20220201865
- Publication date Jun 23, 2022
- DENSO CORPORATION
- Go SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICULAR BATTERY WIRING MODULE
- Publication number 20220190392
- Publication date Jun 16, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY HAVING HYBRID CONDUCTIVE POLYMER CONT...
- Publication number 20220029325
- Publication date Jan 27, 2022
- TE Connectivity Services GmbH
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL APPARATUS COMPRISING A POWER SEMICONDUCTOR MODULE AND AT...
- Publication number 20220007491
- Publication date Jan 6, 2022
- HELLA GmbH & Co. KGaA
- Joël Afanou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE SWITCHING DEVICE INCLUDING HEAT SINKS AND CONTROL ELECT...
- Publication number 20210400815
- Publication date Dec 23, 2021
- ABB Schweiz AG
- Giovanni Salvatore
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACKED SCALABLE VOLTAGE REGULATOR MODULE FOR PLATFORM AREA MINIATU...
- Publication number 20210385942
- Publication date Dec 9, 2021
- Intel Corporation
- Tai Loong Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
- Publication number 20210249194
- Publication date Aug 12, 2021
- Taiyo Yuden Co., Ltd.
- Takashi SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT DEVICE AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20210037651
- Publication date Feb 4, 2021
- Hitachi Automotive Systems, Ltd.
- Kiminori MUTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20200258797
- Publication date Aug 13, 2020
- MURATA MANUFACTURING CO., LTD.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200045819
- Publication date Feb 6, 2020
- Murata Manufacturing Co., Ltd.
- Junya YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULATOR
- Publication number 20200012163
- Publication date Jan 9, 2020
- InnoLight Technology (Suzhou) LTD.
- Dongdong YAN
- G02 - OPTICS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190364673
- Publication date Nov 28, 2019
- FANUC CORPORATION
- Shinichirou Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BI-DIRECTIONAL OPTICAL SUB ASSEMBLY CONNECTING STRUCTURE
- Publication number 20190364672
- Publication date Nov 28, 2019
- XAVi Technologies Corporation
- KUO-HO LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190318974
- Publication date Oct 17, 2019
- MURATA MANUFACTURING CO., LTD.
- Katsuhiko FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20190318973
- Publication date Oct 17, 2019
- MURATA MANUFACTURING CO., LTD.
- Ken OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE CIRCUIT BOARD ASSEMBLY
- Publication number 20180138611
- Publication date May 17, 2018
- LEAR CORPORATION
- Montserrat Piñol Pedret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE WITH OXALIC ACID AND AMINE COMPONENT
- Publication number 20160311067
- Publication date Oct 27, 2016
- Heraeus Deutschland GmbH & Co. KG
- Jens NACHREINER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLECTED SIGNAL ABSORPTION IN INTERCONNECT
- Publication number 20160242273
- Publication date Aug 18, 2016
- Intel Corporation
- Shaowu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Control Device
- Publication number 20160073504
- Publication date Mar 10, 2016
- Hitachi Automotive Systems, Ltd.
- Miki HIRAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CHIP ATTACH USING EMBEDDED TRACES
- Publication number 20150092378
- Publication date Apr 2, 2015
- Mihir K. Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME
- Publication number 20150090480
- Publication date Apr 2, 2015
- TU-ANH N. TRAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UTILIZING CHIP-ON-GLASS TECHNOLOGY TO JUMPER ROUTING TRACES
- Publication number 20150022989
- Publication date Jan 22, 2015
- SYNAPTICS INCORPORATED
- Jim DUNPHY
- G01 - MEASURING TESTING
Information Patent Application
ANTENNA MOUNTED ON A CIRCUIT BOARD
- Publication number 20140159990
- Publication date Jun 12, 2014
- OPTICON SENSORS EUROPE B.V.
- Alexander Azhari
- H01 - BASIC ELECTRIC ELEMENTS

Components characterised by their electrical contacts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vehicular battery wiring module

Electrical apparatus comprising a power semiconductor module and at...

Add-in card connector edge finger optimization for high-speed signa...

Circuit module

Multi-layer ceramic electronic component and circuit board

Electrical connector assembly having hybrid conductive polymer cont...

Stacked scalable voltage regulator module for platform area miniatu...

Printed circuit board trace for galvanic effect reduction

Electronic device

Electrical connector assembly having variable height contacts

Adjustable circuit board assembly

Printed wiring board

Circuit module

Electronic device including at least one electronic chip and electr...

Circuit module and method of manufacturing the same

Optical modulator

Solder paste with oxalic acid and amine component

Electronic control device

Reflected signal absorption in interconnect

Bump electrode, board which has bump electrodes, and method for man...

Patents Applicationslast 30 patents

NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...

CONNECTOR

ADD-IN CARD CONNECTOR EDGE FINGER OPTIMIZATION FOR HIGH-SPEED SIGNA...

ELECTRIC COMPONENT

VEHICULAR BATTERY WIRING MODULE

ELECTRICAL CONNECTOR ASSEMBLY HAVING HYBRID CONDUCTIVE POLYMER CONT...

ELECTRICAL APPARATUS COMPRISING A POWER SEMICONDUCTOR MODULE AND AT...

SOLID STATE SWITCHING DEVICE INCLUDING HEAT SINKS AND CONTROL ELECT...

STACKED SCALABLE VOLTAGE REGULATOR MODULE FOR PLATFORM AREA MINIATU...

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

ELECTRIC CIRCUIT DEVICE AND METHOD FOR PRODUCING CIRCUIT BOARD

CIRCUIT MODULE

ELECTRONIC DEVICE

OPTICAL MODULATOR

PRINTED WIRING BOARD

BI-DIRECTIONAL OPTICAL SUB ASSEMBLY CONNECTING STRUCTURE

CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT MODULE

ADJUSTABLE CIRCUIT BOARD ASSEMBLY

SOLDER PASTE WITH OXALIC ACID AND AMINE COMPONENT

REFLECTED SIGNAL ABSORPTION IN INTERCONNECT

Electronic Control Device

DIRECT CHIP ATTACH USING EMBEDDED TRACES

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME

UTILIZING CHIP-ON-GLASS TECHNOLOGY TO JUMPER ROUTING TRACES

ANTENNA MOUNTED ON A CIRCUIT BOARD