Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Industry

CPC
H05K3/3489

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board assembly process using multiple solders and a...
- Patent number 12,035,483
- Issue date Jul 9, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling components implementing a pre-treatment of th...
- Patent number 11,855,038
- Issue date Dec 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for curing solder paste on a thermally fragile substrate
- Patent number 11,647,594
- Issue date May 9, 2023
- PulseForge, Inc.
- Rob Jacob Hendriks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin flux solder paste and mount structure
- Patent number 11,623,307
- Issue date Apr 11, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, resin flux cored solder, and solder paste
- Patent number 11,541,485
- Issue date Jan 3, 2023
- KOKI COMPANY LIMITED
- Kazuhiro Yukikata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste using a solder paste flux and solder powder
- Patent number 11,425,825
- Issue date Aug 23, 2022
- KOKI COMPANY LIMITED
- Yuki Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition, solder paste composition, and solder joint
- Patent number 11,370,069
- Issue date Jun 28, 2022
- Senju Metal Industry Co., Ltd.
- Tomoko Nonaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser soldering system
- Patent number 11,351,622
- Issue date Jun 7, 2022
- TE Connectivity Corporation
- Hongzhou Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux
- Patent number 11,305,385
- Issue date Apr 19, 2022
- Senju Metal Industry Co., Ltd.
- Tomohisa Kawanago
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method, component mounting system, and manufactu...
- Patent number 11,140,788
- Issue date Oct 5, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tetsuya Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for applying solder paste flux
- Patent number 11,076,490
- Issue date Jul 27, 2021
- Mycronic AB
- Johan Bergström
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for backlight source
- Patent number 11,000,911
- Issue date May 11, 2021
- Yong Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux residue detection
- Patent number 10,939,600
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition, electronic board, and bonding method
- Patent number 10,913,132
- Issue date Feb 9, 2021
- Tamura Corporation
- Nobuhiro Yamashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Viscous fluid supply device
- Patent number 10,888,943
- Issue date Jan 12, 2021
- FUJI CORPORATION
- Tadashi Murase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recondition process for BGA using flux
- Patent number 10,881,007
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Tim A. Bartsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for curing solder paste on a thermally fragile substrate
- Patent number 10,849,239
- Issue date Nov 24, 2020
- NCC Nano, LLC
- Rob Jacob Hendriks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder flux
- Patent number 10,835,999
- Issue date Nov 17, 2020
- University of Leicester
- Karl Ryder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for jetting droplets
- Patent number 10,786,858
- Issue date Sep 29, 2020
- Mycronic AB
- Andreas Bergström
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electronic component mounting substrate, and...
- Patent number 10,753,551
- Issue date Aug 25, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshiaki Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member, method for manufacturing bonding member, and bondin...
- Patent number 10,625,376
- Issue date Apr 21, 2020
- MURATA MANUFACTURING CO., LTD.
- Seitaro Washizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-heating solder flux material
- Patent number 10,610,980
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for jetting droplets
- Patent number 10,610,942
- Issue date Apr 7, 2020
- Mycronic AB
- Andreas Bergström
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, electric compressor, and air conditioner
- Patent number 10,492,303
- Issue date Nov 26, 2019
- MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
- Makoto Hattori
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solder composition and electronic board
- Patent number 10,449,638
- Issue date Oct 22, 2019
- Tamura Corporation
- Daigo Ichikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste with oxalic acid and amine component
- Patent number 10,434,610
- Issue date Oct 8, 2019
- Heraeus Deutschland GmbH & Co. KG
- Jens Nachreiner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux applying apparatus
- Patent number 10,434,592
- Issue date Oct 8, 2019
- Fujitsu Ten Limited
- Hisaki Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-heating solder flux material
- Patent number 10,328,535
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition containing carbon component, solder paste containi...
- Patent number 10,272,511
- Issue date Apr 30, 2019
- Hyundai Motor Company
- Jeejung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...
- Publication number 20240341040
- Publication date Oct 10, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND METHOD FOR PRODUCING ASSEMBLY
- Publication number 20240326176
- Publication date Oct 3, 2024
- SENJU METAL INDUSTRY CO., LTD
- Yasuhisa SUKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240314939
- Publication date Sep 19, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
- Publication number 20240268036
- Publication date Aug 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shingo OKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE...
- Publication number 20240224419
- Publication date Jul 4, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- KUEI-FENG PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD FOR MAKING A LIGHTING DEVICE
- Publication number 20240032199
- Publication date Jan 25, 2024
- SIGNFY HOLDING B.V.
- Aldegonda Lucia WEIJERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE
- Publication number 20240015893
- Publication date Jan 11, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masayuki MANTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING METHOD FOR MICRO-LED
- Publication number 20230116166
- Publication date Apr 13, 2023
- LEDMAN OPTOELECTRONIC CO., LTD.
- Mantie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...
- Publication number 20220173069
- Publication date Jun 2, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Olivier CASTANY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX, METHOD FOR APPLYING FLUX, AND METHOD FOR MOUNTING SOLDER BALL
- Publication number 20220009041
- Publication date Jan 13, 2022
- SENJU METAL INDUSTRY CO., LTD
- Takahiro NISHIZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FLUX SOLDER PASTE AND MOUNT STRUCTURE
- Publication number 20210354251
- Publication date Nov 18, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR APPLYING SOLDER PASTE FLUX
- Publication number 20210352808
- Publication date Nov 11, 2021
- Mycronic AB
- Johan BERGSTRÖM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Assembly Process Using Multiple Solders And A...
- Publication number 20210315107
- Publication date Oct 7, 2021
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE
- Publication number 20210037661
- Publication date Feb 4, 2021
- NCC NANO, LLC
- ROB JACOB HENDRIKS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND SOLDER JOINT
- Publication number 20200353574
- Publication date Nov 12, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Tomoko NONAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR BACKLIGHT SOURCE
- Publication number 20200261994
- Publication date Aug 20, 2020
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Yong YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX RESIDUE DETECTION
- Publication number 20200170155
- Publication date May 28, 2020
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX, RESIN FLUX CORED SOLDER, AND SOLDER PASTE
- Publication number 20200114477
- Publication date Apr 16, 2020
- KOKI COMPANY LIMITED
- Kazuhiro YUKIKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD
- Publication number 20190275600
- Publication date Sep 12, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX TRANSFER METHOD
- Publication number 20190247944
- Publication date Aug 15, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING METHOD, COMPONENT MOUNTING SYSTEM, AND MANUFACTU...
- Publication number 20190254174
- Publication date Aug 15, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TETSUYA TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-HEATING SOLDER FLUX MATERIAL
- Publication number 20190232439
- Publication date Aug 1, 2019
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX FOR SOLDER PASTE AND SOLDER PASTE
- Publication number 20190182966
- Publication date Jun 13, 2019
- KOKI COMPANY LIMITED
- Yuki YAMAMOTO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER FLUX CONTAINING FLUORESCENT MICROCAPSULES AND METHOD TO VISU...
- Publication number 20190118312
- Publication date Apr 25, 2019
- International Business Machines Corporation
- Jennifer I. BENNETT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER COMPOSITION, ELECTRONIC BOARD, AND BONDING METHOD
- Publication number 20190061070
- Publication date Feb 28, 2019
- TAMURA CORPORATION
- Nobuhiro Yamashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20180339371
- Publication date Nov 29, 2018
- HARIMA CHEMICALS, INC.
- Kosuke INOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR THE MANUFACTURE OF FLUX COMPOSITIONS
- Publication number 20180221996
- Publication date Aug 9, 2018
- SOLVAY S.A.
- Stefanie VOLMER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board assembly process using multiple solders and a...

