comprising a photoconductive layer deposited on the CCD structure

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H01L27/14893

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14893comprising a photoconductive layer deposited on the CCD structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light detecting device
- Patent number 11,716,555
- Issue date Aug 1, 2023
- Sony Corporation
- Tomohiro Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,404,457
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Gwi-Deok Ryan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photocathode including silicon substrate with boron layer
- Patent number 11,081,310
- Issue date Aug 3, 2021
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor with high-permittivity material film and a...
- Patent number 10,944,930
- Issue date Mar 9, 2021
- Sony Corporation
- Tomohiro Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 10,861,887
- Issue date Dec 8, 2020
- Samsung Electronics Co., Ltd.
- Gwi-Deok Ryan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 10,483,302
- Issue date Nov 19, 2019
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image sensor, method for producing solid-state image se...
- Patent number 10,462,404
- Issue date Oct 29, 2019
- Sony Corporation
- Tomohiro Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photocathode including silicon substrate with boron layer
- Patent number 10,199,197
- Issue date Feb 5, 2019
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- G02 - OPTICS
Information Patent Grant
Device for non-destructive testing of a component by analyzing gene...
- Patent number 8,173,964
- Issue date May 8, 2012
- Airbus Operations SAS
- Marie-Anne De Smet
- G01 - MEASURING TESTING
Information Patent Grant
Solid-state image sensing device
- Patent number 7,372,089
- Issue date May 13, 2008
- FUJIFILM Corporation
- Tomoki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for detecting wide wavelength ranges
- Patent number 6,872,992
- Issue date Mar 29, 2005
- Hamamatsu Photonics K.K.
- Masaharu Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a delta-doped CCD to determine the energy of a low-energy par...
- Patent number 6,278,119
- Issue date Aug 21, 2001
- California Institute of Technology
- Shouleh Nikzad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state radiation detector having a charge transfer device
- Patent number 6,114,685
- Issue date Sep 5, 2000
- Seiko Instruments R&D Center Inc.
- Keiji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device with nand cell structure
- Patent number 5,418,387
- Issue date May 23, 1995
- Kabushiki Kaisha Toshiba
- Nobuo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray image intensifier having an image sensor with amorphous semic...
- Patent number 5,365,056
- Issue date Nov 15, 1994
- Siemens Aktiengesellschaft
- Hartmut Sklebitz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state imaging device suppressing dark-current noise
- Patent number 5,343,061
- Issue date Aug 30, 1994
- Kabushiki Kaisha Toshiba
- Hirofumi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color solid-state image sensor
- Patent number 4,783,691
- Issue date Nov 8, 1988
- Kabushiki Kaisha Toshiba
- Nozomu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visible/infrared imaging device with stacked cell structure
- Patent number 4,651,001
- Issue date Mar 17, 1987
- Kabushiki Kaisha Toshiba
- Nozomu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a solid-state image pickup device
- Patent number 4,608,749
- Issue date Sep 2, 1986
- Kabushiki Kaisha Toshiba
- Nozomu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One-dimensional image sensor
- Patent number 4,365,274
- Issue date Dec 21, 1982
- Fuji Xerox Co., Ltd.
- Mutsuo Takenouchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE IMAGE SENSOR, METHOD FOR PRODUCING SOLID-STATE IMAGE SE...
- Publication number 20210160447
- Publication date May 27, 2021
- SONY CORPORATION
- Tomohiro Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20210066362
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- GWI-DEOK RYAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOCATHODE INCLUDING SILICON SUBSTRATE WITH BORON LAYER
- Publication number 20190066962
- Publication date Feb 28, 2019
- Yung-Ho Alex Chuang
- G02 - OPTICS
Information Patent Application
IMAGE SENSOR
- Publication number 20180190697
- Publication date Jul 5, 2018
- Samsung Electronics Co., Ltd.
- GWI-DEOK RYAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR, METHOD FOR PRODUCING SOLID-STATE IMAGE SE...
- Publication number 20170244920
- Publication date Aug 24, 2017
- SONY CORPORATION
- Tomohiro Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20170229501
- Publication date Aug 10, 2017
- Hamamatsu Photonics K.K.
- Shin-ichiro TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photocathode Including Silicon Substrate With Boron Layer
- Publication number 20170069455
- Publication date Mar 9, 2017
- YUNG-HO ALEX CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR NON DESTRUCTIVE TESTING OF A COMPONENT BY ANALYZING RADI...
- Publication number 20100011861
- Publication date Jan 21, 2010
- AIRBUS FRANCE
- Marie-Anne De Smet
- G01 - MEASURING TESTING
Information Patent Application
Solid-state image sensing device
- Publication number 20060214199
- Publication date Sep 28, 2006
- Fuji Photo Film Co., Ltd.
- Tomoki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020020859
- Publication date Feb 21, 2002
- Hamamatsu Photonics K.K.
- Masaharu Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS

comprising a photoconductive layer deposited on the CCD structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light detecting device

Image sensor

Photocathode including silicon substrate with boron layer

Solid-state image sensor with high-permittivity material film and a...

Image sensor

Solid-state imaging device

Solid-state image sensor, method for producing solid-state image se...

Photocathode including silicon substrate with boron layer

Device for non-destructive testing of a component by analyzing gene...

Solid-state image sensing device

Semiconductor device for detecting wide wavelength ranges

Using a delta-doped CCD to determine the energy of a low-energy par...

Solid-state radiation detector having a charge transfer device

Solid-state imaging device with nand cell structure

X-ray image intensifier having an image sensor with amorphous semic...

Solid-state imaging device suppressing dark-current noise

Color solid-state image sensor

Visible/infrared imaging device with stacked cell structure

Method of manufacturing a solid-state image pickup device

One-dimensional image sensor

Patents Applicationslast 30 patents

SOLID-STATE IMAGE SENSOR, METHOD FOR PRODUCING SOLID-STATE IMAGE SE...

IMAGE SENSOR

PHOTOCATHODE INCLUDING SILICON SUBSTRATE WITH BORON LAYER

IMAGE SENSOR

SOLID-STATE IMAGE SENSOR, METHOD FOR PRODUCING SOLID-STATE IMAGE SE...

SOLID-STATE IMAGING DEVICE

Photocathode Including Silicon Substrate With Boron Layer

DEVICE FOR NON DESTRUCTIVE TESTING OF A COMPONENT BY ANALYZING RADI...

Solid-state image sensing device

Semiconductor device