comprising at least one polishing chamber

Industry

CPC
H01L21/67219

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67219comprising at least one polishing chamber

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cleaning apparatus and polishing apparatus
- Patent number 11,948,811
- Issue date Apr 2, 2024
- Ebara Corporation
- Mitsuru Miyazaki
- B08 - CLEANING
Information Patent Grant
Substrate processing system, substrate processing method and comput...
- Patent number 11,929,268
- Issue date Mar 12, 2024
- Tokyo Electron Limited
- Munehisa Kodama
- B24 - GRINDING POLISHING
Information Patent Grant
Monolithic platen
- Patent number 11,919,126
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,869,815
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Vertical polishing system with multiple degrees of freedom
- Patent number 11,756,814
- Issue date Sep 12, 2023
- Meta Platforms, Inc.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, and st...
- Patent number 11,731,229
- Issue date Aug 22, 2023
- Tokyo Electron Limited
- Osamu Miyahara
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for wafer cleaning
- Patent number 11,705,324
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate handling systems
- Patent number 11,705,354
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Gee Sun Hoey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for chemical mechanical polishing process
- Patent number 11,682,552
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-I Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, substrate...
- Patent number 11,676,827
- Issue date Jun 13, 2023
- Ebara Corporation
- Tomoatsu Ishibashi
- B08 - CLEANING
Information Patent Grant
Cleaning device, polishing device, and device and method for calcul...
- Patent number 11,664,252
- Issue date May 30, 2023
- Ebara Corporation
- Michiaki Matsuda
- B08 - CLEANING
Information Patent Grant
Cover for swing member of substrate processing apparatus, swing mem...
- Patent number 11,626,299
- Issue date Apr 11, 2023
- Ebara Corporation
- Yoshitaka Kitagawa
- B08 - CLEANING
Information Patent Grant
Wafer edge polishing apparatus and method
- Patent number 11,559,869
- Issue date Jan 24, 2023
- Sumco Corporation
- Makoto Ando
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate cleaning apparatus, substrate processing apparatus, and m...
- Patent number 11,532,491
- Issue date Dec 20, 2022
- Ebara Corporation
- Hisajiro Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, and co...
- Patent number 11,524,383
- Issue date Dec 13, 2022
- Tokyo Electron Limited
- Minoru Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Method of cleaning a substrate
- Patent number 11,495,475
- Issue date Nov 8, 2022
- Ebara Corporation
- Koji Maeda
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 11,426,834
- Issue date Aug 30, 2022
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Cleaning device, substrate processing apparatus, maintenance method...
- Patent number 11,380,561
- Issue date Jul 5, 2022
- Ebara Corporation
- Hidetatsu Isokawa
- B08 - CLEANING
Information Patent Grant
Cleaning apparatus of cleaning tool, substrate processing apparatus...
- Patent number 11,367,629
- Issue date Jun 21, 2022
- Ebara Corporation
- Hideaki Tanaka
- B08 - CLEANING
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,282,755
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Eric Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High throughput polishing system for workpieces
- Patent number 11,267,095
- Issue date Mar 8, 2022
- UTICA LEASECO, LLC
- Stephen M. Fisher
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and method of detecting indentation...
- Patent number 11,221,239
- Issue date Jan 11, 2022
- Ebara Corporation
- Zhongxin Wen
- B08 - CLEANING
Information Patent Grant
Substrate processing apparatus, method of detaching substrate from...
- Patent number 11,195,736
- Issue date Dec 7, 2021
- Ebara Corporation
- Naoki Toyomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,173,523
- Issue date Nov 16, 2021
- Ebara Corporation
- Hidetatsu Isokawa
- B08 - CLEANING
Information Patent Grant
Substrate cleaning device and substrate cleaning method
- Patent number 11,164,757
- Issue date Nov 2, 2021
- Ebara Corporation
- Haiyang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buff processing device and substrate processing device
- Patent number 11,103,972
- Issue date Aug 31, 2021
- Ebara Corporation
- Hideo Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer grinding apparatus and wafer grinding method
- Patent number 11,101,150
- Issue date Aug 24, 2021
- Mitsubishi Electric Corporation
- Naoyuki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning device and method for driving cleaning device
- Patent number 11,087,972
- Issue date Aug 10, 2021
- Samsung Electronics Co., Ltd.
- Hyun Joon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus and substrate processing apparatus
- Patent number 11,056,359
- Issue date Jul 6, 2021
- Ebara Corporation
- Teruaki Hombo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particle reduction in semiconductor fabrication
- Patent number 11,043,405
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD
- Publication number 20240087919
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Jumpei FUJIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING POLISHING COMPOS...
- Publication number 20240030041
- Publication date Jan 25, 2024
- SK enpulse Co., Ltd.
- Han Teo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD FOR HOLDING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240006204
- Publication date Jan 4, 2024
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20230352326
- Publication date Nov 2, 2023
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
- Publication number 20230326770
- Publication date Oct 12, 2023
- EBARA CORPORATION
- Haiyang Xu
- B08 - CLEANING
Information Patent Application
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
- Publication number 20230307259
- Publication date Sep 28, 2023
- EBARA CORPORATION
- Haiyang Xu
- B08 - CLEANING
Information Patent Application
METHOD AND SYSTEM FOR CHEMICAL MECHANICAL POLISHING PROCESS
- Publication number 20230274929
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-I PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USI...
- Publication number 20230197482
- Publication date Jun 22, 2023
- SKC solmics Co., Ltd.
- Chang Gyu IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230038445
- Publication date Feb 9, 2023
- EBARA CORPORATION
- Itsuki KOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230005773
- Publication date Jan 5, 2023
- EBARA CORPORATION
- HAO YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CLEANING DEVICE, POLISHING DEVICE, AND DEVICE AND METHOD FOR CALCUL...
- Publication number 20220406633
- Publication date Dec 22, 2022
- EBARA CORPORATION
- Michiaki MATSUDA
- B08 - CLEANING
Information Patent Application
FILM-THICKNESS MEASURING METHOD, METHOD OF DETECTING NOTCH PORTION,...
- Publication number 20220344221
- Publication date Oct 27, 2022
- EBARA CORPORATION
- Osamu NABEYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING SYSTEM
- Publication number 20220277963
- Publication date Sep 1, 2022
- KCTECH CO., LTD.
- Hee Sung Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetry Correction Via Oriented Wafer Loading
- Publication number 20220208621
- Publication date Jun 30, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
METHOD, DEVICE, AND NON-TRANSITORY COMPUTER READABLE MEDIUM FOR DET...
- Publication number 20220139741
- Publication date May 5, 2022
- EBARA CORPORATION
- HIDETATSU ISOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS, CHEMICAL MECHANICAL POLISH...
- Publication number 20220118582
- Publication date Apr 21, 2022
- Samsung Electronics Co., Ltd.
- Myung-Ki HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING
- Publication number 20220028718
- Publication date Jan 27, 2022
- GLOBALWAFERS CO., LTD.
- ShinBae Park
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
- Publication number 20220020610
- Publication date Jan 20, 2022
- EBARA CORPORATION
- Haiyang Xu
- B08 - CLEANING
Information Patent Application
SUBSTRATE HANDLING SYSTEMS
- Publication number 20220013394
- Publication date Jan 13, 2022
- Applied Materials, Inc.
- Gee Sun HOEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI-ENVIRONMENTS
- Publication number 20210375650
- Publication date Dec 2, 2021
- Applied Materials, Inc.
- Nitin Bharadwaj SATYAVOLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HELICAL CHAMFER MACHINING SILICON WAFER
- Publication number 20210327718
- Publication date Oct 21, 2021
- SUMCO CORPORATION
- Kentarou ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS
- Publication number 20210323118
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Jagan RANGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS
- Publication number 20210323117
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Jagan RANGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS
- Publication number 20210323119
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Jagan RANGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC PLATEN
- Publication number 20210268624
- Publication date Sep 2, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Lung Lia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER CLEANING
- Publication number 20210257211
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Hsien LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20210217647
- Publication date Jul 15, 2021
- EBARA CORPORATION
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING APPARATUS AND POLISHING APPARATUS
- Publication number 20210202273
- Publication date Jul 1, 2021
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...
- Publication number 20210187685
- Publication date Jun 24, 2021
- EBARA CORPORATION
- Atsuo Katagiri
- B24 - GRINDING POLISHING

