comprising arrays of active devices and fibres

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CPC
G02B6/4249

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4249comprising arrays of active devices and fibres

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic modules and wafer-level methods for manufacturing th...
- Patent number 12,169,315
- Issue date Dec 17, 2024
- ams Sensors Singapore Pte. Ltd.
- Qi Chuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside optical connector
- Patent number 12,164,159
- Issue date Dec 10, 2024
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Methods, systems, and devices for integrating wireless technology i...
- Patent number 12,149,288
- Issue date Nov 19, 2024
- CommScope Technologies LLC
- Trevor D. Smith
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIC die and package with multiple level and multiple depth connecti...
- Patent number 12,130,470
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Yield enhancement techniques for photonic communications platform
- Patent number 12,130,484
- Issue date Oct 29, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Grant
Pluggable optical modules with blind mate optical connectors
- Patent number 12,092,858
- Issue date Sep 17, 2024
- Cisco Technology, Inc.
- Jock T. Bovington
- G02 - OPTICS
Information Patent Grant
Signal transmission device based on MID/LDS technology and assembly...
- Patent number 12,080,977
- Issue date Sep 3, 2024
- HANGZHOU MO-LINK TECHNOLOGY CO. LTD
- Cheng Zhi Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver and methods of making and using the same
- Patent number 12,072,540
- Issue date Aug 27, 2024
- SOURCE PHOTONICS (CHENGDU) COMPANY, LTD.
- Jinglei Mao
- G02 - OPTICS
Information Patent Grant
Fixture and method for attaching fibers to V-grooves of photonic in...
- Patent number 12,061,368
- Issue date Aug 13, 2024
- Google LLC
- Daoyi Wang
- G02 - OPTICS
Information Patent Grant
Aligning optical circuit and aligning method
- Patent number 12,055,773
- Issue date Aug 6, 2024
- Nippon Telegraph and Telephone Corporation
- Toru Miura
- G02 - OPTICS
Information Patent Grant
Electronic devices with optical fiber ribbons
- Patent number 12,013,585
- Issue date Jun 18, 2024
- Apple Inc.
- Prabhakar Gulgunje
- G02 - OPTICS
Information Patent Grant
Light-emitting cable structure
- Patent number 11,994,727
- Issue date May 28, 2024
- Hsu-Shen Chin
- G02 - OPTICS
Information Patent Grant
Ribbon fanout for multicore fiber connectivity
- Patent number 11,988,886
- Issue date May 21, 2024
- Amazon Technologies, Inc.
- Patrick Stephen Van Vickle
- G02 - OPTICS
Information Patent Grant
Optical fiber-to-chip interconnection
- Patent number 11,982,848
- Issue date May 14, 2024
- Nubis Communications, Inc.
- Lukas Elsinger
- G02 - OPTICS
Information Patent Grant
Optical receptacle and optical module
- Patent number 11,921,331
- Issue date Mar 5, 2024
- Enplas Corporation
- Takahiro Izawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote memory architectures enabled by monolithic in-package optica...
- Patent number 11,916,602
- Issue date Feb 27, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Grant
Pluggable optical module and optical communication system
- Patent number 11,906,797
- Issue date Feb 20, 2024
- NEC Corporation
- Yuuji Minota
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vertical integrated photonics chiplet for in-package optical interc...
- Patent number 11,899,251
- Issue date Feb 13, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic ball grid array package with fiber
- Patent number 11,892,690
- Issue date Feb 6, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic optical fiber alignment assembly having integrated optical...
- Patent number 11,892,691
- Issue date Feb 6, 2024
- Senko Advanced Components, Inc.
- Shuhe Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Photonic optoelectronic module packaging
- Patent number 11,886,023
- Issue date Jan 30, 2024
- II-VI DELAWARE, INC.
- Gilles P. Denoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular assembly for opto-electronic systems
- Patent number 11,874,502
- Issue date Jan 16, 2024
- II-VI DELAWARE, INC.
- Po Dong
- G02 - OPTICS
Information Patent Grant
Package structure and optical signal transmitter
- Patent number 11,860,428
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling
- Patent number 11,852,876
- Issue date Dec 26, 2023
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Rack-mountable equipment with a high-heat-dissipation module, and t...
- Patent number 11,828,908
- Issue date Nov 28, 2023
- SAMTEC, INC.
- Eric J. Zbinden
- G02 - OPTICS
Information Patent Grant
Multi-array parallel optical links
- Patent number 11,822,135
- Issue date Nov 21, 2023
- Avicena Tech Corp.
- Robert Kalman
- G02 - OPTICS
Information Patent Grant
Optical bench subassembly having integrated photonic device
- Patent number 11,803,020
- Issue date Oct 31, 2023
- Senko Advanced Components, Inc.