Method for assembling components implementing a pre-treatment of th...

Method for curing solder paste on a thermally fragile substrate

Resin flux solder paste and mount structure

Flux, resin flux cored solder, and solder paste

Solder paste using a solder paste flux and solder powder

Flux composition, solder paste composition, and solder joint

Laser soldering system

Flux

Component mounting method, component mounting system, and manufactu...

Method and device for applying solder paste flux

Manufacturing method for backlight source

Flux residue detection

Solder composition, electronic board, and bonding method

Viscous fluid supply device

Recondition process for BGA using flux

Method for curing solder paste on a thermally fragile substrate

Solder flux

Method and device for jetting droplets

Electronic component, electronic component mounting substrate, and...

Bonding member, method for manufacturing bonding member, and bondin...

Self-heating solder flux material

Method and device for jetting droplets

Substrate, electric compressor, and air conditioner

Solder composition and electronic board

Solder paste with oxalic acid and amine component

Resin fluxed solder paste, and mount structure

Flux applying apparatus

Self-heating solder flux material

Flux composition containing carbon component, solder paste containi...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...

FLUX AND METHOD FOR PRODUCING ASSEMBLY

METHOD OF BONDING COLUMN TYPE DEPOSITS

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

CAMERA MODULE PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

A METHOD FOR MAKING A LIGHTING DEVICE

MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE

DIE BONDING METHOD FOR MICRO-LED

METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...

FLUX, METHOD FOR APPLYING FLUX, AND METHOD FOR MOUNTING SOLDER BALL

RESIN FLUX SOLDER PASTE AND MOUNT STRUCTURE

METHOD AND DEVICE FOR APPLYING SOLDER PASTE FLUX

Printed Circuit Board Assembly Process Using Multiple Solders And A...

METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE

FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND SOLDER JOINT

MANUFACTURING METHOD FOR BACKLIGHT SOURCE

FLUX RESIDUE DETECTION

FLUX, RESIN FLUX CORED SOLDER, AND SOLDER PASTE

FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD

FLUX TRANSFER METHOD

COMPONENT MOUNTING METHOD, COMPONENT MOUNTING SYSTEM, AND MANUFACTU...

SELF-HEATING SOLDER FLUX MATERIAL

FLUX FOR SOLDER PASTE AND SOLDER PASTE

SOLDER FLUX CONTAINING FLUORESCENT MICROCAPSULES AND METHOD TO VISU...

SOLDER COMPOSITION, ELECTRONIC BOARD, AND BONDING METHOD

FLUX AND SOLDER PASTE

HYBRID LOW METAL LOADING FLUX

PROCESS FOR THE MANUFACTURE OF FLUX COMPOSITIONS