comprising at least one polishing chamber

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cleaning apparatus and polishing apparatus

Substrate processing system, substrate processing method and comput...

Monolithic platen

Asymmetry correction via oriented wafer loading

Vertical polishing system with multiple degrees of freedom

Substrate processing apparatus, substrate processing method, and st...

Apparatus and method for wafer cleaning

Substrate handling systems

Apparatus for chemical mechanical polishing process

Substrate cleaning apparatus, substrate cleaning method, substrate...

Cleaning device, polishing device, and device and method for calcul...

Cover for swing member of substrate processing apparatus, swing mem...

Wafer edge polishing apparatus and method

Substrate cleaning apparatus, substrate processing apparatus, and m...

Substrate processing apparatus, substrate processing method, and co...

Method of cleaning a substrate

Substrate processing apparatus, substrate processing method, substr...

Cleaning device, substrate processing apparatus, maintenance method...

Cleaning apparatus of cleaning tool, substrate processing apparatus...

Asymmetry correction via oriented wafer loading

High throughput polishing system for workpieces

Substrate processing apparatus and method of detecting indentation...

Substrate processing apparatus, method of detaching substrate from...

Substrate processing apparatus

Substrate cleaning device and substrate cleaning method

Buff processing device and substrate processing device

Wafer grinding apparatus and wafer grinding method

Cleaning device and method for driving cleaning device

Cleaning apparatus and substrate processing apparatus

Particle reduction in semiconductor fabrication

Patents Applicationslast 30 patents

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING POLISHING COMPOS...

HEAD FOR HOLDING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD

SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD

SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD

METHOD AND SYSTEM FOR CHEMICAL MECHANICAL POLISHING PROCESS

POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USI...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

TRANSPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS

CLEANING DEVICE, POLISHING DEVICE, AND DEVICE AND METHOD FOR CALCUL...

FILM-THICKNESS MEASURING METHOD, METHOD OF DETECTING NOTCH PORTION,...

SUBSTRATE POLISHING SYSTEM

Asymmetry Correction Via Oriented Wafer Loading

METHOD, DEVICE, AND NON-TRANSITORY COMPUTER READABLE MEDIUM FOR DET...

CHEMICAL MECHANICAL POLISHING APPARATUS, CHEMICAL MECHANICAL POLISH...

AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING

SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD

SUBSTRATE HANDLING SYSTEMS

HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI-ENVIRONMENTS

METHOD OF HELICAL CHAMFER MACHINING SILICON WAFER

HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS

HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS

HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS

MONOLITHIC PLATEN

APPARATUS AND METHOD FOR WAFER CLEANING

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

CLEANING APPARATUS AND POLISHING APPARATUS

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...