- Robert Ryan Vallance
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Additive manufacture in metals with a fiber array laser source and...
- Patent number 11,780,030
- Issue date Oct 10, 2023
- II-VI DELAWARE, INC.
- Mikhail A. Vorontsov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for scalable optical interconnect for quantum com...
- Patent number 11,768,340
- Issue date Sep 26, 2023
- Lawrence Livermore National Security, LLC
- Susant K. Patra
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20240402421
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
Pattern projector
- Publication number 20240393551
- Publication date Nov 28, 2024
- Apple Inc.
- Refael Della Pergola
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240345337
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Tai-Hsiang LIU
- G02 - OPTICS
Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...
- Publication number 20240272383
- Publication date Aug 15, 2024
- PICadvanced S.A.
- Francisco Manuel RUIVO RODRIGUES
- G02 - OPTICS
Information Patent Application
SILICON PHOTONICS PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SW...
- Publication number 20240264393
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Seok Geun Ahn
- G02 - OPTICS
Information Patent Application
Remote Memory Architectures Enabled by Monolithic In-Package Optica...
- Publication number 20240187110
- Publication date Jun 6, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ULTRAVIOLET LIGHT IRRADIATION SYSTEM AND ULTRAVIOLET LIGHT IRRADIAT...
- Publication number 20240181099
- Publication date Jun 6, 2024
- Nippon Telegraph and Telephone Corporation
- Tomohiro TANIGUCHI
- G02 - OPTICS
Information Patent Application
Vertical Integrated Photonics Chiplet for In-Package Optical Interc...
- Publication number 20240176081
- Publication date May 30, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM
- Publication number 20240142729
- Publication date May 2, 2024
- NEC Corporation
- Yuuji MINOTA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical Coupling
- Publication number 20240118505
- Publication date Apr 11, 2024
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
PHOTONIC OPTOELECTRONIC MODULE PACKAGING
- Publication number 20240118506
- Publication date Apr 11, 2024
- II-VI Delaware, Inc.
- Gilles P. Denoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR ASSEMBLY FOR OPTO-ELECTRONIC SYSTEMS
- Publication number 20240103225
- Publication date Mar 28, 2024
- II-VI Delaware, Inc.
- Po DONG
- G02 - OPTICS
Information Patent Application
LIGHT-EMITTING CABLE STRUCTURE
- Publication number 20240077689
- Publication date Mar 7, 2024
- ENERGY FULL ELECTRONICS CO.,LTD.
- Hsu-Shen CHIN
- G02 - OPTICS
Information Patent Application
MULTI-ARRAY PARALLEL OPTICAL LINKS
- Publication number 20240045155
- Publication date Feb 8, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING
- Publication number 20240027706
- Publication date Jan 25, 2024
- Intel Corporation
- Pooya Tadayon
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240006396
- Publication date Jan 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER
- Publication number 20230400649
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Implementing Low Latency Optical Channels
- Publication number 20230393354
- Publication date Dec 7, 2023
- Panduit Corp.
- Richard J. Pimpinella
- G02 - OPTICS
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES
- Publication number 20230375793
- Publication date Nov 23, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURE
- Publication number 20230375792
- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Tsutaru KUMAGAI
- G02 - OPTICS
Information Patent Application
Pooled Memory System Enabled by Monolithic In-Package Optical I/O
- Publication number 20230370170
- Publication date Nov 16, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND METHOD FOR MODELLING OF PASSIVE CONNECTORS AND A ONE-...
- Publication number 20230358970
- Publication date Nov 9, 2023
- Infinera Corp.
- Thirumala Raju Mone
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RAPID FIBER OPTIC ALIGNMENT TECHNIQUES FOR OPTICAL SWITCHING
- Publication number 20230350141
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Adam Joseph Fruehling
- G02 - OPTICS
Information Patent Application
PHOTONIC COMMUNICATION PLATFORM AND RELATED ARCHITECTURES, SYSTEMS...
- Publication number 20230314742
- Publication date Oct 5, 2023
- Lightmattter, Inc.
- Carlos Dorta-Quinones
- G02 - OPTICS
Information Patent Application
Fixture And Method For Attaching Fibers To V-Grooves Of Photonic In...
- Publication number 20230305243
- Publication date Sep 28, 2023
- Google LLC
- Daoyi Wang
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230266528
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 8WDM Optical Transceiver at 10nm Wavelength Grid
- Publication number 20230261752
- Publication date Aug 17, 2023
- Google LLC
- Liming Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

