Composite particles

Industry

CPC
H05K2201/0218

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0218Composite particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Prepreg, metal-clad laminated board, and printed wiring board
- Patent number 11,647,583
- Issue date May 9, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shimpei Obata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminate and printed wiring board
- Patent number 11,638,349
- Issue date Apr 25, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Dai Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier layer
- Patent number 11,612,062
- Issue date Mar 21, 2023
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier layer
- Patent number 11,058,011
- Issue date Jul 6, 2021
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible conductive ink
- Patent number 10,995,232
- Issue date May 4, 2021
- Henkel AG & Co. KGaA
- Jie Cao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal core solder ball and heat dissipation structure for semicondu...
- Patent number 10,661,394
- Issue date May 26, 2020
- Duksan Hi-Metal Co., Ltd.
- Yong Cheol Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core-shell nanostructures and related inks, films and methods
- Patent number 10,563,080
- Issue date Feb 18, 2020
- University of Louisville Research Foundation, Inc.
- Theodore Druffel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver nanoparticle ink
- Patent number 10,563,079
- Issue date Feb 18, 2020
- Xerox Corporation
- Pedram Salami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive composition
- Patent number 10,388,423
- Issue date Aug 20, 2019
- Henkel AG & Co. KGaA
- Adrianus Peter Van Veen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing cu core ball
- Patent number 10,370,771
- Issue date Aug 6, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure of circuit member, connection method, and conn...
- Patent number 9,999,123
- Issue date Jun 12, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable compositions comprising composite particles
- Patent number 9,914,855
- Issue date Mar 13, 2018
- Henkel AG & Co. KGaA
- Anja Henckens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped tin oxide and method for selective metallization of insulatin...
- Patent number 9,869,025
- Issue date Jan 16, 2018
- BYD Company Limited
- Qing Gong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Core-shell metallic nanoparticles, methods of production thereof, a...
- Patent number 9,833,836
- Issue date Dec 5, 2017
- Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd.
- Shlomo Magdassi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 9,402,313
- Issue date Jul 26, 2016
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive-pattern forming method and composition for forming condu...
- Patent number 9,318,243
- Issue date Apr 19, 2016
- Showa Denko K.K.
- Hiroshi Uchida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Selective deposition of magnetic particles and using magnetic mater...
- Patent number 9,251,458
- Issue date Feb 2, 2016
- Féinics AmaTech Teoranta
- David Finn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 9,224,684
- Issue date Dec 29, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuyuki Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage switchable dielectric material containing conductor-on-cond...
- Patent number 9,208,931
- Issue date Dec 8, 2015
- Littelfuse, Inc.
- Lex Kosowsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stabilized metal nanoparticles and methods for production thereof
- Patent number 9,095,898
- Issue date Aug 4, 2015
- Lockheed Martin Corporation
- Alfred A. Zinn
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Anisotropic conductive adhesive composite and film, and circuit con...
- Patent number 9,035,192
- Issue date May 19, 2015
- Cheil Industries, Inc.
- Gyu Ho Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive particle, and anisotropic conductive film, bonded struct...
- Patent number 8,932,716
- Issue date Jan 13, 2015
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Solder paste and electronic device
- Patent number 8,920,580
- Issue date Dec 30, 2014
- MURATA MANUFACTURING CO., LTD.
- Hidekiyo Takaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing conductive particle, anisotropic conductive...
- Patent number 8,821,764
- Issue date Sep 2, 2014
- Samsung Display Co., Ltd.
- Min-Sok Jang
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 8,673,050
- Issue date Mar 18, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal nanoparticles and methods for producing and using same
- Patent number 8,663,548
- Issue date Mar 4, 2014
- Lockheed Martin Corporation
- Alfred A. Zinn
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20220353988
- Publication date Nov 3, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Dai SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Barrier Layer
- Publication number 20220022325
- Publication date Jan 20, 2022
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20200362169
- Publication date Nov 19, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER FOR RESINOUS COMPOSITION, FILLER-CONTAINING SLURRY COMPOSITI...
- Publication number 20200040162
- Publication date Feb 6, 2020
- ADMATECHS CO., LTD.
- Shinta HAGIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MATERIAL DEPOSITION IN A MAGNETIC FIELD
- Publication number 20200024741
- Publication date Jan 23, 2020
- Coventry University
- Andrew Cobley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIGHT EMITTING ELEMENT
- Publication number 20190387616
- Publication date Dec 19, 2019
- CHUNGHWA PICTURE TUBES, LTD.
- Wen-Jiunn Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
- Publication number 20190150279
- Publication date May 16, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Shimpei OBATA
- B32 - LAYERED PRODUCTS
Information Patent Application
CORE-SHELL NANOSTRUCTURES AND RELATED INKS, FILMS AND METHODS
- Publication number 20170253758
- Publication date Sep 7, 2017
- UNIVERSITY OF LOUISVILLE RESEARCH FOUNDATION, INC.
- Theodore DRUFFEL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE PASTE, METHOD OF PRODUCING PATTERN, METHOD OF PRODUCING...
- Publication number 20160358688
- Publication date Dec 8, 2016
- TORAY INDUSTRIES, INC.
- Miharu Tanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES
- Publication number 20140367854
- Publication date Dec 18, 2014
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PATTERN
- Publication number 20140360763
- Publication date Dec 11, 2014
- TORAY INDUSTRIES, INC.
- Tsukuru Mizuguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME
- Publication number 20140349030
- Publication date Nov 27, 2014
- SHENZHEN BYD AUTO R&D COMPANY LIMITED
- Qing GONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYBRID MATERIALS FOR PRINTING (SEMI-) CONDUCTIVE ELEMENTS
- Publication number 20140220238
- Publication date Aug 7, 2014
- Nederlandse Organisatie voor toegepast-natuur- wetenschappelijk Onderzoek TNO
- Robert J. Abbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF MAGNETIC PARTICLES AND USING MAGNETIC MATER...
- Publication number 20140209691
- Publication date Jul 31, 2014
- David Finn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20140209366
- Publication date Jul 31, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuyuki Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDU...
- Publication number 20140183733
- Publication date Jul 3, 2014
- DUKSAN HI-METAL CO., LTD.
- Yong Cheol CHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...
- Publication number 20140140030
- Publication date May 22, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME
- Publication number 20140134350
- Publication date May 15, 2014
- Lockheed Martin Corporation
- Alfred A. Zinn
- B82 - NANO-TECHNOLOGY
Information Patent Application
HIGH-DIELECTRIC MATERIAL
- Publication number 20130341818
- Publication date Dec 26, 2013
- MBDA UK LIMITED
- Michael Dunleavy
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Bonded Board and Manufacturing Method Thereof
- Publication number 20130133936
- Publication date May 30, 2013
- Hitachi, Ltd
- Chiko YORITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CONDUCTIVE CIRCUIT
- Publication number 20130092423
- Publication date Apr 18, 2013
- Yoshitaka HAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE PARTICLES, CONDUCTIVE PASTE, AND CIRCUIT BOARD
- Publication number 20120247817
- Publication date Oct 4, 2012
- SONY CORPORATION
- Hayato Hommura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL
- Publication number 20120228559
- Publication date Sep 13, 2012
- Hitachi Chemical Company, Ltd.
- Nana Enomoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE...
- Publication number 20120152455
- Publication date Jun 21, 2012
- Samsung Electronics Co., Ltd.
- Min-Sok JANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
STABILIZED METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF
- Publication number 20120114521
- Publication date May 10, 2012
- Lockheed Martin Corporation
- Alfred A. ZINN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...
- Publication number 20120106111
- Publication date May 3, 2012
- JOSEPH MAZZOCHETTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME
- Publication number 20120100374
- Publication date Apr 26, 2012
- Lockheed Martin Corporation
- Alfred A. ZINN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE PARTICLE, AND ANISOTROPIC CONDUCTIVE FILM, BONDED STRUCT...
- Publication number 20120090882
- Publication date Apr 19, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Tomoyuki ISHIMATSU
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE FINE PARTICLES, ANISOTROPIC CONDUCTIVE ELEMENT, AND CONN...
- Publication number 20120056136
- Publication date Mar 8, 2012
- Taku Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Composite particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Prepreg, metal-clad laminated board, and printed wiring board

