comprising arrays of active devices and fibres

Industry

CPC
G02B6/4249

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4249comprising arrays of active devices and fibres

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sealed optical transceiver
- Patent number 12,253,725
- Issue date Mar 18, 2025
- Samtec, Inc.
- Matthew Brian Puffer
- G02 - OPTICS
Information Patent Grant
Optical components for electronic devices
- Patent number 12,253,728
- Issue date Mar 18, 2025
- Apple Inc.
- Vivek Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber shuffle embedded optical connector
- Patent number 12,253,724
- Issue date Mar 18, 2025
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Photonic communication platform and related methods for increasing...
- Patent number 12,237,871
- Issue date Feb 25, 2025
- Lightmatter, Inc.
- Mykhailo Tymchenko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical circuit module
- Patent number 12,222,567
- Issue date Feb 11, 2025
- Nippon Telegraph and Telephone Corporation
- Yuichiro Ikuma
- G02 - OPTICS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic edge coupled connector via collimation
- Patent number 12,216,313
- Issue date Feb 4, 2025
- Avago Technologies International Sales Pte. Limited
- Rebecca Schaevitz
- G02 - OPTICS
Information Patent Grant
Co-packaged optics
- Patent number 12,197,019
- Issue date Jan 14, 2025
- Teramount Ltd.
- Abraham Israel
- G02 - OPTICS
Information Patent Grant
Optical coupling
- Patent number 12,189,195
- Issue date Jan 7, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
8WDM optical transceiver at 10nm wavelength grid
- Patent number 12,184,334
- Issue date Dec 31, 2024
- Google LLC
- Liming Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Additive manufacture in metals with a fiber array laser source and...
- Patent number 12,172,235
- Issue date Dec 24, 2024
- II-VI DELAWARE, INC.
- Mikhail A. Vorontsov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic modules and wafer-level methods for manufacturing th...
- Patent number 12,169,315
- Issue date Dec 17, 2024
- ams Sensors Singapore Pte. Ltd.
- Qi Chuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside optical connector
- Patent number 12,164,159
- Issue date Dec 10, 2024
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Methods, systems, and devices for integrating wireless technology i...
- Patent number 12,149,288
- Issue date Nov 19, 2024
- CommScope Technologies LLC
- Trevor D. Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIC die and package with multiple level and multiple depth connecti...
- Patent number 12,130,470
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Yield enhancement techniques for photonic communications platform
- Patent number 12,130,484
- Issue date Oct 29, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Grant
Pluggable optical modules with blind mate optical connectors
- Patent number 12,092,858
- Issue date Sep 17, 2024
- Cisco Technology, Inc.
- Jock T. Bovington
- G02 - OPTICS
Information Patent Grant
Signal transmission device based on MID/LDS technology and assembly...
- Patent number 12,080,977
- Issue date Sep 3, 2024
- HANGZHOU MO-LINK TECHNOLOGY CO. LTD
- Cheng Zhi Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver and methods of making and using the same
- Patent number 12,072,540
- Issue date Aug 27, 2024
- SOURCE PHOTONICS (CHENGDU) COMPANY, LTD.
- Jinglei Mao
- G02 - OPTICS
Information Patent Grant
Fixture and method for attaching fibers to V-grooves of photonic in...
- Patent number 12,061,368
- Issue date Aug 13, 2024
- Google LLC
- Daoyi Wang
- G02 - OPTICS
Information Patent Grant
Aligning optical circuit and aligning method
- Patent number 12,055,773
- Issue date Aug 6, 2024
- Nippon Telegraph and Telephone Corporation
- Toru Miura
- G02 - OPTICS
Information Patent Grant
Electronic devices with optical fiber ribbons
- Patent number 12,013,585
- Issue date Jun 18, 2024
- Apple Inc.
- Prabhakar Gulgunje
- G02 - OPTICS
Information Patent Grant
Light-emitting cable structure
- Patent number 11,994,727
- Issue date May 28, 2024
- Hsu-Shen Chin
- G02 - OPTICS
Information Patent Grant
Ribbon fanout for multicore fiber connectivity
- Patent number 11,988,886
- Issue date May 21, 2024
- Amazon Technologies, Inc.
- Patrick Stephen Van Vickle
- G02 - OPTICS
Information Patent Grant
Optical fiber-to-chip interconnection
- Patent number 11,982,848
- Issue date May 14, 2024
- Nubis Communications, Inc.
- Lukas Elsinger
- G02 - OPTICS
Information Patent Grant
Optical receptacle and optical module
- Patent number 11,921,331
- Issue date Mar 5, 2024
- Enplas Corporation
- Takahiro Izawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote memory architectures enabled by monolithic in-package optica...
- Patent number 11,916,602
- Issue date Feb 27, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Grant
Pluggable optical module and optical communication system
- Patent number 11,906,797