comprising arrays of active devices and fibres

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optoelectronic modules and wafer-level methods for manufacturing th...

Backside optical connector

Methods, systems, and devices for integrating wireless technology i...

Transceiver and interface for IC package

PIC die and package with multiple level and multiple depth connecti...

Yield enhancement techniques for photonic communications platform

Pluggable optical modules with blind mate optical connectors

Signal transmission device based on MID/LDS technology and assembly...

Optical transceiver and methods of making and using the same

Fixture and method for attaching fibers to V-grooves of photonic in...

Aligning optical circuit and aligning method

Electronic devices with optical fiber ribbons

Light-emitting cable structure

Ribbon fanout for multicore fiber connectivity

Optical fiber-to-chip interconnection

Optical receptacle and optical module

Remote memory architectures enabled by monolithic in-package optica...

Pluggable optical module and optical communication system

Vertical integrated photonics chiplet for in-package optical interc...

Optoelectronic ball grid array package with fiber

Hermetic optical fiber alignment assembly having integrated optical...

Photonic optoelectronic module packaging

Modular assembly for opto-electronic systems

Package structure and optical signal transmitter

Optical coupling

Rack-mountable equipment with a high-heat-dissipation module, and t...

Multi-array parallel optical links

Optical bench subassembly having integrated photonic device

Additive manufacture in metals with a fiber array laser source and...

System and method for scalable optical interconnect for quantum com...

Patents Applicationslast 30 patents

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

Pattern projector

PACKAGE AND METHOD OF FORMING SAME

OPTICAL DEVICE

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...

SILICON PHOTONICS PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SW...

Remote Memory Architectures Enabled by Monolithic In-Package Optica...

ULTRAVIOLET LIGHT IRRADIATION SYSTEM AND ULTRAVIOLET LIGHT IRRADIAT...

Vertical Integrated Photonics Chiplet for In-Package Optical Interc...

PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM

Optical Coupling

PHOTONIC OPTOELECTRONIC MODULE PACKAGING

MODULAR ASSEMBLY FOR OPTO-ELECTRONIC SYSTEMS

LIGHT-EMITTING CABLE STRUCTURE

MULTI-ARRAY PARALLEL OPTICAL LINKS

PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING

OPTICAL DEVICE

PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER

Apparatus and Method for Implementing Low Latency Optical Channels

COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES

OPTICAL CONNECTION STRUCTURE

Pooled Memory System Enabled by Monolithic In-Package Optical I/O

APPARATUS AND METHOD FOR MODELLING OF PASSIVE CONNECTORS AND A ONE-...

RAPID FIBER OPTIC ALIGNMENT TECHNIQUES FOR OPTICAL SWITCHING

PHOTONIC COMMUNICATION PLATFORM AND RELATED ARCHITECTURES, SYSTEMS...

Fixture And Method For Attaching Fibers To V-Grooves Of Photonic In...

PACKAGE AND METHOD OF FORMING SAME

Novel 8WDM Optical Transceiver at 10nm Wavelength Grid