Metal-clad laminate and printed wiring board

Barrier layer

Barrier layer

Flexible conductive ink

Metal core solder ball and heat dissipation structure for semicondu...

Core-shell nanostructures and related inks, films and methods

Silver nanoparticle ink

Electrically conductive composition

Method of manufacturing cu core ball

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Connection structure of circuit member, connection method, and conn...

Curable compositions comprising composite particles

Doped tin oxide and method for selective metallization of insulatin...

Core-shell metallic nanoparticles, methods of production thereof, a...

UV-curable anisotropic conductive adhesive

Component-mounted structure

Electroconductive microparticles, anisotropic electroconductive mat...

Conductive material, conductive paste, circuit board, and semicondu...

Conductive-pattern forming method and composition for forming condu...

Selective deposition of magnetic particles and using magnetic mater...

Wiring board and method of manufacturing wiring board

Voltage switchable dielectric material containing conductor-on-cond...

Stabilized metal nanoparticles and methods for production thereof

Anisotropic conductive adhesive composite and film, and circuit con...

Conductive particle, and anisotropic conductive film, bonded struct...

Solder paste and electronic device

Method of manufacturing conductive particle, anisotropic conductive...

Conductive material, conductive paste, circuit board, and semicondu...

Metal nanoparticles and methods for producing and using same

Patents Applicationslast 30 patents

METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

Barrier Layer

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

FILLER FOR RESINOUS COMPOSITION, FILLER-CONTAINING SLURRY COMPOSITI...

MATERIAL DEPOSITION IN A MAGNETIC FIELD

LIGHT EMITTING ELEMENT

PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD

CORE-SHELL NANOSTRUCTURES AND RELATED INKS, FILMS AND METHODS

CONDUCTIVE PASTE, METHOD OF PRODUCING PATTERN, METHOD OF PRODUCING...

INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PATTERN

POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME

HYBRID MATERIALS FOR PRINTING (SEMI-) CONDUCTIVE ELEMENTS

SELECTIVE DEPOSITION OF MAGNETIC PARTICLES AND USING MAGNETIC MATER...

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDU...

CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...

METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME

HIGH-DIELECTRIC MATERIAL

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

Bonded Board and Manufacturing Method Thereof

METHOD FOR FORMING CONDUCTIVE CIRCUIT

CONDUCTIVE PARTICLES, CONDUCTIVE PASTE, AND CIRCUIT BOARD

CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL

METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE...

STABILIZED METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...

METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME

CONDUCTIVE PARTICLE, AND ANISOTROPIC CONDUCTIVE FILM, BONDED STRUCT...

CONDUCTIVE FINE PARTICLES, ANISOTROPIC CONDUCTIVE ELEMENT, AND CONN...