- Issue date Feb 20, 2024
- NEC Corporation
- Yuuji Minota
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vertical integrated photonics chiplet for in-package optical interc...
- Patent number 11,899,251
- Issue date Feb 13, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Optical Module
- Publication number 20250110297
- Publication date Apr 3, 2025
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Tao WU
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250110296
- Publication date Apr 3, 2025
- Industrial Technology Research Institute
- Tsung-Jun Ho
- G02 - OPTICS
Information Patent Application
OPTICAL COMPONENTS FOR ELECTRONIC DEVICES
- Publication number 20250110298
- Publication date Apr 3, 2025
- Apple Inc.
- Vivek Venugopal
- G02 - OPTICS
Information Patent Application
HIGH-POWER FIBER ARRAY ASSEMBLY HAVING BUILT-IN COOLING ARRANGEMENT
- Publication number 20250110300
- Publication date Apr 3, 2025
- Molex, LLC
- Devinder Pal Singh Saini
- G02 - OPTICS
Information Patent Application
High Speed Optical Links for High-Bandwidth Memory Systems
- Publication number 20250102746
- Publication date Mar 27, 2025
- Google LLC
- Horia Alexandru Toma
- G02 - OPTICS
Information Patent Application
Optical Coupling
- Publication number 20250085492
- Publication date Mar 13, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
STRUCTURE AND METHOD FOR FASTENING OPTICAL FIBER CABLE TO SILICON P...
- Publication number 20250076596
- Publication date Mar 6, 2025
- Marvell Asia Pte Ltd.
- Pei-Keng Fu
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND OPTICAL TRANSCEIVER
- Publication number 20250052964
- Publication date Feb 13, 2025
- FUJITSU OPTICAL COMPONENTS LIMITED
- Yamato IWAMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CO-PACKAGED ASSEMBLY AND NETWORK DEVICE
- Publication number 20250044529
- Publication date Feb 6, 2025
- ZTE CORPORATION
- Ningfeng TANG
- G02 - OPTICS
Information Patent Application
Micro-LED/PD arrangements and selection in an optical interconnect...
- Publication number 20250048006
- Publication date Feb 6, 2025
- CIENA CORPORATION
- Daniel Rivaud
- G02 - OPTICS
Information Patent Application
LIGHT SOURCE DEVICE AND OPTICAL COUPLING STRUCTURE AND OPTOELECTRON...
- Publication number 20250035866
- Publication date Jan 30, 2025
- AIP Inc.
- Chia Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM
- Publication number 20250028130
- Publication date Jan 23, 2025
- Lightmatter, Inc
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Application
OPTICAL FIBER-TO-CHIP INTERCONNECTION
- Publication number 20250020877
- Publication date Jan 16, 2025
- Nubis Communications, Inc.
- Lukas Elsinger
- G02 - OPTICS
Information Patent Application
STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...
- Publication number 20250004206
- Publication date Jan 2, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20240427097
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20240402421
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
Pattern projector
- Publication number 20240393551
- Publication date Nov 28, 2024
- Apple Inc.
- Refael Della Pergola
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240345337
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Tai-Hsiang LIU
- G02 - OPTICS
Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...
- Publication number 20240272383
- Publication date Aug 15, 2024
- PICadvanced S.A.
- Francisco Manuel RUIVO RODRIGUES
- G02 - OPTICS
Information Patent Application
SILICON PHOTONICS PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SW...
- Publication number 20240264393
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Seok Geun Ahn
- G02 - OPTICS
Information Patent Application
Remote Memory Architectures Enabled by Monolithic In-Package Optica...
- Publication number 20240187110
- Publication date Jun 6, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ULTRAVIOLET LIGHT IRRADIATION SYSTEM AND ULTRAVIOLET LIGHT IRRADIAT...
- Publication number 20240181099
- Publication date Jun 6, 2024
- Nippon Telegraph and Telephone Corporation
- Tomohiro TANIGUCHI
- G02 - OPTICS
Information Patent Application
Vertical Integrated Photonics Chiplet for In-Package Optical Interc...
- Publication number 20240176081
- Publication date May 30, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM
- Publication number 20240142729
- Publication date May 2, 2024
- NEC Corporation
- Yuuji MINOTA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical Coupling
- Publication number 20240118505
- Publication date Apr 11, 2024
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
PHOTONIC OPTOELECTRONIC MODULE PACKAGING
- Publication number 20240118506
- Publication date Apr 11, 2024
- II-VI Delaware, Inc.
- Gilles P. Denoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR ASSEMBLY FOR OPTO-ELECTRONIC SYSTEMS
- Publication number 20240103225
- Publication date Mar 28, 2024
- II-VI Delaware, Inc.
- Po DONG
- G02 - OPTICS

comprising arrays of active devices and fibres

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sealed optical transceiver

Optical components for electronic devices

Fiber shuffle embedded optical connector

Photonic communication platform and related methods for increasing...

Optical circuit module

Package and method of forming same

Silicon photonic edge coupled connector via collimation

Co-packaged optics

Optical coupling

8WDM optical transceiver at 10nm wavelength grid

Additive manufacture in metals with a fiber array laser source and...

Optoelectronic modules and wafer-level methods for manufacturing th...

Backside optical connector

Methods, systems, and devices for integrating wireless technology i...

Transceiver and interface for IC package

PIC die and package with multiple level and multiple depth connecti...

Yield enhancement techniques for photonic communications platform

Pluggable optical modules with blind mate optical connectors

Signal transmission device based on MID/LDS technology and assembly...

Optical transceiver and methods of making and using the same

Fixture and method for attaching fibers to V-grooves of photonic in...

Aligning optical circuit and aligning method

Electronic devices with optical fiber ribbons

Light-emitting cable structure

Ribbon fanout for multicore fiber connectivity

Optical fiber-to-chip interconnection

Optical receptacle and optical module

Remote memory architectures enabled by monolithic in-package optica...

Pluggable optical module and optical communication system

Vertical integrated photonics chiplet for in-package optical interc...

Patents Applicationslast 30 patents

Optical Module

OPTICAL COUPLING MODULE AND MANUFACTURING METHOD THEREOF

OPTICAL COMPONENTS FOR ELECTRONIC DEVICES

HIGH-POWER FIBER ARRAY ASSEMBLY HAVING BUILT-IN COOLING ARRANGEMENT

High Speed Optical Links for High-Bandwidth Memory Systems

Optical Coupling

STRUCTURE AND METHOD FOR FASTENING OPTICAL FIBER CABLE TO SILICON P...

OPTICAL DEVICE AND OPTICAL TRANSCEIVER

CO-PACKAGED ASSEMBLY AND NETWORK DEVICE

Micro-LED/PD arrangements and selection in an optical interconnect...

LIGHT SOURCE DEVICE AND OPTICAL COUPLING STRUCTURE AND OPTOELECTRON...

YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM

OPTICAL FIBER-TO-CHIP INTERCONNECTION

STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

Pattern projector

PACKAGE AND METHOD OF FORMING SAME

OPTICAL DEVICE

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...

SILICON PHOTONICS PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SW...

Remote Memory Architectures Enabled by Monolithic In-Package Optica...

ULTRAVIOLET LIGHT IRRADIATION SYSTEM AND ULTRAVIOLET LIGHT IRRADIAT...

Vertical Integrated Photonics Chiplet for In-Package Optical Interc...

PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM

Optical Coupling

PHOTONIC OPTOELECTRONIC MODULE PACKAGING

MODULAR ASSEMBLY FOR OPTO-ELECTRONIC SYSTEMS